Application Notes

S10 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
NON-ISOLATED DC-DC Converter
S10 SERIES
3.0-5.5Vin, 1-3.3Vout, 10A
APPLICATION NOTES
Ver 1.0
S10-5SX.XT (Through-Hole) Series
S10-5SX.X SMT Series
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 1
S10 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
1. INTRODUCTION
3
2. MODELS
3
3. 10A SIP/SMT CONVERTER FEATURES
3
4. GENERAL DESCRIPTION
3
4.1 Electrical Description
3
4.2 Thermal Packaging and Physical Design.
4
5. MAIN FEATURES AND FUNCTIONS
4
5.1 Operating Temperature Range
4
5.2 Over-Temperature Protection (OTP)
4
5.3 Output Voltage Adjustment
4
5.4 Safe Operating Area (SOA)
4
5.5 Over Current Protection
4
5.6 Remote ON/OFF
4
5.7 UVLO (Under-Voltage Lockout)
5
6. SAFETY
5
6.1 Input Fusing and Safety Considerations.
5
7. APPLICATIONS
5
7.1 Layout Design Challenges.
5
7.2 Convection Requirements for Cooling
6
7.3 Thermal Considerations
6
7.4 Power De-Rating Curves
7
7.5 Input Capacitance at the Power Module
7
7.6 Test Set-Up
8
7.7 Remote Sense Compensation
8
7.8 S10-5SX.X Series Output Voltage Adustment.
8
7.9 Output Ripple and Noise Measurement
10
7.10 Output Capacitance
10
7.11 SMT Reflow Profile
10
8. MECHANICAL OUTLINE DIAGRAMS
10
8.1 SIP/SMT S10 Mechanical Outline Diagrams
10
8.2 SMT Tape and Reel Dimensions
11
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 2
S10 SERIES SIP or SMT
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
Version Application Notes
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
1. Introduction
3. 10A SIP/SMT Converter Features
This application note describes the features and functions of
•
High efficiency topology, typically 95% at 3.3Vdc
Intronics’ S10 SMT series of Non Isolated DC-DC Converters.
•
Industry standard footprint
These are highly efficient, reliable and compact, high power
•
Wide ambient temperature range, -40C to +85C
density, single output DC/DC converters. These “Point of
•
Cost efficient open frame design
Load” modules serve the needs specifically of the fixed and mobile
•
±10% output voltage trimmable.
telecommunications and computing market, employing economical
•
No minimum load requirement (Stable at all loads)
distributed Power Architectures.
•
Remote ON/OFF
The S10 SMT series provide precisely regulated output voltage range
•
Remote sense compensation
from 1.0V to 3.3Vdc over a wide range of input voltage (Vi=3.0 –
•
Fixed switching frequency
5.5Vdc) and can operate over an ambient temperature range of –40C
•
Continuous short-circuit protection and over current protection
to +85C. Ultra-high efficiency operation is achieved through the use
•
Over-temperature protection (OTP)
of synchronous rectification and drive control techniques. The modules
•
Monotonic Startup with pre-bias at the output.
are fully protected against short circuit and over-temperature
•
UL/IEC/EN60950 Certified.
conditions.
Intronics’ world class automated manufacturing methods, together with
4. General Description
an extensive testing and qualification program, ensure that all S10-
4.1 Electrical Description
5SX.X series converters are extremely reliable.
A block diagram of the S10-5SX.X Series converter is shown in Figure
1. Extremely high efficiency power conversion is achieved through the
2. Models
use of synchronous rectification and drive techniques.
The adjustable S10 series currently comprises of 7 models.
Essentially, the powerful S10-5SX.X series topology is based on a
non-isolated synchronous buck converter. The control loop is
Model
S10-5S1.0T
S10-5S1.2T
S10-5S1.5T
S10-5S1.8T
S10-5S2.5T
S10-5S3.3T
S10-5S5.0T
Input
Voltage
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
4.5 – 5.5VDC
Output
Voltage
1.0V
1.2V
1.5V
1.8V
2.0V
2.5V
3.3V
Output
Current
10A
10A
10A
10A
10A
10A
10A
Table 1A – S10-5SX.XT Through-Hole Series Models
optimized for unconditional stability, fast transient response and a very
tight line and load regulation. In a typical pre-bias application the S105SX.X series converters do not draw any reverse current at start-up.
The output is adjustable over a range of -10% to +10% of the nominal
output voltage, using the TRIM pin.
The converter can be shut down via a remote ON/OFF input that is
referenced to ground. This input is compatible with popular logic
devices; a 'negative' logic input is supplied as standard. Negative logic
implies that the converter is enabled if the remote ON/OFF input is low
(or floating), and disabled if it is high.
The converter is also protected against over-temperature conditions. If
the converter is overloaded or the ambient temperature gets too high,
the converter will shut down to protect the unit.
The adjustable SMT10-05 series comprises of 7 models.
Model
S10-5S1.0
S10-5S1.2
S10-5S1.5
S10-5S1.8
S10-5S2.5
S10-5S3.3
S10-5S5.0
Input
Voltage
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
3.0 – 5.5VDC
4.5 – 5.5VDC
Output
Voltage
1.0V
1.2V
1.5V
1.8V
2.0V
2.5V
3.3V
L1
Q1
Output
Current
10A
10A
10A
10A
10A
10A
10A
+VIN
+VO
Q2
C1
D1
C2
R sense
+SENSE
COM
COM
R1
PWM IC
ON/OFF
R trim
ERR AMP
TRIM
R2
Table 1B – S10-5SX.X SMT Series Models
Figure 1. Electrical Block Diagram
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 3
S10 SERIES SIP or SMT
Version Application Notes
4.2 Thermal Packaging and Physical Design.
The S10-5SX.X series uses a multi-layer FR4 PCB construction. All
surface mount power components are placed on one side of the PCB,
and all low-power control components are placed on the other side.
Thus, the Heat dissipation of the power components is optimized,
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
5.4 Safe Operating Area (SOA)
Figure 2 provides a graphical representation of the Safe Operating
Area (SOA) of the converter. This representation assumes ambient
operating conditions such as airflow are met as per thermal guidelines
provided in Sections 7.2 and 7.3.
ensuring that control components are not thermally stressed.
Vo
The converter is an open-frame product and has no case or case pin.
The open-frame design has several advantages over
encapsulated closed devices. Among these advantages are:
Efficient Thermal Management: the heat is removed from the
heat generating components without heating more sensitive, small
signal control components.
•
Environmental: Lead free open-frame converters are more easily
re-cycled.
•
Cost Efficient: No encapsulation. Cost efficient open-frame
Vo,nom
VOLTAGE (V)
•
Safe Operating Area
construction.
•
Reliable: Efficient cooling provided by open frame construction
Io,max Io,CL Io
offers high reliability and easy diagnostics.
CURRENT (A)
5. Main Features and Functions
5.1 Operating Temperature Range
Figure 2. Maximum Output Current Safe Operating Area
Intronics’ S10-5SX.X series converters highly efficient converter design
has resulted in its ability to operate over a wide ambient temperature
environment ( -40C to 85C). Due consideration must be given to the
de-rating curves when ascertaining maximum power that can be drawn
from the converter. The maximum power drawn is influenced by a
number of factors, such as:
5.5 Over Current Protection
All different voltage models have a full continuous short-circuit
protection. The unit will auto recover once the short circuit is removed.
To provide protection in a fault condition, the unit is equipped with
internal over-current protection. The unit operates normally once the
•
Input voltage range.
fault condition is removed. The power module will supply up to 170% of
•
Output load current.
rated current. In the event of an over current converter will go into a
•
Air velocity (forced or natural convection).
hiccup mode protection.
•
Mounting orientation of converter PCB with respect to the Airflow.
•
Motherboard PCB design, especially ground and power planes.
These can be effective heatsinks for the converter.
5.2 Over-Temperature Protection (OTP)
5.6 Remote ON/OFF
The remote ON/OFF input feature of the converter allows external
circuitry to turn the converter ON or OFF. Active-low remote
The S10-5SX.X Series converters are equipped with non-latching over-
ON/OFF is available as standard.
temperature protection. A temperature sensor monitors the
The S10-5SX.X series converters are turned on if the remote
temperature of the hot spot (typically, top switch). If the temperature
ON/OFF pin is low, or left open or floating. Pulling the pin high will turn
exceeds a threshold of 120°C (typical) the converter will shut down,
the converter ‘Off’. The signal level of the remote on/off input is defined
disabling the output. When the temperature has decreased the
with respect to ground. The unit is guaranteed OFF over the full
converter will automatically restart.
temperature range if this voltage level exceeds 2.8Vdc.
The over-temperature condition can be induced by a variety of reasons
such as external overload condition or a system fan failure.
The remote ON/OFF input can be driven as described in Figure 3.
5.3 Output Voltage Adjustment
Section 7.8 describes in detail as to how to trim the output voltage with
respect to its set point. The output voltage on all models is trimmable
in the range -10% to +10%.
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 4
S10 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
given to proper low impedance tracks between power module, input
+Vin
+Vo
and output grounds.
Q1
SIP10 Series
ON/OFF
Control
Remote ON/OFF
Common
Common
Figure 3 . Remote ON/OFF Input Drive Circuit
LAYOUT PATTERN
TOP VIEW
0.29(7.4)
All Dimmension In Inches(mm)
Tolerance :
.XX=¡ Ó0.04
.XXX=¡ Ó0.010
5.7 UVLO (Under-Voltage Lockout)
converter initiates a soft start. The UVLO function in the converter has
a Hysterisis (about 100mV) built in to provide noise immunity at start-
1.1mm PLATED THROUGH HOLE
1.6mm PAD SIZE
VIEW IS FROM TOP SIDE
Figure 4A. Recommended SIP Footprint
The voltage on the Vcc pin determines the start of the operation of the
Converter. When the input Vcc rises and exceeds about 2.8V the
Recommended Pad Layout
Dimensions are in millimetes and(inches)
up.
7.54
(0.297)
4.83
4.83
4.83
(0.190) (0.190) (0.190)
+SENSE TRIM
10.29
(0.405)
6. Safety
0.33(8.4)
+VO
Agency Approvals: The power Supply shall be submitted to and
rd
10.92
(0.430)
29.90
(1.177)
PAD SIZE
MIN:3.556x2.413(0.140x0.095)
MAX:4.19x2.79(0.165x0.110)
1.The power supply shall be approved by a nationally recognized
testing laboratory to UL/CSA 60950 3 Edition (North America) and
COM
+VIN
0.64
(0.025)
receive formal approval from the following test agencies.
(0.310)
Top View of Board
ON/OFF
6.1 Input Fusing and Safety Considerations.
7.87
Figure 4B. Recommended SMT Footprint
EN60950 (International)
2. CB Certificate from an internationally recognized test house in
accordance with EN 60950.
The S10-5SX.X series converters do not have an internal fuse.
However, to achieve maximum safety and system protection, always
use an input line fuse. The safety agencies require a time-delay fuse
with a maximum rating of 20A.
7. Applications
7.1 Layout Design Challenges.
In optimizing thermal design the PCB is utilized as a heatsink. Also
some heat is transferred from the SIP module to the main board
through connecting pins. The system designer or the end user
must ensure that other components and metal in the vicinity of the
S10-5SX.X series SIP’s meet the spacing requirements to which the
system is approved.
Low resistance and low inductance PCB layout traces are the norm
and should be used where possible. Due consideration must also be
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 5
S10 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7.2 Convection Requirements for Cooling
To predict the approximate cooling needed for the module, refer to the
Power De-rating curves in Figures 9 and 10. These de-rating curves
are approximations of the ambient temperatures and airflows required
to keep the power module temperature below its maximum rating.
Once the module is assembled in the actual system, the module’s
temperature should be checked as shown in Figure 5 to ensure it does
not exceed 110°C.
Proper cooling can be verified by measuring the power module’s
temperature at Q1-pin 6 and Q2-pin 6 as shown in Figure 6A,6B.
W ind
Tunnel
25.4(1.0)
Figure 6B. Temperature Measurement Location for SMT
7.3 Thermal Considerations
Bakelite
The power module operates in a variety of thermal environments;
however, sufficient cooling should be provided to help ensure reliable
operation of the unit. Heat is removed by conduction, convection, and
radiation to the surrounding environment. The thermal data presented
is based on measurements taken in a set-up as shown in Figure 5.
Power Module
Figures 7A,7B and 8A,8B represent the test data.
Note that the airflow is parallel to the long axis of the module as shown
in Figure 6A for the SIP.
The temperature at either location should not exceed 110 °C. The
output power of the module should not exceed the rated power for the
module (VO, set x IO, max).
76.2(3.0)
The SMT10 thermal data presented is based on measurements taken
Thermocuple Location
for measuring
ambient temperature
and airflow
in a wind tunnel. The test setup shown in Figure 5 and EUT need to
solder on 33mm x 40.38mm(1.300'' x 1.59'') test pcb. Note that airflow
is parallel to the long axis of the module as shown in Fig 6B
12.7(0.5)
Air
flow
Note : Dimensions are in millimeters and (inches)
Figure 5. Thermal Test Setup
Pin6
Inductor Pin
Airflow
Figure 6A. Temperature Measurement Location for SIP
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 6
S10 SERIES SIP or SMT
Version Application Notes
7.4 Power De-Rating Curves
Output Current(A)
Output Current(A)
Vin=3.3Vdc Derating Curve
10
8
6
0LFM
4
100LFM
2
200LFM
10
8
0LFM
100LFM
200LFM
6
4
2
0
0
0
10
20
30
40
50
60
70
80
90 100
o
Ambient Temperature( C)
10
20
30 40 50 60 70 80
o
Ambient Temperature( C)
90 100
7.5 Input Capacitance at the Power Module
The SIP/SMT converters must be connected to a low AC source
Vin=5Vdc Derating Curve
12
0
Figure8B.Typical Power De-rating for 5.0V IN(SMT10)
Figure7A Typical Power De-rating for 3.3V IN(SIP10)
Output Current(A)
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
Vin=5Vdc Derating Curve
12
12
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
impedance. To avoid problems with loop stability source inductance
should be low. Also, the input capacitors should be placed close to the
10
converter input pins to de-couple distribution inductance. However, the
8
external input capacitors are chosen for suitable ripple handling
6
4
0LFM
capability. Low ESR polymers are a good choice. They have high
100LFM
capacitance, high ripple rating and low ESR (typical <20mΩ).
Electrolytic capacitors should be avoided. Circuit as shown in Figure 9
200LFM
2
represents typical measurement methods for ripple current. Input
reflected-ripple current is measured with a simulated source
0
0
10
20
30
40
50
60
70
80
90 100
Inductance of 1uH. Current is measured at the input of the module.
o
Ambient Temperature( C)
Figure7B.Typical Power De-rating for 5.0V IN(SIP10)
L1
Vin=3.3Vdc Derating Curve
12
Output Current(A)
To Oscilloscope
10
Power
8
Supply
0LFM
100LFM
200LFM
6
4
+Vin
1uH
+
2*100uF
Tantalum
SIP10 Series
220uF
ESR<0.1ohm
Common
2
Figure 9. Input Reflected-Ripple Test Setup
0
0
10
20
30 40 50 60 70 80
o
Ambient Temperature( C)
90 100
Figure8A.Typical Power De-rating for 3.3V IN (SMT10)
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 7
S10 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7.6 Test Set-Up
The basic test set-up to measure parameters such as efficiency and
7.7 Remote Sense Compensation
load regulation is shown in Figure 10. Things to note are that this
Remote Sense regulates the output voltage at the point of load. It
converter is non-isolated, as such the input and output share a
minimizes the effects of distribution losses such as drops across the
common ground. These grounds should be connected together via low
connecting pin and PCB tracks (see Figure 11). Please note however,
impedance ground plane in the application circuit. When testing a
the maximum drop from the output pin to the point of load should not
converter on a bench set-up, ensure that -Vin and -Vo are connected
exceed 500mV for remote compensation to work.
together via a low impedance short to ensure proper efficiency and
The amount of power delivered by the module is defined as the output
load regulation measurements are being made. When testing the
voltage multiplied by the output current (VO x IO).
Intronics’ S10-5SX.X series under any transient conditions please
When using TRIM UP, the output voltage of the module will increase
ensure that the transient response of the source is sufficient to power
which, if the same output current is maintained, increases the power
the equipment under test. We can calculate the
output by the module. Make sure that the maximum output power of
•
Efficiency
the module remains at or below the maximum rated power.
•
Load regulation and line regulation.
When the Remote Sense feature is not being used, leave sense pin
disconnected.
The value of efficiency is defined as :
Distribution Losses
Vo × Io
η =
× 100%
Vin × Iin
Where:
+Vin
+Vo
+Sense
Vo is output voltage ,
SIP10 Series
Io is output current,
R-Load
Vin is input voltage,
Iin is input current.
Common
The value of load regulation is defined as :
Load .reg =
Distribution Losses
VFL − VNL
×100%
VNL
Figure 11. Circuit Configuration for Remote Sense
Operation
VFL is the output voltage at full load
VNL is the output voltage at no load
Where:
The value of line regulation is defined as:
Line.reg =
Common
7.8 S10-5SX.X Series Output Voltage Adustment.
VHL − VLL
×100%
VLL
In order to trim the voltage up or down one needs to connect the trim
resistor either between the trim pin and ground for trim-up and
between trim pin and Vsense+ for trim-down. The output voltage trim
Where: VHL is the output voltage of maximum input voltage at full load.
VLL is the output voltage of minimum input voltage at full load.
range is ±10%. This is shown in Figures 12 and 13:
+Vin
Current Meter
Current Meter
A
+Vin
Supply
+
Voltage
V 100uF
Meter
Tant.
SIP10 Series
Common
Trim
A
+Vo
+Sense
Power +
+Vo
R-Load
SIP10 Series
Voltage Meter
V
R-Load
Common
Common
Figure 10. SIP10 Series Test Setup
R trim-up
Common
Figure 12. Trim-up Voltage Setup
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 8
S10 SERIES SIP or SMT
Version Application Notes
Vo,nom is the nominal output voltage.
+Vo
Vo is the desired output voltage.
R trim-down
SIP10 Series
R-Load
R1 and Rt are internal to the unit and are defined in Table 2.
For example,to trim-down the output voltage of 2.5V module
(SIP10-05S25E) by 8% to 2.3V , Rtrim-down is calculated as follows :
Trim
Common
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
Rtrim-down is the external resistor in KΩ.
Where:
+Vin
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
Vo,nom – Vo = 2.5 – 2.3 = 0.2 V
Common
R1 = 30.1 KΩ
Rt = 78.7 KΩ
Figure 13. Trim-down Voltage Setup
The value of Rtrim-up defined as:
Rtrim − up = (
Where:
Rtrim − down =
R1 × 0.8
) − Rt (KΩ )
Vo − Vo , nom
Rtrim-up is the external resistor in KΩ.
30 .1× ( 2.3 − 0.8)
− 78 .7 = 147 .05 (KΩ )
0 .2
For Trim-up using an external voltage source, apply a voltage from
TRIM pin to ground using the following equation:
Vo,nom is the nominal output voltage.
Vo is the desired output voltage.
R1 and Rt are internal to the unit and are defined in Table 2.
Output Voltage(V)
R1 (KΩ)
Rt (KΩ)
1.0
30.1
30.1
1.2
30.1
59
1.5
30.1
100
1.8
30.1
100
2.0
30.1
100
2.5
30.1
78.7
3.3
30.1
59
Table 2 – Trim Resistor Values
Vtrim − up = 0.8 − (
(Vo − Vo , nom ) × Rt
)
R1
For Trim-down using an external voltage source,apply a voltage
from TRIM pin to ground using the following equation :
Vtrim − down = 0.8 +
Where:
(Vo , nom − Vo) × Rt
R1
Vtrim-up is the external source voltage for trim-up.
Vtrim-down is the external source voltage for trim-down.
Vo is the desired output voltage.
For example, to trim-up the output voltage of 1.5V module
Vo,nom is the nominal output voltage.
(SIP10-05S15E) by 8% to 1.62V , Rtrim-up is calculated as follows :
Rt (internal to the module) is defined in Table 2.
Vo – Vo,nom = 1.62 – 1.5 = 0.12V
If the TRIM feature is not being used, leave the TRIM pin
Rt = 100 KΩ
disconnected.
R1= 30.1 KΩ
Rtrim − up =
30.1× 0.8
− 100 = 100.66 (KΩ)
0.12
The value of Rtrim-down defined as:
Rtrim − down =
R1× (Vo − 0.8)
− Rt (KΩ)
Vo , nom − Vo
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 9
S10 SERIES SIP or SMT
Version Application Notes
7.9 Output Ripple and Noise Measurement
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
REFLOW PROFILE
240
The test set-up for noise and ripple measurements is shown in Figure
200
higher frequencies.
+Vin
+Vo
SIP10 Series
10uF
Tant.
1uF
Ceramic
R-Load
Test Jack
Common
TEMPERATURE (C)
14. a 50Ω. coaxial cable with a 50Ω termination was used to prevent
impedance mismatch reflections disturbing the noise readings at
160
120
80
40
0
0
Common
30
60
90
120 150 180 210 240
TIME (SECONDS)
Figure 15 – SMT Reflow Profile
Figure 14. Output Voltage Ripple and Noise
Measurement Set-Up
8. Mechanical Outline Diagrams
7.10 Output Capacitance
8.1 SIP/SMT10 Mechanical Outline Diagrams
Intronics’ S10-5SX.X series converters provide unconditional stability
Dimensions are in millimeters and (inches)
with or without external capacitors. For good transient response low
ESR output capacitors should be located close to the point of load.
For high current applications point has already been made in layout
Tolerance : x.xx ±0.02 in.(0.5mm) , x.xxx ±0.010 in. (0.25 mm) unless
otherwise noted
0.327(8.30)
considerations for low resistance and low inductance tracks.
2.000(50.80)
0.23(5.8)
Output capacitors with its associated ESR values have an impact on
loop stability and bandwidth.Intronics’ converters are designed to work
additional capacitance, typically 1,000uF and low ESR (<20mΩ), be
0.139(3.53)
0.500(12.70)
connected close to the point of load and outside the remote
compensation point.
7.11 SMT Reflow Profile
6 7 8 9 10 11
1 2 3 4 5
with load capacitance up-to 10,000uF. It is recommended that any
0.100(2.54)
0.025(0.64)
1.000(25.40)
0.050(1.30)
0.28(7.1)
0.025(0.64)
0.400(10.20)
An example of the SMT reflow profile is given in Figure 15.
PIN CONNECTION
Pin FUNCTION
+Output
1
+Output
2
3
+Sense
+Output
4
Equipment used: SMD HOT AIR REFLOW HD-350SAR
Alloy: AMQ-M293TA or NC-SMQ92 IND-82088 SN63
5
6
7
8
9
10
11
Common
Common
+V Input
+V Input
No Pin
Trim
On/Off Control
Figure 16. SIP10 Mechanical Outline Diagram
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 10
S10 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
BOTTOM VIEW OF BOARD
9.30
(0.366)
max.
33.0
(1.30)
7.87
(0.310)
4.83
4.83
4.83
(0.190) (0.190) (0.190)
COM
+VO
1.65
(0.065)
TRIM +SENSE
10.29 13.46
(0.405) (0.530)
ON/OFF
+VIN
1.60
(0.063)
7.54
(0.297)
SURFACE MOUNT CONTACT
1.22
(0.048)
2.84
(0.112)
1.91 (0.075)
L1 INDUCTOR
Dimensions are in millimeters(Inches)
Tolerances :X.X¡ Ó0.5mm(0.02in),X.XX¡ Ó0.25mm(0.010in),unless otherwise noted.
Figure 17. SMT10 Mechanical Outline Diagram
8.2 SMT Tape and Reel Dimensions
The Tape Reel dimensions for the SMT module is shown in Figure 18.
P
D
t
E
W
Bo
F
Po
P2
Ao
Ko
W
Ao
Bo
Ko
P
F
E
D
D1
Po
P2
t
Figure 18 – SMT Tape and Reel Dimensions
•
•
Intronics Power Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-781-551-5500 Fax: 1-781-551-5555 Rev. B
Page 11