® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical NON-ISOLATED DC-DC Converter S10 SERIES 3.0-5.5Vin, 1-3.3Vout, 10A APPLICATION NOTES Ver 1.0 S10-5SX.XT (Through-Hole) Series S10-5SX.X SMT Series • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 1 ® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 1. INTRODUCTION 3 2. MODELS 3 3. 10A SIP/SMT CONVERTER FEATURES 3 4. GENERAL DESCRIPTION 3 4.1 Electrical Description 3 4.2 Thermal Packaging and Physical Design. 4 5. MAIN FEATURES AND FUNCTIONS 4 5.1 Operating Temperature Range 4 5.2 Over-Temperature Protection (OTP) 4 5.3 Output Voltage Adjustment 4 5.4 Safe Operating Area (SOA) 4 5.5 Over Current Protection 4 5.6 Remote ON/OFF 4 5.7 UVLO (Under-Voltage Lockout) 5 6. SAFETY 5 6.1 Input Fusing and Safety Considerations. 5 7. APPLICATIONS 5 7.1 Layout Design Challenges. 5 7.2 Convection Requirements for Cooling 6 7.3 Thermal Considerations 6 7.4 Power De-Rating Curves 7 7.5 Input Capacitance at the Power Module 7 7.6 Test Set-Up 8 7.7 Remote Sense Compensation 8 7.8 S10-5SX.X Series Output Voltage Adustment. 8 7.9 Output Ripple and Noise Measurement 10 7.10 Output Capacitance 10 7.11 SMT Reflow Profile 10 8. MECHANICAL OUTLINE DIAGRAMS 10 8.1 SIP/SMT S10 Mechanical Outline Diagrams 10 8.2 SMT Tape and Reel Dimensions 11 • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 2 ® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment Version Application Notes • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 1. Introduction 3. 10A SIP/SMT Converter Features This application note describes the features and functions of • High efficiency topology, typically 95% at 3.3Vdc Intronics’ S10 SMT series of Non Isolated DC-DC Converters. • Industry standard footprint These are highly efficient, reliable and compact, high power • Wide ambient temperature range, -40C to +85C density, single output DC/DC converters. These “Point of • Cost efficient open frame design Load” modules serve the needs specifically of the fixed and mobile • ±10% output voltage trimmable. telecommunications and computing market, employing economical • No minimum load requirement (Stable at all loads) distributed Power Architectures. • Remote ON/OFF The S10 SMT series provide precisely regulated output voltage range • Remote sense compensation from 1.0V to 3.3Vdc over a wide range of input voltage (Vi=3.0 – • Fixed switching frequency 5.5Vdc) and can operate over an ambient temperature range of –40C • Continuous short-circuit protection and over current protection to +85C. Ultra-high efficiency operation is achieved through the use • Over-temperature protection (OTP) of synchronous rectification and drive control techniques. The modules • Monotonic Startup with pre-bias at the output. are fully protected against short circuit and over-temperature • UL/IEC/EN60950 Certified. conditions. Intronics’ world class automated manufacturing methods, together with 4. General Description an extensive testing and qualification program, ensure that all S10- 4.1 Electrical Description 5SX.X series converters are extremely reliable. A block diagram of the S10-5SX.X Series converter is shown in Figure 1. Extremely high efficiency power conversion is achieved through the 2. Models use of synchronous rectification and drive techniques. The adjustable S10 series currently comprises of 7 models. Essentially, the powerful S10-5SX.X series topology is based on a non-isolated synchronous buck converter. The control loop is Model S10-5S1.0T S10-5S1.2T S10-5S1.5T S10-5S1.8T S10-5S2.5T S10-5S3.3T S10-5S5.0T Input Voltage 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 4.5 – 5.5VDC Output Voltage 1.0V 1.2V 1.5V 1.8V 2.0V 2.5V 3.3V Output Current 10A 10A 10A 10A 10A 10A 10A optimized for unconditional stability, fast transient response and a very tight line and load regulation. In a typical pre-bias application the S105SX.X series converters do not draw any reverse current at start-up. The output is adjustable over a range of -10% to +10% of the nominal output voltage, using the TRIM pin. The converter can be shut down via a remote ON/OFF input that is referenced to ground. This input is compatible with popular logic devices; a 'negative' logic input is supplied as standard. Negative logic implies that the converter is enabled if the remote ON/OFF input is low (or floating), and disabled if it is high. The converter is also protected against over-temperature conditions. If the converter is overloaded or the ambient temperature gets too high, Table 1A – S10-5SX.XT Through-Hole Series Models the converter will shut down to protect the unit. The adjustable SMT10-05 series comprises of 7 models. Model S10-5S1.0 S10-5S1.2 S10-5S1.5 S10-5S1.8 S10-5S2.5 S10-5S3.3 S10-5S5.0 Input Voltage 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 3.0 – 5.5VDC 4.5 – 5.5VDC Output Voltage 1.0V 1.2V 1.5V 1.8V 2.0V 2.5V 3.3V L1 Q1 +VIN Output Current 10A 10A 10A 10A 10A 10A 10A +VO C1 Q2 D1 C2 R sense +SENSE COM COM R1 PWM IC ON/OFF R trim ERR AMP TRIM R2 Table 1B – S10-5SX.X SMT Series Models Figure 1. Electrical Block Diagram • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 3 ® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 5.4 Safe Operating Area (SOA) 4.2 Thermal Packaging and Physical Design. Figure 2 provides a graphical representation of the Safe Operating The S10-5SX.X series uses a multi-layer FR4 PCB construction. All Area (SOA) of the converter. This representation assumes ambient surface mount power components are placed on one side of the PCB, operating conditions such as airflow are met as per thermal guidelines and all low-power control components are placed on the other side. provided in Sections 7.2 and 7.3. Thus, the Heat dissipation of the power components is optimized, ensuring that control components are not thermally stressed. Vo The converter is an open-frame product and has no case or case pin. The open-frame design has several advantages over encapsulated closed devices. Among these advantages are: Vo,nom Efficient Thermal Management: the heat is removed from the VOLTAGE (V) • heat generating components without heating more sensitive, small signal control components. • Environmental: Lead free open-frame converters are more easily re-cycled. • Cost Efficient: No encapsulation. Cost efficient open-frame Safe Operating Area construction. • Reliable: Efficient cooling provided by open frame construction Io,max Io,CL Io offers high reliability and easy diagnostics. CURRENT (A) 5. Main Features and Functions 5.1 Operating Temperature Range Figure 2. Maximum Output Current Safe Operating Area Intronics’ S10-5SX.X series converters highly efficient converter design has resulted in its ability to operate over a wide ambient temperature 5.5 Over Current Protection environment ( -40C to 85C). Due consideration must be given to the All different voltage models have a full continuous short-circuit de-rating curves when ascertaining maximum power that can be drawn protection. The unit will auto recover once the short circuit is removed. from the converter. The maximum power drawn is influenced by a To provide protection in a fault condition, the unit is equipped with number of factors, such as: internal over-current protection. The unit operates normally once the • Input voltage range. fault condition is removed. The power module will supply up to 170% of • Output load current. rated current. In the event of an over current converter will go into a • Air velocity (forced or natural convection). hiccup mode protection. • Mounting orientation of converter PCB with respect to the Airflow. • Motherboard PCB design, especially ground and power planes. 5.6 Remote ON/OFF These can be effective heatsinks for the converter. The remote ON/OFF input feature of the converter allows external 5.2 Over-Temperature Protection (OTP) circuitry to turn the converter ON or OFF. Active-low remote The S10-5SX.X Series converters are equipped with non-latching over- ON/OFF is available as standard. temperature protection. A temperature sensor monitors the The S10-5SX.X series converters are turned on if the remote temperature of the hot spot (typically, top switch). If the temperature ON/OFF pin is low, or left open or floating. Pulling the pin high will turn exceeds a threshold of 120°C (typical) the converter will shut down, the converter ‘Off’. The signal level of the remote on/off input is defined disabling the output. When the temperature has decreased the with respect to ground. The unit is guaranteed OFF over the full converter will automatically restart. temperature range if this voltage level exceeds 2.8Vdc. The over-temperature condition can be induced by a variety of reasons such as external overload condition or a system fan failure. The remote ON/OFF input can be driven as described in Figure 3. 5.3 Output Voltage Adjustment Section 7.8 describes in detail as to how to trim the output voltage with respect to its set point. The output voltage on all models is trimmable in the range -10% to +10%. • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 4 ® S10 SERIES SIP or SMT 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical given to proper low impedance tracks between power module, input +Vin and output grounds. +Vo Q1 SIP10 Series ON/OFF Control Remote ON/OFF Common LAYOUT PATTERN TOP VIEW 0.29(7.4) Common 0.33(8.4) All Dimmension In Inches(mm) Tolerance : .XX=¡ Ó0.04 .XXX=¡ Ó0.010 Figure 3 . Remote ON/OFF Input Drive Circuit 5.7 UVLO (Under-Voltage Lockout) 1.1mm PLATED THROUGH HOLE 1.6mm PAD SIZE VIEW IS FROM TOP SIDE Figure 4A. Recommended SIP Footprint The voltage on the Vcc pin determines the start of the operation of the Converter. When the input Vcc rises and exceeds about 2.8V the Recommended Pad Layout converter initiates a soft start. The UVLO function in the converter has Dimensions are in millimetes and(inches) a Hysterisis (about 100mV) built in to provide noise immunity at startup. 7.54 (0.297) 4.83 4.83 (0.190) (0.190) (0.190) +SENSE TRIM 10.29 (0.405) 6. Safety 4.83 +VO 0.64 (0.025) Agency Approvals: The power Supply shall be submitted to and receive formal approval from the following test agencies. (0.310) COM 10.92 (0.430) Top View of Board ON/OFF 6.1 Input Fusing and Safety Considerations. 7.87 +VIN 29.90 (1.177) PAD SIZE MIN:3.556x2.413(0.140x0.095) MAX:4.19x2.79(0.165x0.110) 1.The power supply shall be approved by a nationally recognized rd Figure 4B. Recommended SMT Footprint testing laboratory to UL/CSA 60950 3 Edition (North America) and EN60950 (International) 2. CB Certificate from an internationally recognized test house in accordance with EN 60950. The S10-5SX.X series converters do not have an internal fuse. However, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 20A. 7. Applications 7.1 Layout Design Challenges. In optimizing thermal design the PCB is utilized as a heatsink. Also some heat is transferred from the SIP module to the main board through connecting pins. The system designer or the end user must ensure that other components and metal in the vicinity of the S10-5SX.X series SIP’s meet the spacing requirements to which the system is approved. Low resistance and low inductance PCB layout traces are the norm and should be used where possible. Due consideration must also be • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 5 ® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.2 Convection Requirements for Cooling To predict the approximate cooling needed for the module, refer to the Power De-rating curves in Figures 9 and 10. These de-rating curves are approximations of the ambient temperatures and airflows required to keep the power module temperature below its maximum rating. Once the module is assembled in the actual system, the module’s temperature should be checked as shown in Figure 5 to ensure it does not exceed 110°C. Proper cooling can be verified by measuring the power module’s temperature at Q1-pin 6 and Q2-pin 6 as shown in Figure 6A,6B. W ind Tunnel Figure 6B. Temperature Measurement Location for SMT 25.4(1.0) 7.3 Thermal Considerations Bakelite The power module operates in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding environment. The thermal data presented is based on measurements taken in a set-up as shown in Figure 5. Power Module Figures 7A,7B and 8A,8B represent the test data. Note that the airflow is parallel to the long axis of the module as shown in Figure 6A for the SIP. The temperature at either location should not exceed 110 °C. The output power of the module should not exceed the rated power for the module (VO, set x IO, max). 76.2(3.0) The SMT10 thermal data presented is based on measurements taken in a wind tunnel. The test setup shown in Figure 5 and EUT need to Thermocuple Location for measuring ambient temperature and airflow solder on 33mm x 40.38mm(1.300'' x 1.59'') test pcb. Note that airflow is parallel to the long axis of the module as shown in Fig 6B 12.7(0.5) Air flow Note : Dimensions are in millimeters and (inches) Figure 5. Thermal Test Setup Pin6 Inductor Pin Airflow Figure 6A. Temperature Measurement Location for SIP • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 6 ® S10 SERIES SIP or SMT Version Application Notes 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM 7.4 Power De-Rating Curves Output Current(A) Output Current(A) Vin=3.3Vdc Derating Curve 10 8 6 0LFM 4 100LFM 2 200LFM 10 8 0LFM 100LFM 200LFM 6 4 2 0 0 0 10 20 30 40 50 60 70 80 0 90 100 o Ambient Temperature( C) 20 30 40 50 60 70 80 o Ambient Temperature( C) 90 100 7.5 Input Capacitance at the Power Module The SIP/SMT converters must be connected to a low AC source Vin=5Vdc Derating Curve 12 10 Figure8B.Typical Power De-rating for 5.0V IN(SMT10) Figure7A Typical Power De-rating for 3.3V IN(SIP10) Output Current(A) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical Vin=5Vdc Derating Curve 12 12 Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment impedance. To avoid problems with loop stability source inductance should be low. Also, the input capacitors should be placed close to the 10 converter input pins to de-couple distribution inductance. However, the 8 external input capacitors are chosen for suitable ripple handling 0LFM 6 4 2 capability. Low ESR polymers are a good choice. They have high 100LFM capacitance, high ripple rating and low ESR (typical <20mΩ). 200LFM Electrolytic capacitors should be avoided. Circuit as shown in Figure 9 represents typical measurement methods for ripple current. Input reflected-ripple current is measured with a simulated source 0 0 10 20 30 40 50 60 70 80 Inductance of 1uH. Current is measured at the input of the module. 90 100 o Ambient Temperature( C) Figure7B.Typical Power De-rating for 5.0V IN(SIP10) L1 Vin=3.3Vdc Derating Curve 12 Output Current(A) To Oscilloscope 10 Power 8 Supply 0LFM 100LFM 200LFM 6 4 +Vin 1uH + 2*100uF Tantalum SIP10 Series 220uF ESR<0.1ohm Common 2 Figure 9. Input Reflected-Ripple Test Setup 0 0 10 20 30 40 50 60 70 80 o Ambient Temperature( C) 90 100 Figure8A.Typical Power De-rating for 3.3V IN (SMT10) • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 7 ® S10 SERIES SIP or SMT Version Application Notes 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.6 Test Set-Up 7.7 Remote Sense Compensation The basic test set-up to measure parameters such as efficiency and load regulation is shown in Figure 10. Things to note are that this Remote Sense regulates the output voltage at the point of load. It converter is non-isolated, as such the input and output share a minimizes the effects of distribution losses such as drops across the common ground. These grounds should be connected together via low connecting pin and PCB tracks (see Figure 11). Please note however, impedance ground plane in the application circuit. When testing a the maximum drop from the output pin to the point of load should not converter on a bench set-up, ensure that -Vin and -Vo are connected exceed 500mV for remote compensation to work. together via a low impedance short to ensure proper efficiency and The amount of power delivered by the module is defined as the output load regulation measurements are being made. When testing the voltage multiplied by the output current (VO x IO). Intronics’ S10-5SX.X series under any transient conditions please When using TRIM UP, the output voltage of the module will increase ensure that the transient response of the source is sufficient to power which, if the same output current is maintained, increases the power the equipment under test. We can calculate the output by the module. Make sure that the maximum output power of • Efficiency the module remains at or below the maximum rated power. • Load regulation and line regulation. When the Remote Sense feature is not being used, leave sense pin disconnected. The value of efficiency is defined as : Distribution Losses Vo × Io η = × 100% Vin × Iin Where: +Vin +Vo +Sense Vo is output voltage , SIP10 Series Io is output current, R-Load Vin is input voltage, Iin is input current. Common The value of load regulation is defined as : Load .reg = Distribution Losses VFL − VNL × 100% VNL Figure 11. Circuit Configuration for Remote Sense Operation VFL is the output voltage at full load VNL is the output voltage at no load Where: The value of line regulation is defined as: Line.reg = Common 7.8 S10-5SX.X Series Output Voltage Adustment. VHL − VLL ×100% VLL In order to trim the voltage up or down one needs to connect the trim resistor either between the trim pin and ground for trim-up and between trim pin and Vsense+ for trim-down. The output voltage trim Where: VHL is the output voltage of maximum input voltage at full load. range is ±10%. This is shown in Figures 12 and 13: VLL is the output voltage of minimum input voltage at full load. +Vin Current Meter Current Meter A +Vin Supply + Voltage V 100uF Meter Tant. SIP10 Series Common Trim A +Vo +Sense Power + +Vo R-Load SIP10 Series Voltage Meter V R trim-up R-Load Common Common Figure 10. SIP10 Series Test Setup Common Figure 12. Trim-up Voltage Setup • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 8 ® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Version Application Notes Where: +Vin Rtrim-down is the external resistor in KΩ. Vo is the desired output voltage. R trim-down R1 and Rt are internal to the unit and are defined in Table 2. For example,to trim-down the output voltage of 2.5V module R-Load (SIP10-05S25E) by 8% to 2.3V , Rtrim-down is calculated as follows : Trim Common • Networking Gear • Data Communications • Telecommunications • Industrial / Medical Vo,nom is the nominal output voltage. +Vo SIP10 Series Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment Vo,nom – Vo = 2.5 – 2.3 = 0.2 V Common R1 = 30.1 KΩ Rt = 78.7 KΩ Figure 13. Trim-down Voltage Setup The value of Rtrim-up defined as: Rtrim − up = ( Where: Rtrim − down = R1 × 0.8 ) − Rt (KΩ ) Vo − Vo , nom 30 .1 × ( 2.3 − 0.8) − 78 .7 = 147 .05 (KΩ ) 0 .2 For Trim-up using an external voltage source, apply a voltage from TRIM pin to ground using the following equation: Rtrim-up is the external resistor in KΩ. Vo,nom is the nominal output voltage. Vo is the desired output voltage. Vtrim − up = 0.8 − ( R1 and Rt are internal to the unit and are defined in Table 2. Output Voltage(V) R1 (KΩ) Rt (KΩ) 1.0 30.1 30.1 1.2 30.1 59 1.5 30.1 100 1.8 30.1 100 2.0 30.1 100 2.5 30.1 78.7 3.3 30.1 59 (Vo − Vo , nom ) × Rt ) R1 For Trim-down using an external voltage source,apply a voltage from TRIM pin to ground using the following equation : Vtrim − down = 0.8 + Where: Table 2 – Trim Resistor Values (Vo , nom − Vo) × Rt R1 Vtrim-up is the external source voltage for trim-up. Vtrim-down is the external source voltage for trim-down. Vo is the desired output voltage. For example, to trim-up the output voltage of 1.5V module Vo,nom is the nominal output voltage. (SIP10-05S15E) by 8% to 1.62V , Rtrim-up is calculated as follows : Rt (internal to the module) is defined in Table 2. Vo – Vo,nom = 1.62 – 1.5 = 0.12V If the TRIM feature is not being used, leave the TRIM pin Rt = 100 KΩ disconnected. R1= 30.1 KΩ Rtrim − up = 30.1× 0.8 − 100 = 100.66 (KΩ) 0.12 The value of Rtrim-down defined as: Rtrim − down = R1× (Vo − 0.8) − Rt (KΩ) Vo , nom − Vo • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 9 ® 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM S10 SERIES SIP or SMT Version Application Notes 7.9 Output Ripple and Noise Measurement Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical REFLOW PROFILE 240 The test set-up for noise and ripple measurements is shown in Figure 200 impedance mismatch reflections disturbing the noise readings at higher frequencies. +Vin +Vo SIP10 Series 10uF Tant. 1uF Ceramic TEMPERATURE (C) 14. a 50Ω. coaxial cable with a 50Ω termination was used to prevent R-Load Test Jack Common 160 120 80 40 0 0 Common 30 60 90 120 150 180 210 240 TIME (SECONDS) Figure 15 – SMT Reflow Profile Figure 14. Output Voltage Ripple and Noise Measurement Set-Up 8. Mechanical Outline Diagrams 7.10 Output Capacitance 8.1 SIP/SMT10 Mechanical Outline Diagrams Intronics’ S10-5SX.X series converters provide unconditional stability Dimensions are in millimeters and (inches) with or without external capacitors. For good transient response low Tolerance : x.xx ±0.02 in.(0.5mm) , x.xxx ±0.010 in. (0.25 mm) unless ESR output capacitors should be located close to the point of load. otherwise noted For high current applications point has already been made in layout 0.327(8.30) considerations for low resistance and low inductance tracks. 2.000(50.80) 0.23(5.8) Output capacitors with its associated ESR values have an impact on loop stability and bandwidth.Intronics’ converters are designed to work additional capacitance, typically 1,000uF and low ESR (<20mΩ), be 6 7 8 9 10 11 1 2 3 4 5 with load capacitance up-to 10,000uF. It is recommended that any 0.139(3.53) 0.500(12.70) connected close to the point of load and outside the remote 0.100(2.54) compensation point. 0.025(0.64) 0.050(1.30) 1.000(25.40) 7.11 SMT Reflow Profile 0.28(7.1) 0.025(0.64) 0.400(10.20) An example of the SMT reflow profile is given in Figure 15. PIN CONNECTION Pin FUNCTION +Output 1 +Output 2 3 +Sense +Output 4 Equipment used: SMD HOT AIR REFLOW HD-350SAR Alloy: AMQ-M293TA or NC-SMQ92 IND-82088 SN63 5 6 7 8 9 10 11 Common Common +V Input +V Input No Pin Trim On/Off Control Figure 16. SIP10 Mechanical Outline Diagram • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 10 ® S10 SERIES SIP or SMT Version Application Notes 1400 PROVIDENCE HIGHWAY • BUILDING 2 NORWOOD, MASSACHUSETTS 02062-5015 WWW.INTRONICS.COM Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical BOTTOM VIEW OF BOARD 9.30 (0.366) max. 33.0 (1.30) 7.87 (0.310) 4.83 4.83 4.83 (0.190) (0.190) (0.190) COM +VO 1.65 (0.065) TRIM +SENSE 10.29 13.46 (0.405) (0.530) ON/OFF +VIN 1.60 (0.063) 7.54 (0.297) SURFACE MOUNT CONTACT 1.22 (0.048) 2.84 (0.112) 1.91 (0.075) L1 INDUCTOR Dimensions are in millimeters(Inches) Tolerances :X.X¡ Ó0.5mm(0.02in),X.XX¡ Ó0.25mm(0.010in),unless otherwise noted. Figure 17. SMT10 Mechanical Outline Diagram 8.2 SMT Tape and Reel Dimensions The Tape Reel dimensions for the SMT module is shown in Figure 18. P D t E W Bo F Po P2 Ao Ko W Ao Bo Ko P F E D D1 Po P2 t Figure 18 – SMT Tape and Reel Dimensions • • Intronics, Inc. 1400 Providence Highway, Building 2, Norwood, MA 02062-5015 Phone: 1-800-367-0004, 1-781-551-5500 Fax: 1-781-551-5555 Rev. A Page 11