S5 App Notes

S5 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
NON-ISOLATED DC-DC Converter
S5-5S3.3T, S5-5S3.3
3.0-5.5Vin, 0.75- 3.63Vout, 5A
APPLICATION NOTE
Ver10
S5-5S3.3T (Suffix “T” Indicates Through-Hole Version)
S5-5S3.3
Page 1
S5 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
Content
1. INTRODUCTION
2. MODELS
3. 5A SIP/SMT CONVERTER FEATURES
4. GENERAL DESCRIPTION
3
3
3
4.1 Electrical Description
3
3
4.2 Thermal Packaging and Physical Design.
4
5. MAIN FEATURES AND FUNCTIONS
5.1 Operating Temperature Range
4
4
5.2 Over-Temperature Protection (OTP)
4
5.3 Output Voltage Adjustment
4
5.4 Safe Operating Area (SOA)
4
5.5 Over Current Protection
4
5.6 Remote ON/OFF
4
5.7 UVLO (Under-Voltage Lockout)
5
6. SAFETY
5
5
6.1 Input Fusing and Safety Considerations.
7. APPLICATIONS
7.1 Layout Design Challenges.
5
5
7.2 Convection Requirements for Cooling
6
7.3 Thermal Considerations
6
7.4 Power De-Rating Curves
7
7.5 Efficiency vs Load Curves
11
7.6 Input Capacitance at the Power Module
13
7.7 Test Set-Up
13
7.8 S5 Series Output Voltage Adustment.
14
7.9 Output Ripple and Noise Measurement
14
7.10 Output Capacitance
14
7.11 SMT Reflow Profile
14
8. MECHANICAL OUTLINE DIAGRAMS
8.1 SIP/SMT05 Mechanical Outline Diagrams
15
15
8.2 SMT Tape and Reel Dimensions
15
Page 2
S5 SERIES SIP or SMT
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
Version Application Notes
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
1. Introduction
3. 5A SIP/SMT Converter Features
This application note describes the features and functions of Intronics’
•
High efficiency topology, typically 94% at 3.3Vdc
S5 series of Non Isolated DC-DC Converters. These are highly efficient,
•
Industry standard footprint
reliable and compact, high power density, single output DC/DC
•
Wide ambient temperature range, -40C to +85C
converters. These “Point of Load” modules serve the needs specifically
•
Cost efficient open frame design
of the fixed and mobile telecommunications and computing market,
•
Programmable output voltage via external resistor from 0.75 to
employing economical distributed Power Architectures. The S5 series
3.63Vdc
provide precisely regulated output voltage range from 0.75V to 3.63Vdc
•
No minimum load requirement (Stable at all loads)
over a wide range of input voltage (Vi=3.0 – 5.5Vdc) and can operate
•
Remote ON/OFF
over an ambient temperature range of –40℃ to +85℃. Ultra-high
•
Remote sense compensation
efficiency operation is achieved through the use of synchronous
•
Fixed switching frequency
rectification and drive control techniques.
•
Continuous short-circuit protection and over current protection
The modules are fully protected against short circuit and over-
•
Over-temperature protection (OTP)
temperature conditions. Intronics’ world class automated manufacturing
•
Monotonic Startup with pre-bias at the output.
methods, together with an extensive testing and qualification program,
•
UL/IEC/EN60950 Certified.
ensure that all S5 series converters are extremely reliable.
4. General Description
2. Models
4.1 Electrical Description
A block diagram of the S5 Series converter is shown in Figure 1.
The adjustable S5 series models are shown in table1.
Extremely high efficiency power conversion is achieved through the use
Model
Input
Voltage
Output
Voltage
Output
Current
S5-5S3.3T
3.0 – 5.5VDC
0.75 – 3.63VDC
5A
S5-5S3.3
3.0 – 5.5VDC
0.75 – 3.63VDC
5A
0.75V
1.2V
1.5V
1.8V
2.0V
2.5V
3.3V
Input Current (mA)
No Load
Full Load
5A
25
5A
30
5A
30
5A
35
5A
35
5A
35
5A
35
0.949
1.412
1.724
2.022
2.222
2.217
3.511
buck converter. The control loop is optimized for unconditional stability,
fast transient response and a very tight line and load regulation. In a
typical pre-bias application the S5 series converters do not draw any
0.75 to 3.63vdc, using the TRIM pin with a external resistor. The
The S5 SERIES efficiency and input current at 5.0Vin are shown in
table2.
Output
Current
powerful S5 series topology is based on a non-isolated synchronous
reverse current at start-up. The output voltage can be adjusted from
Table 1 – S5 Series Models
Output
Voltage
of synchronous rectification and drive techniques. Essentially, the
converter can be shut down via a remote ON/OFF input that is
referenced to ground. This input is compatible with popular logic
Efficiency
typ.
devices; a 'positive' logic input is supplied as standard. Positive logic
79%
85%
87%
89%
90%
92%
94%
(or floating), and disabled if it is low. The converter is also protected
implies that the converter is enabled if the remote ON/OFF input is high
against over-temperature conditions. If the converter is overloaded or
the ambient temperature gets too high, the converter will shut down to
protect the unit.
L1
Q1
+VIN
+VO
C1
Q2
D1
C2
Table 2 – S5 Series Efficiency and Input Current
COM
COM
R1
PWM IC
ON/OFF
R trim
ERR AMP
TRIM
R2
Figure 1. Electrical Block Diagram
Page 3
S5 SERIES SIP or SMT
Applications
Version Application Notes
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
4.2 Thermal Packaging and Physical Design.
5.4 Safe Operating Area (SOA)
The S5 series uses a multi-layer FR4 PCB construction. All surface
Figure 2 provides a graphical representation of the Safe Operating Area
mount power components are placed on one side of the PCB, and all
(SOA) of the converter. This representation assumes ambient
low-power control components are placed on the other side. Thus, the
operating conditions such as airflow are met as per thermal guidelines
Heat dissipation of the power components is optimized, ensuring that
provided in Sections 7.2 and 7.3.
control components are not thermally stressed. The converter is an
Vo
open-frame product and has no case or case pin. The open-frame
design has several advantages over encapsulated closed devices.
Among these advantages are:
•
Vo,nom
Efficient Thermal Management: the heat is removed from the
VOLTAGE (V)
heat generating components without heating more sensitive, small
signal control components.
•
Environmental: Lead free open-frame converters are more easily
re-cycled.
•
Cost Efficient: No encapsulation. Cost efficient open-frame
Safe Operating Area
construction.
•
Reliable: Efficient cooling provided by open frame construction
offers high reliability and easy diagnostics.
Io,max Io,CL Io
CURRENT (A)
5. Main Features and Functions
5.1 Operating Temperature Range
Figure 2. Maximum Output Current Safe Operating Area
Intronics’ S5 series converters highly efficient converter design has
resulted in its ability to operate over a wide ambient temperature
5.5 Over Current Protection
environment ( -40℃ to 85℃). Due consideration must be given to the
All different voltage models have a full continuous short-circuit
de-rating curves when ascertaining maximum power that can be drawn
protection. The unit will auto recover once the short circuit is removed.
from the converter. The maximum power drawn is influenced by a
To provide protection in a fault condition, the unit is equipped with
number of factors, such as:
internal over-current protection. The unit operates normally once the
fault condition is removed. The power module will supply up to 150% of
•
Input voltage range.
•
rated current. In the event of an over current converter will go into a
Output load current.
•
hiccup mode protection.
Air velocity (forced or natural convection).
•
Mounting orientation of converter PCB with respect to the Airflow.
•
5.6 Remote ON/OFF
Motherboard PCB design, especially ground and power planes.
The remote ON/OFF input feature of the converter allows external
These can be effective heat sinks for the converter.
circuitry to turn the converter ON or OFF. Active-high remote ON/OFF
5.2 Over-Temperature Protection (OTP)
is available as standard. The S5 series converters are turned on if the
remote ON/OFF pin is high, or left open or floating. Setting the pin low
The S5 Series converters are equipped with non-latching over-
will turn the converter ‘Off’. The signal level of the remote on/off input is
temperature protection. A temperature sensor monitors the temperature
defined with respect to ground. If not using the remote on/off pin, leave
of the hot spot (typically, top switch). If the temperature exceeds a
the pin open (module will be on). The part number suffix “N” is Negative
threshold of 120°C (typical) the converter will shut down, disabling the
remote ON/OFF version. The unit is guaranteed OFF over the full
output. When the temperature has decreased the converter will
temperature range if this voltage level exceeds 2.8Vdc. The converters
automatically restart.
are turned on If the on/off pin input is low or left open. The
The over-temperature condition can be induced by a variety of reasons
recommended SIP/SMT remote on/off drive circuit as shown as figure
such as external overload condition or a system fan failure.
3, 4.
5.3 Output Voltage Adjustment
Section 7.8 describes in detail as to how to trim the output voltage with
respect to its set point. The output voltage on all models is trimmable in
the range 0.75 – 3.63Vdc.
Page 4
S5 SERIES SIP or SMT
Applications
Version Application Notes
+Vin
+Vo
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7. Applications
7.1 Layout Design Challenges.
ON/OFF
Control
Remote ON/OFF
In optimizing thermal design the PCB is utilized as a heat sink. Also
S5
Q1
some heat is transferred from the SIP/SMT module to the main board
SIP/SMT Series
through connecting pins. The system designer or the end user must
ensure that other components and metal in the vicinity of the
Common
Common
S5 series meet the spacing requirements to which the system is
approved.
Figure 3. Positive Remote ON/OFF Input Drive Circuit
Low resistance and low inductance PCB layout traces are the norm and
should be used where possible. Due consideration must also be given
+Vin
+Vo
S5
Q1
to proper low impedance tracks between power module, input and
output grounds. The recommended SIP/SMT footprint as shown as
figure 5, 6.
SIP/SMT Series
ON/OFF
Control
1.1mm PLATED THROUGH HOLE
1.6mm PAD SIZE
Remote ON/OFF
LAYOUT PATTERN
TOP VIEW
0.20(5.1)
Common
0.24(6.1)
Common
All Dimmension In Inches(mm)
Tolerance :
.XX=¡ 0
Ó.02 ( ¡ Ó0.5 )
.XXX=¡ 0
Ó.010 ( ¡ Ó0.25 )
Figure 4. Negative Remote ON/OFF Input Drive Circuit
Figure 5. Recommended SIP Footprint
5.7 UVLO (Under-Voltage Lockout)
The voltage on the Vcc pin determines the start of the operation of the
Recommended Pad Layout
Converter. When the input Vcc rises and exceeds about 2.0V the
Dimensions are in Inches ( millimetes )
converter initiates a soft start. The UVLO function in the converter has a
0.180
(4.57)
hysteresis (about 100mV) built in to provide noise immunity at start-up.
6. Safety
0.160
(4.06)
VOUT
6.1 Input Fusing and Safety Considerations.
ON/OFF
1.The power supply shall be approved by a nationally recognized
EN60950 (International)
2. CB Certificate from an internationally recognized test house in
accordance with EN 60950.
GND
0.350
(8.89)
Agency Approvals: The power Supply shall be submitted to and
rd
TRIM
0.190
(4.83)
0.340
(8.64)
receive formal approval from the following test agencies.
testing laboratory to UL/CSA 60950 3 Edition (North America) and
0.160
(4.06)
0.06
(1.5)
0.05
(1.3)
0.010
(0.25)
VIN
0.690
(17.53)
PAD SIZE
MIN : 0.120" x 0.095 "
MAX : 0.135" x 0.110 "
Figure 6. Recommended SMT Footprint (Top View)
The S5 series converters do not have an internal fuse. However, to
achieve maximum safety and system protection, always
use an input line fuse. The safety agencies require a time-delay fuse
with a maximum rating of 10A.
Page 5
S5 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7.2 Convection Requirements for Cooling
To predict the approximate cooling needed for the module, refer to the
Power De-rating curves in Figures 10 to 13 . These de-rating curves are
approximations of the ambient temperatures and airflows required to
keep the power module temperature below its maximum rating. Once
the module is assembled in the actual system, the module’s
temperature should be checked as shown in Figure 7 to ensure it does
not exceed 110°C.
Proper cooling can be verified by measuring the power module’s
temperature at Q1-pin 6 as shown in Figure 8,9.
W ind
Tunnel
25.4(1.0)
Bakelite
Figure 9. Temperature Measurement Location for SMT
Power Module
76.2(3.0)
Thermocuple Location
for measuring
ambient temperature
and airflow
12.7(0.5)
Air
flow
7.3 Thermal Considerations
The power module operates in a variety of thermal environments;
however, sufficient cooling should be provided to help ensure reliable
operation of the unit. Heat is removed by conduction, convection, and
radiation to the surrounding environment. The thermal data presented is
based on measurements taken in a set-up as shown in Figure7.
Figures 10 to 13 represent the test data. Note that the airflow is parallel
to the long axis of the module as shown in Figure7 for the SIP/SMT.
The temperature at either location should not exceed 110 °C. The
output power of the module should not exceed the rated power for the
module (VO, set x IO, max). The SMT Version of S5 Family thermal
data presented is based on measurements taken in a wind tunnel. The
test setup shown in Figure 7 and EUT need to solder on 33mm x
40.38mm(1.300'' x 1.59'') test pcb. Note that airflow is parallel to the
long axis of the module as shown in Fig7.
Note : Dimensions are in millimeters and (inches)
Figure 7. Thermal Test Setup
Figure 8. Temperature Measurement Location for SIP
Page 6
S5 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7.4 Power De-Rating Curves
SIP05-05S33A
S5-5S3.3T (Vo=3.3V) Derating Curve
5.0
4.0
3.0
0LFM
100LFM
2.0
200LFM
1.0
6.0
Output Current(A)
Output Current(A)
6.0
0
4.0
3.0
100LFM
200LFM
1.0
0
SIPS5-5S3.3T
05-05S33A (Vo=1.5V) Derating Curve
SIP05-05S33A
S5-5S3.3T (Vo=1.8V) Derating Curve
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
6.0
Output Current(A)
5.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 10b.Typical Power De-rating for 5.0V IN 2.5Vout
0.0
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure10c.Typical Power De-rating for 5.0V IN 1.8Vout
0
SIP05-05S33A
S5-5S3.3T (Vo=0.75V) Derating Curve
6.0
5.0
5.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
Output Current(A)
6.0
4.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 10d.Typical Power De-rating for 5.0V IN 1.5Vout
SIP05-05S33A
S5-5S3.3T (Vo=1.2V) Derating Curve
Output Current(A)
0LFM
2.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure10a.Typical Power De-rating for 5.0V IN 3.3Vout
Output Current(A)
5.0
0.0
0.0
6.0
SIPS5-5S3.3T
05-05S33A (Vo=2.5V) Derating Curve
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure10e.Typical Power De-rating for 5.0V IN 1.2Vout
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 10f.Typical Power De-rating for 5.0V IN 0.75Vout
Page 7
S5 SERIES SIP or SMT
Version Application Notes
SIP05-05S33A
S5-5S3.3T (Vo=2.5V) Derating Curve
5.0
4.0
3.0
0LFM
100LFM
2.0
200LFM
1.0
6.0
Output Current(A)
Output Current(A)
6.0
0.0
SIPS5-5S3.3T
05-05S33A (Vo=2.0V) Derating Curve
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure11a.Typical Power De-rating for 3.3V IN 2.5Vout
0
SIPS5-5S3.3T
05-05S33A (Vo=1.5V) Derating Curve
6.0
5.0
5.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
Output Current(A)
6.0
4.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 11b.Typical Power De-rating for 3.3V IN 2.0Vout
SIP05-05S33A
S5-5S3.3T (Vo=1.8V) Derating Curve
Output Current(A)
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
0.0
0
0.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure11c.Typical Power De-rating for 3.3V IN 1.8Vout
0
SIP05-05S33A
S5-5S3.3T (Vo=0.75V) Derating Curve
6.0
5.0
5.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
Output Current(A)
6.0
4.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 11d.Typical Power De-rating for 3.3V IN 1.5Vout
SIP05-05S33A
S5-5S3.3T (Vo=1.2V) Derating Curve
Output Current(A)
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure11e.Typical Power De-rating for 3.3V IN 1.2Vout
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 11f.Typical Power De-rating for 3.3V IN 0.75Vout
Page 8
S5 SERIES SIP or SMT
Version Application Notes
SMT05-05S33A
S5-5S3.3 (Vo=3.3V) Derating Curve
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
6.0
Output Current(A)
Output Current(A)
6.0
0.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0
SMT05-05S33A
S5-5S3.3 (Vo=1.5V) Derating Curve
6.0
5.0
5.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
Output Current(A)
6.0
4.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure12b.Typical Power De-rating for 5V IN 2.5Vout
SMT05-05S33A
S5-5S3.3 (Vo=1.8V) Derating Curve
Output Current(A)
SMT05-05S33A
S5-5S3.3 (Vo=2.5V) Derating Curve
5.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure12a.Typical Power De-rating for 5V IN 3.3Vout
0.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure12c.Typical Power De-rating for 5V IN 1.8Vout
0
SMTS5-5S3.3
05-05S33A (Vo=0.75V) Derating Curve
SMT05-05S33A
S5-5S3.3 (Vo=1.2V) Derating Curve
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 12d.Typical Power De-rating for 5V IN 1.5Vout
6.0
Output Current(A)
Output Current(A)
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
0.0
0
6.0
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure12e.Typical Power De-rating for 5V IN 1.2Vout
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 12f.Typical Power De-rating for 5V IN 0.75Vout
Page 9
S5 SERIES SIP or SMT
Version Application Notes
SMT05-05S33A
S5-5S3.3 (Vo=2.5V) Derating Curve
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
6.0
Output Current(A)
Output Current(A)
6.0
0.0
SMT05-05S33A
S5-5S3.3 (Vo=2.0V) Derating Curve
5.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure13a.Typical Power De-rating for 3.3V IN 2.5Vout
0
SMT05-05S33A
S5-5S3.3 (Vo=1.5V) Derating Curve
6.0
5.0
5.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
Output Current(A)
6.0
4.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 13b.Typical Power De-rating for 3.3V IN 2.0Vout
SMT05-05S33A
S5-5S3.3 (Vo=1.8V) Derating Curve
Output Current(A)
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
0.0
0
0.0
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure13c.Typical Power De-rating for 3.3V IN 1.8Vout
0
6.0
5.0
5.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
Output Current(A)
6.0
4.0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 13d.Typical Power De-rating for 3.3V IN 1.5Vout
SMT05-05S33A
S5-5S3.3 (Vo=1.2V) Derating Curve
Output Current(A)
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
SMTS5-5S3.3
05-05S33A (Vo=0.75V) Derating Curve
4.0
3.0
0LFM
2.0
100LFM
1.0
200LFM
0.0
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure13e.Typical Power De-rating for 3.3V IN 1.2Vout
0
10 20 30 40 50 60 70 80 90 100
o
Ambient Temperature( C)
Figure 13f.Typical Power De-rating for 3.3V IN 0.75Vout
Page 10
S5 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7.5 Efficiency vs Load Curves
SIP05-05S33A
S5-5S3.3T Vo=3.3V (Eff Vs Io)
SIP05-05S33A
S5-5S3.3T Vo=2.5V (Eff Vs Io)
95%
95%
Efficincy (%)
100%
Efficincy (%)
100%
90%
85%
4.5V
5.0V
5.5V
80%
75%
90%
85%
3.0V
5.0V
5.5V
80%
75%
70%
70%
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
Current Load (A)
SIP0505S33A Vo=1.8V (Eff Vs Io)
S5-5S3.3T
95%
Efficincy (%)
95%
Efficincy (%)
2.5
3
3.5
4
4.5
5
SIP05-05S33A
S5-5S3.3T Vo=1.5V (Eff Vs Io)
100%
90%
85%
3.0V
5.0V
5.5V
75%
2
Current Load (A)
100%
80%
1.5
90%
85%
3.0V
5.0V
5.5V
80%
75%
70%
70%
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
Current Load (A)
1.5
2
2.5
3
3.5
4
4.5
5
Current Load (A)
SIP05-05S33A
S5-5S3.3T Vo=1.2V (Eff Vs Io)
SIP05-05S33A
S5-5S3.3T Vo=0.75V (Eff Vs Io)
100%
100%
95%
95%
Efficincy (%)
Efficincy (%)
90%
90%
85%
3.0V
5.0V
5.5V
80%
75%
85%
80%
75%
3.0V
5.0V
5.5V
70%
65%
70%
60%
0
0.5
1
1.5
2
2.5
3
3.5
Current Load (A)
4
4.5
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Current Load (A)
Page 11
S5 SERIES SIP or SMT
Version Application Notes
SMT05-05S33A
S5-5S3.3 Vo=3.3V (Eff Vs Io)
95%
Efficincy (%)
95%
Efficincy (%)
100%
90%
85%
4.5V
5.0V
5.5V
75%
90%
85%
3.0V
5.0V
5.5V
80%
75%
70%
70%
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
Current Load (A)
SMT05-05S33
S5-5S3.3 A Vo=1.8V (Eff Vs Io)
95%
Efficincy (%)
95%
90%
85%
3.0V
5.0V
5.5V
75%
2
2.5
3
3.5
4
4.5
5
SMT0505S33A Vo=1.5V (Eff Vs Io)
S5-5S3.3
100%
80%
1.5
Current Load (A)
100%
Efficincy (%)
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
SMT05-05S33A
Vo=2.5V (Eff Vs Io)
S5-5S3.3
100%
80%
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
90%
85%
3.0V
5.0V
5.5V
80%
75%
70%
70%
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
Current Load (A)
1.5
2
2.5
3
3.5
4
4.5
5
Current Load (A)
SMT0505S33A Vo=1.2V (Eff Vs Io)
S5-5S3.3
SMT05-05S33A
Vo=0.75V (Eff Vs Io)
S5-5S3.3
100%
100%
95%
95%
Efficincy (%)
Efficincy (%)
90%
90%
85%
3.0V
5.0V
5.5V
80%
75%
85%
80%
75%
3.0V
5.0V
5.5V
70%
65%
70%
60%
0
0.5
1
1.5
2
2.5
3
3.5
Current Load (A)
4
4.5
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Current Load (A)
Page 12
S5 SERIES SIP or SMT
Version Application Notes
7.6 Input Capacitance at the Power Module
The SIP/SMT converters must be connected to a low AC source
impedance. To avoid problems with loop stability source inductance
should be low. Also, the input capacitors should be placed close to the
converter input pins to de-couple distribution inductance. However, the
external input capacitors are chosen for suitable ripple handling
capability. Low ESR polymers are a good choice. They have high
capacitance, high ripple rating and low ESR (typical <100mohm).
Electrolytic capacitors should be avoided. Circuit as shown in Figure 14
represents typical measurement methods for ripple current. Input
reflected-ripple current is measured with a simulated source Inductance
of 1uH. Current is measured at the input of the module.
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
VFL is the output voltage at full load
VNL is the output voltage at no load
Where:
The value of line regulation is defined as:
Line.reg =
VHL − VLL
×100%
VLL
Where: VHL is the output voltage of maximum input voltage at full load.
VLL is the output voltage of minimum input voltage at full load.
Current Meter
A
Power
Supply
+Vin
A
+Vo
+Sense
+
V 100uF
Voltage Meter
SIP/SMT Series
V
Load
To Oscilloscope
Common
Common
L1
+Vin
1uH
Power
+
2*100uF
Tantalum
Supply
Figure 15. S5 Series Test Setup
SIP/SMT05
220uF
ESR<0.1ohm
Common
Figure 14. Input Reflected-Ripple Test Setup
7.7 Test Set-Up
The basic test set-up to measure parameters such as efficiency and
load regulation is shown in Figure 15. Things to note are that this
converter is non-isolated, as such the input and output share a common
ground. These grounds should be connected together via low
impedance ground plane in the application circuit. When testing a
converter on a bench set-up, ensure that -Vin and -Vo are connected
together via a low impedance short to ensure proper efficiency and load
regulation measurements are being made. When testing the Intronics’
S5 series under any transient conditions please ensure that the
transient response of the source is sufficient to power the equipment
under test. We can calculate the
•
Efficiency
• Load regulation and line regulation.
The value of efficiency is defined as:
η =
Vo × Io
× 100%
Vin × Iin
Where:
Vo is output voltage,
Io is output current,
Vin is input voltage,
Iin is input current.
The value of load regulation is defined as:
Load .reg =
VFL − VNL
× 100%
VNL
Page 13
S5 SERIES SIP or SMT
Applications
Version Application Notes
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
7.8 S5 Series Output Voltage Adjustment.
7.9 Output Ripple and Noise Measurement
The output Voltage of the S5 SERIES can be adjusted in the range
0.75V to 3.63V by connecting a single resistor on the motherboard
(shown as Rtrim) in Figure 17. When Trim resistor is not connected the
output voltage defaults to 0.75V
The test set-up for noise and ripple measurements is shown in Figure
18. a coaxial cable with a 50ohm termination was used to prevent
impedance mismatch reflections disturbing the noise readings at higher
frequencies.
+Vin
+Vin
+Vo
+Vo
S5 SERIES 05S33A
SIP/SMT05-
Trim
Common
Common
Figure 17. Trim-up Voltage Setup
21070
− 5110 )
Vo − 0.75
Rtrim-up is the external resistor in ohm,
Vo is the desired output voltage
To give an example of the above calculation, to set a voltage of 3.3Vdc,
Rtrim is given by:
Where:
21070
− 5110 )
Vo − 0.75
Rtrim = 3153 ohm
7.10 Output Capacitance
Intronics’ S5 series converters provide unconditional stability with or
without external capacitors. For good transient response low ESR
output capacitors should be located close to the point of load.
For high current applications point has already been made in layout
considerations for low resistance and low inductance tracks.
Output capacitors with its associated ESR values have an impact on
loop stability and bandwidth. Intronics’ converters are designed to work
with load capacitance up-to 3,000uF. It is recommended that any
additional capacitance, Maximum 3,000uF and low ESR, be connected
close to the point of load and outside the remote compensation point.
7.11 SMT Reflow Profile
An example of the SMT reflow profile is given in Figure 19.
Equipment used: SMD HOT AIR REFLOW HD-350SAR
Alloy: AMQ-M293TA or NC-SMQ92 IND-82088 SN63
For various output values various resistors are calculated and provided
in Table 3 for convenience.
Rtrim (Kohm)
Open
41.71
22.98
14.96
11.75
6.93
3.15
2.20
Table 3 – Trim Resistor Values
REFLOW PROFILE
240
200
TEMPERATURE (C)
Vo,set (V)
0.75
1.20
1.50
1.80
2.00
2.50
3.30
3.63
Common
Figure 18. Output Voltage Ripple and Noise Measurement Set-Up
The value of Rtrim-up defined as:
Rtrim = (
R-Load
Test Jack
R trim-up
Rtrim = (
1uF
Ceramic
R-Load
SIP/SMT05-05S33A
S5 SERIES
Common
10uF
Tant.
160
120
80
40
0
0
30
60
90
120 150 180 210 240
TIME (SECONDS)
Figure 19 SMT Reflow Profile
Page 14
S5 SERIES SIP or SMT
Version Application Notes
Applications
• Servers, Switches and Data Storage
• Wireless Communications
• Distributed Power Architecture
• Semiconductor Test Equipment
• Networking Gear
• Data Communications
• Telecommunications
• Industrial / Medical
8.2 SMT Tape and Reel Dimensions
8. Mechanical Outline Diagrams
The Tape Reel dimensions for the SMT module is shown in Figure 22.
8.1 S5 SERIES Mechanical Outline Diagrams
Dimensions are in millimeters and inches
Tolerance: x.xx ±0.02 in. (0.5mm) , x.xxx ±0.010 in. (0.25 mm) unless
otherwise noted
t
SIZE SIP05
0.90(22.9)
PIN CONNECTION
0.22(5.6)Max.
Pin
1 2 3
FUNCTION
1
+Output
2
Trim
0.400(10.16)
4 5
0.14(3.6)
0.025(0.64)
0.100(2.54)
0.025(0.64)
0.200(5.08)
0.700(17.78)
3
Common
4
+V Input
5
On/Off
0.19(4.7)
0.800(20.32)
Figure 20 S5-5S3.3T Mechanical Outline Diagram
BOTTOM VIEW OF BOARD
0.80
(20.3)
0.190
(4.83)
0.160
(4.06)
GND
0.35
(8.9)
0.160
(4.06)
TRIM
0.24
(6.09)
0.180
(4.06)
VOUT
0.062
(1.57)
0.062
(1.57)
Bo
Ko
P
0.340
(8.64)
0.450
(11.43)
VIN
W
Ao
ON/OFF
0.06 (1.5)
F
E
D
Surface Mount Contact 5 Places
0.090
0.05 (1.3)
(2.29)
Dimensions are in Inches (millimeters)
D1
Po
Tolerances :x.xx ¡ Ó0.02in.( x.x ¡ Ó0.5mm) , unless otherwise noted
x.xxx ¡ Ó0.010in. ( x.xx ¡ Ó0.25mm)
P2
t
Figure 21 S5-5S3.3T Mechanical Outline Diagram
Figure 22 – SMT Tape and Reel Dimensions
Page 15