S5 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical NON-ISOLATED DC-DC Converter S5-5S3.3T, S5-5S3.3 3.0-5.5Vin, 0.75- 3.63Vout, 5A APPLICATION NOTE Ver10 S5-5S3.3T (Suffix “T” Indicates Through-Hole Version) S5-5S3.3 Page 1 S5 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical Content 1. INTRODUCTION 2. MODELS 3. 5A SIP/SMT CONVERTER FEATURES 4. GENERAL DESCRIPTION 3 3 3 4.1 Electrical Description 3 3 4.2 Thermal Packaging and Physical Design. 4 5. MAIN FEATURES AND FUNCTIONS 5.1 Operating Temperature Range 4 4 5.2 Over-Temperature Protection (OTP) 4 5.3 Output Voltage Adjustment 4 5.4 Safe Operating Area (SOA) 4 5.5 Over Current Protection 4 5.6 Remote ON/OFF 4 5.7 UVLO (Under-Voltage Lockout) 5 6. SAFETY 5 5 6.1 Input Fusing and Safety Considerations. 7. APPLICATIONS 7.1 Layout Design Challenges. 5 5 7.2 Convection Requirements for Cooling 6 7.3 Thermal Considerations 6 7.4 Power De-Rating Curves 7 7.5 Efficiency vs Load Curves 11 7.6 Input Capacitance at the Power Module 13 7.7 Test Set-Up 13 7.8 S5 Series Output Voltage Adustment. 14 7.9 Output Ripple and Noise Measurement 14 7.10 Output Capacitance 14 7.11 SMT Reflow Profile 14 8. MECHANICAL OUTLINE DIAGRAMS 8.1 SIP/SMT05 Mechanical Outline Diagrams 15 15 8.2 SMT Tape and Reel Dimensions 15 Page 2 S5 SERIES SIP or SMT Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment Version Application Notes • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 1. Introduction 3. 5A SIP/SMT Converter Features This application note describes the features and functions of Intronics’ • High efficiency topology, typically 94% at 3.3Vdc S5 series of Non Isolated DC-DC Converters. These are highly efficient, • Industry standard footprint reliable and compact, high power density, single output DC/DC • Wide ambient temperature range, -40C to +85C converters. These “Point of Load” modules serve the needs specifically • Cost efficient open frame design of the fixed and mobile telecommunications and computing market, • Programmable output voltage via external resistor from 0.75 to employing economical distributed Power Architectures. The S5 series 3.63Vdc provide precisely regulated output voltage range from 0.75V to 3.63Vdc • No minimum load requirement (Stable at all loads) over a wide range of input voltage (Vi=3.0 – 5.5Vdc) and can operate • Remote ON/OFF over an ambient temperature range of –40℃ to +85℃. Ultra-high • Remote sense compensation efficiency operation is achieved through the use of synchronous • Fixed switching frequency rectification and drive control techniques. • Continuous short-circuit protection and over current protection The modules are fully protected against short circuit and over- • Over-temperature protection (OTP) temperature conditions. Intronics’ world class automated manufacturing • Monotonic Startup with pre-bias at the output. methods, together with an extensive testing and qualification program, • UL/IEC/EN60950 Certified. ensure that all S5 series converters are extremely reliable. 4. General Description 2. Models 4.1 Electrical Description A block diagram of the S5 Series converter is shown in Figure 1. The adjustable S5 series models are shown in table1. Extremely high efficiency power conversion is achieved through the use Model Input Voltage Output Voltage Output Current S5-5S3.3T 3.0 – 5.5VDC 0.75 – 3.63VDC 5A S5-5S3.3 3.0 – 5.5VDC 0.75 – 3.63VDC 5A 0.75V 1.2V 1.5V 1.8V 2.0V 2.5V 3.3V Input Current (mA) No Load Full Load 5A 25 5A 30 5A 30 5A 35 5A 35 5A 35 5A 35 0.949 1.412 1.724 2.022 2.222 2.217 3.511 buck converter. The control loop is optimized for unconditional stability, fast transient response and a very tight line and load regulation. In a typical pre-bias application the S5 series converters do not draw any 0.75 to 3.63vdc, using the TRIM pin with a external resistor. The The S5 SERIES efficiency and input current at 5.0Vin are shown in table2. Output Current powerful S5 series topology is based on a non-isolated synchronous reverse current at start-up. The output voltage can be adjusted from Table 1 – S5 Series Models Output Voltage of synchronous rectification and drive techniques. Essentially, the converter can be shut down via a remote ON/OFF input that is referenced to ground. This input is compatible with popular logic Efficiency typ. devices; a 'positive' logic input is supplied as standard. Positive logic 79% 85% 87% 89% 90% 92% 94% (or floating), and disabled if it is low. The converter is also protected implies that the converter is enabled if the remote ON/OFF input is high against over-temperature conditions. If the converter is overloaded or the ambient temperature gets too high, the converter will shut down to protect the unit. L1 Q1 +VIN +VO C1 Q2 D1 C2 Table 2 – S5 Series Efficiency and Input Current COM COM R1 PWM IC ON/OFF R trim ERR AMP TRIM R2 Figure 1. Electrical Block Diagram Page 3 S5 SERIES SIP or SMT Applications Version Application Notes • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 4.2 Thermal Packaging and Physical Design. 5.4 Safe Operating Area (SOA) The S5 series uses a multi-layer FR4 PCB construction. All surface Figure 2 provides a graphical representation of the Safe Operating Area mount power components are placed on one side of the PCB, and all (SOA) of the converter. This representation assumes ambient low-power control components are placed on the other side. Thus, the operating conditions such as airflow are met as per thermal guidelines Heat dissipation of the power components is optimized, ensuring that provided in Sections 7.2 and 7.3. control components are not thermally stressed. The converter is an Vo open-frame product and has no case or case pin. The open-frame design has several advantages over encapsulated closed devices. Among these advantages are: • Vo,nom Efficient Thermal Management: the heat is removed from the VOLTAGE (V) heat generating components without heating more sensitive, small signal control components. • Environmental: Lead free open-frame converters are more easily re-cycled. • Cost Efficient: No encapsulation. Cost efficient open-frame Safe Operating Area construction. • Reliable: Efficient cooling provided by open frame construction offers high reliability and easy diagnostics. Io,max Io,CL Io CURRENT (A) 5. Main Features and Functions 5.1 Operating Temperature Range Figure 2. Maximum Output Current Safe Operating Area Intronics’ S5 series converters highly efficient converter design has resulted in its ability to operate over a wide ambient temperature 5.5 Over Current Protection environment ( -40℃ to 85℃). Due consideration must be given to the All different voltage models have a full continuous short-circuit de-rating curves when ascertaining maximum power that can be drawn protection. The unit will auto recover once the short circuit is removed. from the converter. The maximum power drawn is influenced by a To provide protection in a fault condition, the unit is equipped with number of factors, such as: internal over-current protection. The unit operates normally once the fault condition is removed. The power module will supply up to 150% of • Input voltage range. • rated current. In the event of an over current converter will go into a Output load current. • hiccup mode protection. Air velocity (forced or natural convection). • Mounting orientation of converter PCB with respect to the Airflow. • 5.6 Remote ON/OFF Motherboard PCB design, especially ground and power planes. The remote ON/OFF input feature of the converter allows external These can be effective heat sinks for the converter. circuitry to turn the converter ON or OFF. Active-high remote ON/OFF 5.2 Over-Temperature Protection (OTP) is available as standard. The S5 series converters are turned on if the remote ON/OFF pin is high, or left open or floating. Setting the pin low The S5 Series converters are equipped with non-latching over- will turn the converter ‘Off’. The signal level of the remote on/off input is temperature protection. A temperature sensor monitors the temperature defined with respect to ground. If not using the remote on/off pin, leave of the hot spot (typically, top switch). If the temperature exceeds a the pin open (module will be on). The part number suffix “N” is Negative threshold of 120°C (typical) the converter will shut down, disabling the remote ON/OFF version. The unit is guaranteed OFF over the full output. When the temperature has decreased the converter will temperature range if this voltage level exceeds 2.8Vdc. The converters automatically restart. are turned on If the on/off pin input is low or left open. The The over-temperature condition can be induced by a variety of reasons recommended SIP/SMT remote on/off drive circuit as shown as figure such as external overload condition or a system fan failure. 3, 4. 5.3 Output Voltage Adjustment Section 7.8 describes in detail as to how to trim the output voltage with respect to its set point. The output voltage on all models is trimmable in the range 0.75 – 3.63Vdc. Page 4 S5 SERIES SIP or SMT Applications Version Application Notes +Vin +Vo • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7. Applications 7.1 Layout Design Challenges. ON/OFF Control Remote ON/OFF In optimizing thermal design the PCB is utilized as a heat sink. Also S5 Q1 some heat is transferred from the SIP/SMT module to the main board SIP/SMT Series through connecting pins. The system designer or the end user must ensure that other components and metal in the vicinity of the Common Common S5 series meet the spacing requirements to which the system is approved. Figure 3. Positive Remote ON/OFF Input Drive Circuit Low resistance and low inductance PCB layout traces are the norm and should be used where possible. Due consideration must also be given +Vin +Vo S5 Q1 to proper low impedance tracks between power module, input and output grounds. The recommended SIP/SMT footprint as shown as figure 5, 6. SIP/SMT Series ON/OFF Control 1.1mm PLATED THROUGH HOLE 1.6mm PAD SIZE Remote ON/OFF LAYOUT PATTERN TOP VIEW 0.20(5.1) Common 0.24(6.1) Common All Dimmension In Inches(mm) Tolerance : .XX=¡ 0 Ó.02 ( ¡ Ó0.5 ) .XXX=¡ 0 Ó.010 ( ¡ Ó0.25 ) Figure 4. Negative Remote ON/OFF Input Drive Circuit Figure 5. Recommended SIP Footprint 5.7 UVLO (Under-Voltage Lockout) The voltage on the Vcc pin determines the start of the operation of the Recommended Pad Layout Converter. When the input Vcc rises and exceeds about 2.0V the Dimensions are in Inches ( millimetes ) converter initiates a soft start. The UVLO function in the converter has a 0.180 (4.57) hysteresis (about 100mV) built in to provide noise immunity at start-up. 6. Safety 0.160 (4.06) VOUT 6.1 Input Fusing and Safety Considerations. ON/OFF 1.The power supply shall be approved by a nationally recognized EN60950 (International) 2. CB Certificate from an internationally recognized test house in accordance with EN 60950. GND 0.350 (8.89) Agency Approvals: The power Supply shall be submitted to and rd TRIM 0.190 (4.83) 0.340 (8.64) receive formal approval from the following test agencies. testing laboratory to UL/CSA 60950 3 Edition (North America) and 0.160 (4.06) 0.06 (1.5) 0.05 (1.3) 0.010 (0.25) VIN 0.690 (17.53) PAD SIZE MIN : 0.120" x 0.095 " MAX : 0.135" x 0.110 " Figure 6. Recommended SMT Footprint (Top View) The S5 series converters do not have an internal fuse. However, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 10A. Page 5 S5 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.2 Convection Requirements for Cooling To predict the approximate cooling needed for the module, refer to the Power De-rating curves in Figures 10 to 13 . These de-rating curves are approximations of the ambient temperatures and airflows required to keep the power module temperature below its maximum rating. Once the module is assembled in the actual system, the module’s temperature should be checked as shown in Figure 7 to ensure it does not exceed 110°C. Proper cooling can be verified by measuring the power module’s temperature at Q1-pin 6 as shown in Figure 8,9. W ind Tunnel 25.4(1.0) Bakelite Figure 9. Temperature Measurement Location for SMT Power Module 76.2(3.0) Thermocuple Location for measuring ambient temperature and airflow 12.7(0.5) Air flow 7.3 Thermal Considerations The power module operates in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding environment. The thermal data presented is based on measurements taken in a set-up as shown in Figure7. Figures 10 to 13 represent the test data. Note that the airflow is parallel to the long axis of the module as shown in Figure7 for the SIP/SMT. The temperature at either location should not exceed 110 °C. The output power of the module should not exceed the rated power for the module (VO, set x IO, max). The SMT Version of S5 Family thermal data presented is based on measurements taken in a wind tunnel. The test setup shown in Figure 7 and EUT need to solder on 33mm x 40.38mm(1.300'' x 1.59'') test pcb. Note that airflow is parallel to the long axis of the module as shown in Fig7. Note : Dimensions are in millimeters and (inches) Figure 7. Thermal Test Setup Figure 8. Temperature Measurement Location for SIP Page 6 S5 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.4 Power De-Rating Curves SIP05-05S33A S5-5S3.3T (Vo=3.3V) Derating Curve 5.0 4.0 3.0 0LFM 100LFM 2.0 200LFM 1.0 6.0 Output Current(A) Output Current(A) 6.0 0 4.0 3.0 100LFM 200LFM 1.0 0 SIPS5-5S3.3T 05-05S33A (Vo=1.5V) Derating Curve SIP05-05S33A S5-5S3.3T (Vo=1.8V) Derating Curve 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 6.0 Output Current(A) 5.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 10b.Typical Power De-rating for 5.0V IN 2.5Vout 0.0 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure10c.Typical Power De-rating for 5.0V IN 1.8Vout 0 SIP05-05S33A S5-5S3.3T (Vo=0.75V) Derating Curve 6.0 5.0 5.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 Output Current(A) 6.0 4.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 10d.Typical Power De-rating for 5.0V IN 1.5Vout SIP05-05S33A S5-5S3.3T (Vo=1.2V) Derating Curve Output Current(A) 0LFM 2.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure10a.Typical Power De-rating for 5.0V IN 3.3Vout Output Current(A) 5.0 0.0 0.0 6.0 SIPS5-5S3.3T 05-05S33A (Vo=2.5V) Derating Curve 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure10e.Typical Power De-rating for 5.0V IN 1.2Vout 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 10f.Typical Power De-rating for 5.0V IN 0.75Vout Page 7 S5 SERIES SIP or SMT Version Application Notes SIP05-05S33A S5-5S3.3T (Vo=2.5V) Derating Curve 5.0 4.0 3.0 0LFM 100LFM 2.0 200LFM 1.0 6.0 Output Current(A) Output Current(A) 6.0 0.0 SIPS5-5S3.3T 05-05S33A (Vo=2.0V) Derating Curve 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure11a.Typical Power De-rating for 3.3V IN 2.5Vout 0 SIPS5-5S3.3T 05-05S33A (Vo=1.5V) Derating Curve 6.0 5.0 5.0 3.0 0LFM 2.0 100LFM 1.0 200LFM Output Current(A) 6.0 4.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 11b.Typical Power De-rating for 3.3V IN 2.0Vout SIP05-05S33A S5-5S3.3T (Vo=1.8V) Derating Curve Output Current(A) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 0.0 0 0.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure11c.Typical Power De-rating for 3.3V IN 1.8Vout 0 SIP05-05S33A S5-5S3.3T (Vo=0.75V) Derating Curve 6.0 5.0 5.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 Output Current(A) 6.0 4.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 11d.Typical Power De-rating for 3.3V IN 1.5Vout SIP05-05S33A S5-5S3.3T (Vo=1.2V) Derating Curve Output Current(A) Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure11e.Typical Power De-rating for 3.3V IN 1.2Vout 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 11f.Typical Power De-rating for 3.3V IN 0.75Vout Page 8 S5 SERIES SIP or SMT Version Application Notes SMT05-05S33A S5-5S3.3 (Vo=3.3V) Derating Curve 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 6.0 Output Current(A) Output Current(A) 6.0 0.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0 SMT05-05S33A S5-5S3.3 (Vo=1.5V) Derating Curve 6.0 5.0 5.0 3.0 0LFM 2.0 100LFM 1.0 200LFM Output Current(A) 6.0 4.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure12b.Typical Power De-rating for 5V IN 2.5Vout SMT05-05S33A S5-5S3.3 (Vo=1.8V) Derating Curve Output Current(A) SMT05-05S33A S5-5S3.3 (Vo=2.5V) Derating Curve 5.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure12a.Typical Power De-rating for 5V IN 3.3Vout 0.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure12c.Typical Power De-rating for 5V IN 1.8Vout 0 SMTS5-5S3.3 05-05S33A (Vo=0.75V) Derating Curve SMT05-05S33A S5-5S3.3 (Vo=1.2V) Derating Curve 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 12d.Typical Power De-rating for 5V IN 1.5Vout 6.0 Output Current(A) Output Current(A) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 0.0 0 6.0 Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure12e.Typical Power De-rating for 5V IN 1.2Vout 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 12f.Typical Power De-rating for 5V IN 0.75Vout Page 9 S5 SERIES SIP or SMT Version Application Notes SMT05-05S33A S5-5S3.3 (Vo=2.5V) Derating Curve 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 6.0 Output Current(A) Output Current(A) 6.0 0.0 SMT05-05S33A S5-5S3.3 (Vo=2.0V) Derating Curve 5.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure13a.Typical Power De-rating for 3.3V IN 2.5Vout 0 SMT05-05S33A S5-5S3.3 (Vo=1.5V) Derating Curve 6.0 5.0 5.0 3.0 0LFM 2.0 100LFM 1.0 200LFM Output Current(A) 6.0 4.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 13b.Typical Power De-rating for 3.3V IN 2.0Vout SMT05-05S33A S5-5S3.3 (Vo=1.8V) Derating Curve Output Current(A) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 0.0 0 0.0 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure13c.Typical Power De-rating for 3.3V IN 1.8Vout 0 6.0 5.0 5.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 Output Current(A) 6.0 4.0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 13d.Typical Power De-rating for 3.3V IN 1.5Vout SMT05-05S33A S5-5S3.3 (Vo=1.2V) Derating Curve Output Current(A) Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment SMTS5-5S3.3 05-05S33A (Vo=0.75V) Derating Curve 4.0 3.0 0LFM 2.0 100LFM 1.0 200LFM 0.0 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure13e.Typical Power De-rating for 3.3V IN 1.2Vout 0 10 20 30 40 50 60 70 80 90 100 o Ambient Temperature( C) Figure 13f.Typical Power De-rating for 3.3V IN 0.75Vout Page 10 S5 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.5 Efficiency vs Load Curves SIP05-05S33A S5-5S3.3T Vo=3.3V (Eff Vs Io) SIP05-05S33A S5-5S3.3T Vo=2.5V (Eff Vs Io) 95% 95% Efficincy (%) 100% Efficincy (%) 100% 90% 85% 4.5V 5.0V 5.5V 80% 75% 90% 85% 3.0V 5.0V 5.5V 80% 75% 70% 70% 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 Current Load (A) SIP0505S33A Vo=1.8V (Eff Vs Io) S5-5S3.3T 95% Efficincy (%) 95% Efficincy (%) 2.5 3 3.5 4 4.5 5 SIP05-05S33A S5-5S3.3T Vo=1.5V (Eff Vs Io) 100% 90% 85% 3.0V 5.0V 5.5V 75% 2 Current Load (A) 100% 80% 1.5 90% 85% 3.0V 5.0V 5.5V 80% 75% 70% 70% 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 Current Load (A) 1.5 2 2.5 3 3.5 4 4.5 5 Current Load (A) SIP05-05S33A S5-5S3.3T Vo=1.2V (Eff Vs Io) SIP05-05S33A S5-5S3.3T Vo=0.75V (Eff Vs Io) 100% 100% 95% 95% Efficincy (%) Efficincy (%) 90% 90% 85% 3.0V 5.0V 5.5V 80% 75% 85% 80% 75% 3.0V 5.0V 5.5V 70% 65% 70% 60% 0 0.5 1 1.5 2 2.5 3 3.5 Current Load (A) 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Current Load (A) Page 11 S5 SERIES SIP or SMT Version Application Notes SMT05-05S33A S5-5S3.3 Vo=3.3V (Eff Vs Io) 95% Efficincy (%) 95% Efficincy (%) 100% 90% 85% 4.5V 5.0V 5.5V 75% 90% 85% 3.0V 5.0V 5.5V 80% 75% 70% 70% 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 Current Load (A) SMT05-05S33 S5-5S3.3 A Vo=1.8V (Eff Vs Io) 95% Efficincy (%) 95% 90% 85% 3.0V 5.0V 5.5V 75% 2 2.5 3 3.5 4 4.5 5 SMT0505S33A Vo=1.5V (Eff Vs Io) S5-5S3.3 100% 80% 1.5 Current Load (A) 100% Efficincy (%) • Networking Gear • Data Communications • Telecommunications • Industrial / Medical SMT05-05S33A Vo=2.5V (Eff Vs Io) S5-5S3.3 100% 80% Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment 90% 85% 3.0V 5.0V 5.5V 80% 75% 70% 70% 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 Current Load (A) 1.5 2 2.5 3 3.5 4 4.5 5 Current Load (A) SMT0505S33A Vo=1.2V (Eff Vs Io) S5-5S3.3 SMT05-05S33A Vo=0.75V (Eff Vs Io) S5-5S3.3 100% 100% 95% 95% Efficincy (%) Efficincy (%) 90% 90% 85% 3.0V 5.0V 5.5V 80% 75% 85% 80% 75% 3.0V 5.0V 5.5V 70% 65% 70% 60% 0 0.5 1 1.5 2 2.5 3 3.5 Current Load (A) 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Current Load (A) Page 12 S5 SERIES SIP or SMT Version Application Notes 7.6 Input Capacitance at the Power Module The SIP/SMT converters must be connected to a low AC source impedance. To avoid problems with loop stability source inductance should be low. Also, the input capacitors should be placed close to the converter input pins to de-couple distribution inductance. However, the external input capacitors are chosen for suitable ripple handling capability. Low ESR polymers are a good choice. They have high capacitance, high ripple rating and low ESR (typical <100mohm). Electrolytic capacitors should be avoided. Circuit as shown in Figure 14 represents typical measurement methods for ripple current. Input reflected-ripple current is measured with a simulated source Inductance of 1uH. Current is measured at the input of the module. Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical VFL is the output voltage at full load VNL is the output voltage at no load Where: The value of line regulation is defined as: Line.reg = VHL − VLL ×100% VLL Where: VHL is the output voltage of maximum input voltage at full load. VLL is the output voltage of minimum input voltage at full load. Current Meter A Power Supply +Vin A +Vo +Sense + V 100uF Voltage Meter SIP/SMT Series V Load To Oscilloscope Common Common L1 +Vin 1uH Power + 2*100uF Tantalum Supply Figure 15. S5 Series Test Setup SIP/SMT05 220uF ESR<0.1ohm Common Figure 14. Input Reflected-Ripple Test Setup 7.7 Test Set-Up The basic test set-up to measure parameters such as efficiency and load regulation is shown in Figure 15. Things to note are that this converter is non-isolated, as such the input and output share a common ground. These grounds should be connected together via low impedance ground plane in the application circuit. When testing a converter on a bench set-up, ensure that -Vin and -Vo are connected together via a low impedance short to ensure proper efficiency and load regulation measurements are being made. When testing the Intronics’ S5 series under any transient conditions please ensure that the transient response of the source is sufficient to power the equipment under test. We can calculate the • Efficiency • Load regulation and line regulation. The value of efficiency is defined as: η = Vo × Io × 100% Vin × Iin Where: Vo is output voltage, Io is output current, Vin is input voltage, Iin is input current. The value of load regulation is defined as: Load .reg = VFL − VNL × 100% VNL Page 13 S5 SERIES SIP or SMT Applications Version Application Notes • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 7.8 S5 Series Output Voltage Adjustment. 7.9 Output Ripple and Noise Measurement The output Voltage of the S5 SERIES can be adjusted in the range 0.75V to 3.63V by connecting a single resistor on the motherboard (shown as Rtrim) in Figure 17. When Trim resistor is not connected the output voltage defaults to 0.75V The test set-up for noise and ripple measurements is shown in Figure 18. a coaxial cable with a 50ohm termination was used to prevent impedance mismatch reflections disturbing the noise readings at higher frequencies. +Vin +Vin +Vo +Vo S5 SERIES 05S33A SIP/SMT05- Trim Common Common Figure 17. Trim-up Voltage Setup 21070 − 5110 ) Vo − 0.75 Rtrim-up is the external resistor in ohm, Vo is the desired output voltage To give an example of the above calculation, to set a voltage of 3.3Vdc, Rtrim is given by: Where: 21070 − 5110 ) Vo − 0.75 Rtrim = 3153 ohm 7.10 Output Capacitance Intronics’ S5 series converters provide unconditional stability with or without external capacitors. For good transient response low ESR output capacitors should be located close to the point of load. For high current applications point has already been made in layout considerations for low resistance and low inductance tracks. Output capacitors with its associated ESR values have an impact on loop stability and bandwidth. Intronics’ converters are designed to work with load capacitance up-to 3,000uF. It is recommended that any additional capacitance, Maximum 3,000uF and low ESR, be connected close to the point of load and outside the remote compensation point. 7.11 SMT Reflow Profile An example of the SMT reflow profile is given in Figure 19. Equipment used: SMD HOT AIR REFLOW HD-350SAR Alloy: AMQ-M293TA or NC-SMQ92 IND-82088 SN63 For various output values various resistors are calculated and provided in Table 3 for convenience. Rtrim (Kohm) Open 41.71 22.98 14.96 11.75 6.93 3.15 2.20 Table 3 – Trim Resistor Values REFLOW PROFILE 240 200 TEMPERATURE (C) Vo,set (V) 0.75 1.20 1.50 1.80 2.00 2.50 3.30 3.63 Common Figure 18. Output Voltage Ripple and Noise Measurement Set-Up The value of Rtrim-up defined as: Rtrim = ( R-Load Test Jack R trim-up Rtrim = ( 1uF Ceramic R-Load SIP/SMT05-05S33A S5 SERIES Common 10uF Tant. 160 120 80 40 0 0 30 60 90 120 150 180 210 240 TIME (SECONDS) Figure 19 SMT Reflow Profile Page 14 S5 SERIES SIP or SMT Version Application Notes Applications • Servers, Switches and Data Storage • Wireless Communications • Distributed Power Architecture • Semiconductor Test Equipment • Networking Gear • Data Communications • Telecommunications • Industrial / Medical 8.2 SMT Tape and Reel Dimensions 8. Mechanical Outline Diagrams The Tape Reel dimensions for the SMT module is shown in Figure 22. 8.1 S5 SERIES Mechanical Outline Diagrams Dimensions are in millimeters and inches Tolerance: x.xx ±0.02 in. (0.5mm) , x.xxx ±0.010 in. (0.25 mm) unless otherwise noted t SIZE SIP05 0.90(22.9) PIN CONNECTION 0.22(5.6)Max. Pin 1 2 3 FUNCTION 1 +Output 2 Trim 0.400(10.16) 4 5 0.14(3.6) 0.025(0.64) 0.100(2.54) 0.025(0.64) 0.200(5.08) 0.700(17.78) 3 Common 4 +V Input 5 On/Off 0.19(4.7) 0.800(20.32) Figure 20 S5-5S3.3T Mechanical Outline Diagram BOTTOM VIEW OF BOARD 0.80 (20.3) 0.190 (4.83) 0.160 (4.06) GND 0.35 (8.9) 0.160 (4.06) TRIM 0.24 (6.09) 0.180 (4.06) VOUT 0.062 (1.57) 0.062 (1.57) Bo Ko P 0.340 (8.64) 0.450 (11.43) VIN W Ao ON/OFF 0.06 (1.5) F E D Surface Mount Contact 5 Places 0.090 0.05 (1.3) (2.29) Dimensions are in Inches (millimeters) D1 Po Tolerances :x.xx ¡ Ó0.02in.( x.x ¡ Ó0.5mm) , unless otherwise noted x.xxx ¡ Ó0.010in. ( x.xx ¡ Ó0.25mm) P2 t Figure 21 S5-5S3.3T Mechanical Outline Diagram Figure 22 – SMT Tape and Reel Dimensions Page 15