SM-BGA-9006 Dwg.mcd - Ironwood Electronics

Top View
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
21.225mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
21.225mm
4
Side View
(Section AA)
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Recommended Torque = 3 in lb
5
Elastomer: Embedded Silver Ball Matrix
Thickness = 0.5969mm - 0.6604mm
6
Ball Guide: Kapton polyimide.
7
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
8
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
9
Nylon washer: 1.73mm ID; 4.78mm OD, 0.64mm thick
4
1
3
Assembled
8.25mm +
IC thickness
8
2
6
7
5
9
Customer's
BGA IC
SM-BGA-9006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Customer's Target PCB
Status: Released
Scale: NA
Rev: A
Drawing: E. Smolentseva
Date: 10/10/11
File: SM-BGA-9006 Dwg.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 3
Recommended PCB Layout
Top View
Note: BGA pattern is not symmetrical
with respect to the mounting holes.
1.25mm±0.13mm (x4)
Orientation Mark
2.54mm
1.25mm±0.13mm (x4)
14.40mm
0.80mm typ.
2.54mm
2.16mm(x4)
Ø 0.85mm±0.03mm (x2)
non plated Alignment Hole
21.225mm±0.125mm(x4)
Socket size
14.40mm
Ø 0.360mmxPAD
5.08mm
Ø 1.61mm±0.05mm (x4)
non plated Mounting Hole
18.725mm (x4)
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SM-BGA-9006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Status: Released
Scale: NA
Rev: A
Drawing: E. Smolentseva
Date: 10/10/11
File: SM-BGA-9006 Dwg.mcd
Modified:
BGA IC Size
Pitch
Array
16x16mm
0.8mm
19x19
PAGE 2 of 3
Compatible BGA Spec
SIDE VIEW
TOP VIEW
DETAIL
D
X
Y
5
DETAIL
0.20 Z
A
E
A1
Z
0.12 Z
4
0.20
e
3
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances per ASME
Y14.5M-1994.
3
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5
Parallelism measurement shall exclude any
effect of mark on top surface of package.
Øb
Ø0.15 Z X Y
Ø0.08
DIM
1.
MIN
MAX
1.70
A
A1
0.25
0.35
b
0.38
0.48
D
15.85
16.15
E
15.85
16.15
e
0.8 BSC
Array: 19x19
BOTTOM VIEW
SM-BGA-9006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Status: Released
Scale: NA
Rev: A
Drawing: E. Smolentseva
Date: 10/10/11
File: SM-BGA-9006 Dwg.mcd
Modified:
PAGE 3 of 3