Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 19.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 19.225mm Side View (Section AA) Recommended torque = 1 in lbs. 4 4 1 5 9 3 Assembled 8.25mm + IC thickness Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 2 8 7 6 10 5 Customer's BGA IC SG-BGA-6112 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 11 Customer's Target PCB Status: Released Scale: - Rev: B Drawing: H. Hansen Date: 4/26/04 File: SG-BGA-6112 Dwg Modified: 6/2/09 All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 M R 1 2 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Note: Maximum BGA pattern shown. Please adjust pattern according to individual requirements. Orientation Mark 1.25mm±0.125mm(x4) 2.34mm* 1.25mm±0.125mm(x4) Socket Body Size 0.8mm typ. 2.54mm 1.96mm Ø 0.85mm±0.025mm (x2) Alignment Hole Ø 0.36mmPAD 5.08mm Ø 1.61mm±0.05mm(x4) Mounting Hole 11.95mm 12.8mm 16.725mm(x4) 19.225mm±0.125mm(x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6112 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 3:1 Rev: B Drawing: H. Hansen Date: 4/26/04 File: SG-BGA-6112 Dwg Modified: 6/2/09 PAGE 2 of 3 Compatible BGA Spec TOP VIEW SIDE VIEW X DETAIL D Y DETAIL 5 0.10 Z Z 0.12 Z A E A1 4 0.15 Dimensions are in millimeters. 2. Interpret dimensions and toleraces per ASME Y14.5M-1994. e 3 Øb Ø0.15 Z X Y Ø0.08 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 BOTTOM VIEW SG-BGA-6112 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com DIM 1. Parallelism measurement shall exclude any effect of mark on top surface of package. MIN MAX 1.16 A A1 0.3 0.4 b 0.4 0.5 D 14.00 BSC E 14.00 BSC e 0.80 BSC Array 17x17 Status: Released Scale: - Rev: B Drawing: H. Hansen Date: 4/26/04 File: SG-BGA-6112 Dwg Modified: 6/2/09 PAGE 3 of 3