GHz BGA SMT Socket Features High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer 34.325mm Easily removable swivel socket lid A A Top View 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 34.325mm Recommended torque = 8.5 in lbs. 4 1 5 9 3 Assembled 8.25mm + IC thickness 2 8 7 Side View (Section AA) 10 6 Customer's BGA IC 4 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 5 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. SMT Adpater: Ironwood Part number3.125mm thickness. (not included) Socket is used with Ironwood's SMT adapter - (sold sepately) SG-BGA-6364 Drawing © 2012 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: NA Rev: A Drawing: V. Panavala Date: 8/29/2012 File: SG-BGA-6364 Dwg.mcd Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View: IF USED WITHOUT SMT ADAPTER *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm(x4) Orientation Mark 2.50mm 2.50mm 1.25mm±0.13mm(x4) 2.738mm* 1.00mm typ. 2.540mm 2.363mm Socket Body Size Ø 0.850mm±0.025mm (x2) Ø 0.51mmPAD 32.225mm±0.125mm (x4) Socket size Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 5.080mm Ø 1.61mm±0.05mm (x8) 14.8625mm (x8) Target PCB Recommendations Total thickness: 3.175mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6364 Drawing © 2012 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Mounting Hole 29.725mm(x4) 34.725mm (x4) SMT adapter outline Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 2:1 Rev: A Drawing: V. Panavala Date: 8/29/2012 File: SG-BGA-6364 Dwg.mcd Modified: PAGE 2 of 3 Compatible BGA Spec D X DETAIL Y e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 TOP VIEW DETAIL SIDE VIEW 5 0.25 Z Z 4 0.2 Z DIM 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A A1 BOTTOM VIEW MIN MAX A A1 3.5 0.4 0.6 b 0.7 D 27.0 BSC E 27.0 BSC e 1.00 BSC Array 26 x 26 SG-BGA-6364 Drawing © 2012 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: NA Rev: A Drawing: V. Panavala Date: 8/29/2012 File: SG-BGA-6364 Dwg.mcd Modified: PAGE 3 of 3