GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 12 IC Guide: Torlon 13 IC Guide Spacer: Kapton A Top View 15.225mm Recommended torque = 0.38 in lbs. (6 in oz.) 4 1 9 3 Assembled 8.25mm + IC thickness 2 12 8 13 Side View (Section AA) 7 11 10 6 Customer's BGA IC SG-BGA-6134 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 5 Customer's Target PCB Status: Released Scale: - Rev: D Drawing: E Smolentseva Date: 9/8/04 File: SG-BGA-6134 Dwg.mcd Modified: 04/29/15, DH All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 0.8mm typ. 3.94mm 2.54mm 3.56mm 0mm (x2) -0.025mm Alignment Hole 15.225mm±0.125mm sqr. Socket size Ø 0.85mm 5.08mm Ø 0.43mm PAD 1.25mm±0.125mm 1.25mm±0.125mm 0mm (x4) -0.025mm Mounting Hole 12.725mm±0.125mm (x4) Ø 1.61mm Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-6134 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Compatible BGA Spec. Status: Released Scale: 4:1 Rev: D Drawing: E Smolentseva Date: 9/8/04 File: SG-BGA-6134 Dwg.mcd Modified: 04/29/15, DH PAGE 2 of 3 X Y D e E Øb Ø0.15 X Y Ø0.08 Bottom View Array: 8 x 8 Top View A1 0.10 Z 1. Dimensions are in millimeters. 2. Interpret dimensions and toleraces per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A Z 0.10 Z Side View SG-BGA-6134 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: - DIM MIN MAX 1.5 A A1 0.31 0.41 b 0.45 D 7.0 BSC E 7.0 BSC e 0.8 BSC Rev: D Drawing: E Smolentseva Date: 9/8/04 File: SG-BGA-6134 Dwg.mcd Modified: 04/29/15, DH PAGE 3 of 3