GHz BGA Socket - Direct mount, solderless 45mm Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45mm Ball guide prevents over compression of elastomer Heat sink lid for power dissipation 1 A Side View (Section AA) A 2 Ela stomer: 4 0 micron dia go ld plated brass filaments ar ranged symmetrically in a silicone rub ber (63.5 degre e a ngle). Thickn ess = 0.75mm. 4 Ela stomer Guid e: Cirlex o r e quiva lent. Thickn ess = 0.75mm. 5 Bal l Gu ide: K apton polyimide. Thickn ess = 0.25mm. 6 Socket ba se screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 9.525 mm long . 7 Socket lid screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 4.76mm long. 8 Backing Plate: B lack ano dize d 6061 Alu min um. Thickn ess = 6.35mm. 9 Insulation Plate: FR4/G10, Th ickness = 1 .59 mm. 1 Max Height 23mm 2 6 10 BGA IC 5 Socket ba se : Black a nodized 606 1 A luminum. Thickn ess = 5mm. 3 20 watt heatsink 7 Heatsi nk Lid : Black an odized 606 1 A luminum. Thickn ess = 16mm. Target PCB 10 IC Frame: FR4/G 10 9 4 8 3 SG-BGA-6137 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 1:0.7 Rev: A Drawing: H. Hansen Date: 12/2/04 File: S G-BGA -6137 Dwg Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 5 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm(x4) 1mm typ. 4.24mm* 1.25mm±0.13mm(x4) 2.54mm Orientation Mark 3.86mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 45.225mm±0.125mm(x4) Socket size Ø 0.51mm PAD 2.5mm±0.13mm 5.08mm 21.363mm(x8) Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Ø 1.61mm±0.05mm(x8) Non plated mounting hole 2.5mm±0.13mm 47.725mm sqr. Backing plate size NOTE: Steel backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-6137 Drawing Status: Released © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Drawing: H. Hansen Date: 12/2/04 File: S G-BGA -6137 Dwg Modified: Scale: 2:1 Rev: A PAGE 2 of 5 Compatible BGA Spec DETAIL Y X D e E 3 TOP VIEW Øb Ø0.10 Z Ø0.30 Z X Y BOTTOM VIEW SIDE VIEW 0.20 DIM 5 DETAIL 1. Dimensions are in mil lime te rs. 2. Inte rpret dimensions and to leraces p er AS ME Y1 4.5 M-1 994. 4 SG-BGA-6137 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 2.36 A1 0.6 0.4 Dimension b is measure d a t th e maximum solde r b all d iameter, pa rallel to d atum pla me Z. b D 37.50 BSC 4 Datum Z (se atin g p lane) is d efined by the sp herical cro wn s of the solder ba lls. E 37.50 BSC e 1.0 BSC 5 Par allelism mea su rement shal l exclude any effe ct o f mark o n top surface of package. 3 A Z MAX A 0.15 Z A1 MIN 0.15 Z Status: Released Scale: - 0.7 Array: 36x36 Rev: A Drawing: H. Hansen Date: 12/2/04 File: S G-BGA -6137 Dwg Modified: PAGE 3 of 5 2.5mm typ 2.5mm typ Top View 21.3625mm±0.025mm (x8) 47.725mm 5mm Ø 1.61mm ±0.05mm (x8) 8.03mm 10mm sqr. 22mm Note: Backing plate holes are tapped to accept 0-80 screws. 47.725mm 2.54mm Side View Insulation Plate 6.35mm Backing Plate Description: Insulation Plate and Backing Plate SG-BGA-6137 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: H. Hansen Date: 12/2/04 File: S G-BGA -6137 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 5 Socket (direct mount - hardware) User Instructions Tooling holes have to be designed into the target PCB for this version of the GHz BGA socket Socket Lid Screw 1. Install the socket base assembly on the target PCB with the socket base screws (0.5 in-lb torque per screw). Check orientation of the socket with respect to the target PCB. Place insulation plate in between target PCB and backing plate. Socket base screws will thread into the backing plate. 2. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation on target PCB is critical. Place IC frame on top of the BGA package. Socket Lid 3. Install the socket lid on to the socket base assembly using socket lid screws. 4. Apply 5 in-oz torque per screw in gradual increments. Socket Base Screw IC Frame BGA Package Socket Base Socket Base Assembly Dowel pin Angle wire elastomer Target PCB with SMT pads Insulation Plate Backing Plate © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PA UL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com PAGE 5 of 5