GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 24.225mm Recommended torque = 3 in lbs. Side View (Section AA) 1 Socket Li d: Bla ck a nodized Aluminu m. Thickn ess = 2.5mm. 2 Socket ba se : Black a nodized Aluminum. Thickn ess = 6.5mm. 3 Compression Plate: B lack ano dize d Alu min um. Thickn ess = 2.5mm. 4 Compression screw: Clear an odized Aluminu m. Thickn ess = 5mm, Hex socke t = 5mm. 5 Ela stomer: 4 0 micron dia go ld plated brass filaments ar ranged symmetrically in a silicone rub ber (63.5 degre e a ngle). Thickn ess = 0.75mm. 6 Ela stomer Guid e: Non-clad FR4 . Thickn ess = 0.725mm. 7 Bal l Gu ide: K apton polyimide. 8 Socket ba se screw: Socket hea d cap , alloy steel with bla ck o xid e finish, 0-80 fine th read , 12 .7mm long. 9 Socket lid screw: Shou lder screw, 1 8-8 SS, 0 -80 fine thread . 10 Insulation Plate: FR4 /G1 0, 1.59mm th ick. 11 Backing Plate: A nodized Alu min um 6 .35 mm thick. 4 1 9 3 Assembled 9.75mm + IC thickness 2 8 7 10 6 11 Customer's BGA IC 5 Customer's Target PCB SG-BGA-6144 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 1/25/05 File: SG-BGA-6144 Dwg Modified: 7/17/09, AE Scale: - Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View Orientation Mark 1mm typ. Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.125mm(x4) 2.74mm 1.25mm±0.125mm(x4) 2.36mm 2.54mm Ø 0.85mm±0.025mm (x2) Alignment Hole Socket Body Size 24.225mm Ø 0.51mmPAD 5.08mm Ø 1.61mm±0.05mm (x4) Mounting Hole Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 21.725mm(x4) 24.225mm (x4) 26.725mm sq. backing plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-6144 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 1/25/05 File: SG-BGA-6144 Dwg Modified: 7/17/09, AE Scale: - Rev: C PAGE 2 of 4 Co mpatible BGA Spec TOP VIEW SIDE VIEW DETAIL Y X D 5 DETAIL 0.35 Z A Z A1 E 0.2 Z 4 0.20 DIM 1. Dimensions are in millimeters. e 3 Øb 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Ø0.30 Z X Y Ø0.10 MIN MAX 2.0 A A1 0.6 0.4 b 0.70 D 19.00 BSC E 19.00 BSC e 1.0 BSC Array: 18x18 BOTTOM VIEW SG-BGA-6144 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 1/25/05 File: SG-BGA-6144 Dwg Modified: 7/17/09, AE Scale: - Rev: C PAGE 3 of 4 26.73mm 2.5mm Top View 26.73mm 21.725mm±0.025mm 3mm 7mm 6mm sqr. Note: Backing plate holes are tapped to accept 0-80 screws. 15.94mm 21.725mm±0.025mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate SG-BGA-6144 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: H. Hansen Date: 1/25/05 File: SG-BGA-6144 Dwg Modified: 7/17/09, AE Scale: - Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 4 of 4