GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 40.225mm Recommended torque = 24 in lbs./ 384 in oz. 4 1 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 15.875mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 9 3 Assembled 9.75mm + IC thickness 2 8 7 10 Side View (Section AA) 6 11 Customer's BGA IC 5 Customer's Target PCB Scale: - SG-BGA-6196 Drawing Status: Released © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/24/06 File: SG-BGA-6196 Dwg Modified: 5/19/09 Rev: B All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View 1.25mm±0.13mm typ. Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 2.74mm 33mm 1mm typ. 1.25mm±0.13mm typ. 2.36mm 2.54mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 40.225mm±0.125mm typ. (socket body) 33mm Ø 0.51mm PAD 5.08mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 2.5mm±0.13mm 2.5mm±0.13mm Ø 1.61mm±0.05mm (x8) Non plated mounting hole 18.863mm(x8) 42.725mm±0.125mm (x4) (Backing Plate size) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6196 Drawing © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: - Rev: B Drawing: J. Glab Date: 10/24/06 File: SG-BGA-6196 Dwg Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL D X Y e E Øb 3 Ø0.25 Z X Y Ø0.10 0.20 TOP VIEW SIDE VIEW BOTTOM VIEW Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 5 DETAIL A 3.5 0.3 0.5 b 0.5 0.7 D 35.0 BSC 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. E 35.0 BSC e 1.00 BSC 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 3 4 MAX A1 A Z MIN Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 0.20 Z A1 DIM 1 0.2 Z Scale: - SG-BGA-6196 Drawing Status: Released © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/24/06 File: SG-BGA-6196 Dwg Modified: 5/19/09 Array 34x34 Rev: B PAGE 3 of 4 Top View 1.27mm (x4) 9.34mm(x4) 18.863mm±0.025mm(x8) 5mm 42.725mm Ø 1.61mm±0.05mm (x8) 7.03mm 2.5mm 10mm Sqr. 2.5mm 20mm (x4) 42.725mm 1.59mm Insulation Plate Side View Backing Plate 6.35mm Note: Backing plate holes are tapped to accept 0-80 screws. Description: Insulation Plate and Backing Plate Scale: - SG-BGA-6196 Drawing Status: Released © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/24/06 File: SG-BGA-6196 Dwg Modified: 5/19/09 Rev: B All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4