GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 38.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 38.225mm 4 5 Recommended torque = 20 in lbs./ 320 in oz. Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 4 1 9 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 11 Insulation Plate: FR4/G10, Thickness = 6.35mm. 3 Assembled 8.25mm + IC thickness 2 8 7 Side View (Section AA) 10 6 11 Customer's BGA IC SG-BGA-6037 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 5 Customer's Target PCB Status: Released Scale: - Rev: F Drawing: W. Watson Date: 3/11/02 File: SG-BGA-6037 Dwg Modified: 7/16/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm (x4) Orientation Mark 2.74mm* 1mm typ. 1.25mm±0.13mm (x4) 2.36mm 2.54mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ø 0.85mm±0.025mm (x2) Non plating alignment hole 38.225mm±0.125mm (x4) Socket Size Ø0.51mm pad 5.08mm 17.8625mm (x8) 2.5mm±0.13mm (x4) Ø 1.61mm±0.05mm (x8) Non plating mounting hole 2.5mm±0.13mm (x4) 40.725mm±0.125mm (x4) Backing Plate Size Target PCB Recommendations Total Thickness: 2.4mm min. Plating: Gold or Solder finish. PCB Pad Height: Same or higher than solder mask. NOTE: Steel backing plate may be required based on end user's application SG-BGA-6037 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 2:1 Rev: F Drawing: W. Watson Date: 3/11/02 File: SG-BGA-6037 Dwg Modified: 7/16/09, AE PAGE 2 of 4 Compatible BGA Spec X Y D Øb Ø0.15 X Y Ø0.08 E e Bottom View Top View 1. Dimensions are in millimeters. 0.20 Z DIM Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. A1 0.3 0.5 3 b 0.5 0.7 D 32.8 33.2 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. E 32.8 33.2 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A1 A Z Interpret dimensions and tolerances per ASME Y14.5M-1994. 2. 0.20 Z Side View SG-BGA-6037 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - MIN MAX 3.5 A e 1.0 BSC Array: 32x32 Rev: F Drawing: W. Watson Date: 3/11/02 File: SG-BGA-6037 Dwg Modified: 7/16/09, AE PAGE 3 of 4 2.5mm typ 1.27mm (x4) 2.5mm typ 17.8625mm±0.025mm (x8) Top View 40.725mm 5mm 6.53mm Ø 1.61mm±0.05mm (x8) Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 19mm (x4) 40.725mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Insulation Plate and Backing Plate SG-BGA-6037 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Drawing: W. Watson Scale: - Rev: F Date: 3/11/02 Modified: 7/16/09, AE PAGE 4 of 4