GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid A Top View A Recommended torque = 0.38 in-lb (6 in-oz) 4 1 2 8 6 12 SG-BGA-7154 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351, Rupp Dr., Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 5 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 4.76mm long. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 12 IC Guide: FR4/G10 7 Side View (Section AA) Customer's BGA IC 2 6 Assembled 8.55mm + IC thickness 11 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 9 3 10 1 Customer's Target PCB Status: Released Scale: - Rev: A Drawing: M.A. Fedde Date: 11/5/09 File: SG-BGA-7154 Dwg Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is offset by 0.25mm to the right of center with respect to the mounting holes. Orientation Mark 1.25mm±0.125mm(x4) 3.3625mm* 0.5mm typ. 1.25mm±0.125mm(x4) Socket Body Size Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 2mm 3.11mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 3.5mm 3mm Ø 0.3mm (x64) Ø 1.61mm±0.05mm (x4) Non plated mounting hole 3.5mm 9.725mm (x4) 12.225mm (x4) 14.73mm sqr. backing plate outline Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-7154 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351, Rupp Dr., Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: A Drawing: M.A. Fedde Date: 11/5/09 File: SG-BGA-7154 Dwg Modified: PAGE 2 of 4 Compatible BGA Spec 3.5mm E X Y A1 e 3.5mm D 3 Øb Ø0.05 X Y Ø0.05 Bottom View Top View DIM 5 1. Dimensions are in millimeters. A 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. A1 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. b 0.10 Z A 0.08 Z Z A1 4 End View MIN MAX 0.8 0.15 0.35 0.25 D 4.0 BSC E 4.0 BSC e 0.5 BSC 8x8 array All dimensions are in mm unless stated otherwise SG-BGA-7154 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351, Rupp Dr., Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: M.A. Fedde Date: 11/5/09 File: SG-BGA-7154 Dwg Modified: PAGE 3 of 4 14.73mm 2.5mm Top View 1.27mm (x4) 2.5mm 1.5mm 14.73mm 9.725mm±0.025mm (x4) 3.5mm Ø 1.61mm±0.05mm (x4) 3mm sqr. 5.94mm Note: Backing plate holes are tapped to accept 0-80 screws. 1.59mm Side View Insulation Plate Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-7154 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351, Rupp Dr., Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) Status: Released Scale: - Rev: A Drawing: M.A. Fedde Date: 11/5/09 File: SG-BGA-7154 Dwg Modified: PAGE 4 of 4