GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 24.225mm Recommended torque = 2 in lbs. Side View (Section AA) 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, 1.59mm thick. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 7 11 10 6 Customer's BGA IC Backing Plate: Anodized Aluminum 6.35mm thick. 11 5 Customer's Target PCB Scale: - SG-BGA-6201 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6201 Dwg.mcd Modified: 7/20/09, AE Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 1.25mm±0.13mm(x4) 1.25mm±0.13mm(x4) 2.84mm* 0.8mm typ. 2.46mm 2.54mm Ø 0.85mm±0.025mm (x2) Alignment Hole Socket Body Size Ø 0.42mm pad 5.08mm Ø 1.61mm±0.05mm (x4) Mounting Hole 21.725mm(x4) 24.225mm (x4) 26.725mm sq. backing plate Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 3:1 SG-BGA-6201 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6201 Dwg.mcd Modified: 7/20/09, AE Rev: C PAGE 2 of 4 Compatible BGA Spec. X Y D 3 Øb Ø0.25 X Y Ø0.10 E e Bottom View Top View A 5 0.20 4 1 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. A 2 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. b 3 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Z A1 Z Side View 0.20 Z Scale: - SG-BGA-6201 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6201 Dwg.mcd Modified: 7/20/09, AE DIM A1 MIN MAX 2.5 0.2 0.5 0.60 D 18.8 19.2 E 18.8 19.2 e 0.8 BSC Array: 22 X 22 Rev: C PAGE 3 of 4 26.73mm 2.5mm Top View 26.73mm 21.725mm±0.025mm 3mm 7mm 6mm sqr. Ø 1.61mm±0.05mm (x4) 15.94mm Note: Backing plate holes are tapped to accept 0-80 screws. 21.725mm±0.025mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate Scale: - SG-BGA-6201 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6201 Dwg.mcd Modified: 7/20/09, AE Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 4 of 4