BT138X series GENERAL DESCRIPTION SYMBOL Glass passivated triacs in a full pack plastic envelope, intended for use in applications requiring high bidirectional transient and blocking voltage capability and high thermal cycling performance. Typical applications include motor control, industrial and domestic lighting, heating and static switching. SOT186A T2 T1 G QUICK REFERENCE DATA SYMBOL PARAMETER MAX. MAX. MAX. UNIT V DRM BT138XBT138XBT138XRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current 500 500F 500G 500 600 600F 600G 600 800 800F 800G 800 V 12 95 12 95 12 95 A A IT(RMS) I TSM LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VDRM Repetitive peak off-state voltages IT(RMS) ITSM RMS on-state current Non-repetitive peak on-state current I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature CONDITIONS MIN. - full sine wave; Ths ≤ 56 ˚C full sine wave; Tj = 25 ˚C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs T2+ G+ T2+ GT2- GT2- G+ over any 20 ms period MAX. -500 5001 -600 6001 UNIT -800 800 V - 12 A - 95 105 45 A A A2s -40 - 50 50 50 10 2 5 5 0.5 150 125 A/µs A/µs A/µs A/µs A V W W ˚C ˚C 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. 2014-6-11 1 www.kersemi.com BT138X series ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. Visol R.M.S. isolation voltage from all three terminals to external heatsink f = 50-60 Hz; sinusoidal waveform; R.H. ≤ 65% ; clean and dustfree Cisol Capacitance from T2 to external f = 1 MHz heatsink TYP. - MAX. UNIT 2500 V - 10 - pF MIN. TYP. MAX. UNIT - 55 4.0 5.5 - K/W K/W K/W THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Thermal resistance junction to heatsink Rth j-a Thermal resistance junction to ambient full or half cycle with heatsink compound without heatsink compound in free air STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER IGT Gate trigger current IL Latching current IH Holding current VT VGT On-state voltage Gate trigger voltage ID Off-state leakage current CONDITIONS BT138XVD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GT2- G+ VD = 12 V; IGT = 0.1 A T2+ G+ T2+ GT2- GT2- G+ VD = 12 V; IGT = 0.1 A IT = 15 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); Tj = 125 ˚C MIN. TYP. MAX. UNIT ... ...F ...G - 5 8 10 22 35 35 35 70 25 25 25 70 50 50 50 100 mA mA mA mA - 7 20 8 10 6 40 60 40 60 30 40 60 40 60 30 60 90 60 90 60 mA mA mA mA mA 0.25 1.4 0.7 0.4 1.65 1.5 - V V V - 0.1 0.5 mA DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER dVD/dt Critical rate of rise of off-state voltage dVcom/dt Critical rate of change of commutating voltage tgt Gate controlled turn-on time 2014-6-11 CONDITIONS BT138XVDM = 67% VDRM(max); Tj = 125 ˚C; exponential waveform; gate open circuit VDM = 400 V; Tj = 95 ˚C; IT(RMS) = 12 A; dIcom/dt = 5.4 A/ms; gate open circuit ITM = 16 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs 2 TYP. MAX. UNIT ... 100 MIN. ...F 50 ...G 200 250 - V/µs - - 10 20 - V/µs - - - 2 - µs www.kersemi.com BT138X series 20 BT138 Ptot / W Ths(max) / C 45 15 BT138X IT(RMS) / A = 180 15 56 C 120 1 65 90 10 60 10 85 30 5 105 5 0 0 5 125 15 10 0 -50 0 50 Ths / C IT(RMS) / A Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle. 1000 BT138 ITSM / A 100 150 Fig.4. Maximum permissible rms current IT(RMS) , versus heatsink temperature Ths. 25 BT138 IT(RMS) / A 20 15 100 dI T /dt limit 10 I TSM IT T2- G+ quadrant T 5 time Tj initial = 25 C max 10 10us 100us 1ms T/s 10ms 0 0.01 100ms Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 20ms. 100 ITSM / A 80 1.6 ITSM T 10 Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Ths ≤ 56˚C. BT138 IT 0.1 1 surge duration / s VGT(Tj) VGT(25 C) BT136 1.4 time Tj initial = 25 C max 1.2 60 1 40 0.8 20 0 0.6 1 10 100 Number of cycles at 50Hz 0.4 -50 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. 2014-6-11 0 50 Tj / C 100 150 Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj. 3 www.kersemi.com BT138X series 3 IGT(Tj) IGT(25 C) Tj = 125 C Tj = 25 C T2+ G+ T2+ GT2- GT2- G+ 2.5 BT138 IT / A 40 BT138 30 typ max Vo = 1.175 V Rs = 0.0316 Ohms 2 20 1.5 1 10 0.5 0 -50 0 50 Tj / C 100 0 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 IL(Tj) IL(25 C) 0 0.5 1 1.5 VT / V 2 2.5 3 Fig.10. Typical and maximum on-state characteristic. 10 TRIAC BT138 Zth j-hs (K/W) with heatsink compound without heatsink compound 2.5 1 unidirectional 2 bidirectional 0.1 1.5 tp P D 1 0.01 0.5 t 0 -50 0 50 Tj / C 100 0.001 10us 150 IH(Tj) IH(25C) 1ms 10ms tp / s 0.1s 1s 10s Fig.11. Transient thermal impedance Zth j-hs, versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj. 3 0.1ms 1000 TRIAC dV/dt (V/us) off-state dV/dt limit BT138...G SERIES 2.5 BT138 SERIES 100 2 BT138...F SERIES 1.5 dIcom/dt = 15 A/ms 10 1 12 9.1 7 5.4 4.2 0.5 0 -50 0 50 Tj / C 100 1 150 50 100 150 Tj / C Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj. 2014-6-11 0 Fig.12. Typical commutation dV/dt versus junction temperature, parameter commutation dIT/dt. The triac should commutate when the dV/dt is below the value on the appropriate curve for pre-commutation dIT/dt. 4 www.kersemi.com BT138X series MECHANICAL DATA Dimensions in mm Net Mass: 2 g 10.3 max 4.6 max 3.2 3.0 2.9 max 2.8 Recesses (2x) 2.5 0.8 max. depth 6.4 15.8 19 max. max. 15.8 max seating plane 3 max. not tinned 3 2.5 13.5 min. 1 0.4 2 3 M 1.0 (2x) 0.6 2.54 0.9 0.7 0.5 2.5 5.08 1.3 Fig.13. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". 2014-6-11 5 www.kersemi.com