2SC4965 Silicon NPN Epitaxial REJ03G0737-0300 (Previous ADE-208-006A) Rev.3.00 Aug.10.2005 Application VHF / UHF RF switch Features • Low Ron and high performance for RF switch. • Capable of high density mounting. Outline RENESAS Package code: PTSP0003ZA-A (Package name: CMPAK R ) 3 1. Emitter 2. Base 3. Collector 1 2 Note: Marking is “YV–”. *CMPAK is a trademark of Renesas Technology Corp. Absolute Maximum Ratings (Ta = 25°C) Item Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Collector power dissipation Junction temperature Storage temperature Rev.3.00 Aug 10, 2005 page 1 of 5 Symbol VCBO VCEO VEBO IC PC Tj Tstg Ratings 12 8 3 100 100 150 –55 to +150 Unit V V V mA mW °C °C 2SC4965 Electrical Characteristics (Ta = 25°C) Item Collector to base breakdown voltage Collector cutoff current Emitter cutoff current DC current transfer ratio Collector to emitter saturation voltage Collector output capacitance On resistance Rev.3.00 Aug 10, 2005 page 2 of 5 Symbol V(BR)CBO ICBO ICEO IEBO hFE VCE(sat) Cob Ron Min 12 — — — 100 — — — Typ — — — — 250 150 1.9 1.2 Max — 10 1 10 600 300 1.6 — Unit V µA mA µA mV pF Ω Test conditions IC = 10 µA, IE = 0 VCB = 10 V, IE = 0 VCE = 8 V, RBE = ∞ VEB = 3 V, IC = 0 VCE = 5 V, IC = 5 mA IC = 80 mA, IB = 5 mA VCB = 5 V, IE = 0, f = 1 MHz IB = 2.5 mA, f = 1 kHz 2SC4965 Main Characteristics DC Current Transfer Ratio vs. Collector Current 500 120 DC Current Transfer Ratio hFE Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve 100 80 60 40 20 VCE = 5V 400 300 200 100 0 0 50 100 1 150 Collector Output Capacitance vs. Collector to Base Voltage 2.8 IE = 0 f = 1 MHz 2.4 2.0 1.6 1.2 0.8 0.5 2 5 10 20 100 1.6 1.2 0.8 0.4 1 2 5 10 20 50 100 Collector Current IC (mA) Ron test circuit Vin 10 On Resistance Ron (Ω) 50 VCE = 5V On Resistance vs. Base Current f = 1kHz 100µF R1(1k Ω) 100µF Vout 2.7k Ω 6 4 D.U.T. 2nF 3 2 1 0.1 20 2.0 Collector to Base Voltage VCB (V) 8 10 Gain Bandwidth Product vs. Collector Current 0 1 5 Collector Current IC (mA) Gain Bandwidth Product fT (GHz) Collector Output Capacitance Cob (pF) Ambient Temperature Ta (°C) 2 VB 0.2 0.5 1 2 Base Current IB (mA) Rev.3.00 Aug 10, 2005 page 3 of 5 5 10 Ron= Vout R1 Vin-Vout 2SC4965 Signal Reduction vs. Frequency Signal Reduction Rs (dB) 0 Signal Reduction test circuit INPUT 33pF OUTPUT 33pF VB = 0 –10 2.7k Ω –20 L1 D.U.T. 2nF V B = 5V –30 VB –40 –50 50 L1 : Inside dia φ 3 mm , φ 0.5 mm Enameled Copper Wire 7 Turns. 100 200 Frequency 500 1000 f (MHz) Signal Reduction vs. Frequency Signal Reduction test circuit Signal Reduction Rt (dB) 0 V B = 5V D.U.T. INPUT 33pF 33pF OUTPUT –10 –20 2.7k Ω 2nF –30 VB L1 , L2 : Inside dia φ 3 mm , φ 0.5 mm Enameled Copper Wire 7 Turns. –40 –50 50 L2 L1 VB = 0 100 200 Frequency 500 f (MHz) Rev.3.00 Aug 10, 2005 page 4 of 5 1000 2SC4965 Package Dimensions JEITA Package Code RENESAS Code SC-70 Package Name PTSP0003ZA-A D MASS[Typ.] CMPAK / CMPAKV 0.006g A e Q c E HE LP L A A x M L1 S A3 Reference Symbol b A e A2 A A1 S e1 b b1 l1 c1 c b2 A-A Section Pattern of terminal position areas A A1 A2 A3 b b1 c c1 D E e HE L L1 LP x b2 e1 l1 Q Dimension in Millimeters Min 0.8 0 0.8 0.25 0.1 1.8 1.15 1.8 0.3 0.1 0.2 Nom 0.9 0.25 0.32 0.3 0.13 0.11 2.0 1.25 0.65 2.1 Max 1.1 0.1 1.0 0.4 0.15 2.2 1.35 2.4 0.7 0.5 0.6 0.05 0.45 1.5 0.9 0.2 Ordering Information Part Name 2SC4965YV-TL-E Quantity 3000 Shipping Container φ 178 mm Reel, 8 mm Emboss Taping Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.3.00 Aug 10, 2005 page 5 of 5 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. 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