2SC4964 Silicon NPN Epitaxial REJ03G0736-0300 (Previous ADE-208-005A) Rev.3.00 Aug.10.2005 Application VHF / UHF RF switch Features • Low Ron and high performance for RF switch. • Capable of high density mounting. Outline RENESAS Package code: PLSP0003ZB-A (Package name: MPAK) 1. Emitter 2. Base 3. Collector 3 1 2 Note: Marking is “YV–”. Absolute Maximum Ratings (Ta = 25°C) Item Collector to base voltage Symbol VCBO Ratings 12 Unit V Collector to emitter voltage Emitter to base voltage VCEO VEBO 8 3 V V Collector current Collector power dissipation Junction temperature Storage temperature IC PC Tj Tstg 100 150 150 –55 to +150 mA mW °C °C Rev.3.00 Aug 10, 2005 page 1 of 5 2SC4964 Electrical Characteristics (Ta = 25°C) Item Collector to base breakdown voltage Collector cutoff current Emitter cutoff current DC current transfer ratio Collector to emitter saturation voltage Collector output capacitance On resistance Rev.3.00 Aug 10, 2005 page 2 of 5 Symbol V(BR)CBO ICBO ICEO IEBO hFE VCE(sat) Cob Ron Min 12 — — — 100 — — — Typ — — — — 250 200 1.2 2.0 Max — 1 1 10 600 300 1.6 — Unit V µA mA µA mV pF Ω Test conditions IC = 10 µA, IE = 0 VCB = 10 V, IE = 0 VCE = 8 V, RBE = ∞ VEB = 3 V, IC = 0 VCE = 5 V, IC = 5 mA IC = 80 mA, IB = 5 mA VCB = 5 V, IE = 0, f = 1 MHz IB = 2.5 mA, f = 1 kHz 2SC4964 Main Characteristics DC Current Transfer Ratio vs. Collector Current 500 DC Current Transfer Ratio hFE 150 100 50 Collector Output Capacitance Cob (pF) 100 400 300 200 100 2 5 20 50 Collector Current IC (mA) Collector Output Capacitance vs. Collector to Base Voltage Gain Bandwidth Product vs. Collector Current IE = 0 f = 1 MHz 2.4 2.0 1.6 1.2 2 5 10 20 VCE = 5V 1.6 1.2 0.8 0.4 1 2 5 10 20 50 Collector to Base Voltage VCB (V) Collector Current IC (mA) On Resistance vs. Base Current Ron test circuit Vin f = 1kHz 100 2.0 0 1 8 100µF R1(1k Ω) 100 100µF Vout 2.7k Ω 6 4 D.U.T. 2nF 3 2 1 0.1 10 Ambient Temperature Ta (°C) 2.8 0.8 0.5 1 150 10 On Resistance Ron (Ω) VCE = 5V 0 50 0 Gain Bandwidth Product fT (GHz) Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve VB 0.2 0.5 1 2 5 Base Current IB (mA) Rev.3.00 Aug 10, 2005 page 3 of 5 10 Ron= Vout R1 Vin-Vout 2SC4964 Signal Reduction vs. Frequency Signal Reduction Rs (dB) 0 Signal Reduction test circuit INPUT 33pF OUTPUT 33pF VB = 0 –10 2.7k Ω –20 D.U.T. 2nF V B = 5V –30 VB –40 –50 50 L1 : Inside dia φ 3 mm , φ 0.5 mm Enameled Copper Wire 7 Turns. 100 200 Frequency 500 1000 f (MHz) Signal Reduction vs. Frequency Signal Reduction test circuit 0 Signal Reduction Rt (dB) L1 V B = 5V D.U.T. INPUT 33pF 33pF OUTPUT –10 –20 2.7k Ω 2nF –30 VB L1 , L2 : Inside dia φ 3 mm , φ 0.5 mm Enameled Copper Wire 7 Turns. –40 –50 50 L2 L1 VB = 0 100 200 Frequency 500 f (MHz) Rev.3.00 Aug 10, 2005 page 4 of 5 1000 2SC4964 Package Dimensions JEITA Package Code RENESAS Code Package Name MPAK(T) / MPAK(T)V, MPAK / MPAKV PLSP0003ZB-A SC-59A D MASS[Typ.] 0.011g A Q e E HE L A c LP L1 Reference Symbol A3 A x M S b A e A2 A e1 A1 S b b1 c1 I1 c b2 A-A Section Pattern of terminal position areas A A1 A2 A3 b b1 c c1 D E e HE L L1 LP x b2 e1 I1 Q Dimension in Millimeters Min 1.0 0 1.0 0.35 0.1 2.7 1.35 2.2 0.35 0.15 0.25 Nom 1.1 0.25 0.42 0.4 0.13 0.11 1.5 0.95 2.8 Max 1.3 0.1 1.2 0.5 0.15 3.1 1.65 3.0 0.75 0.55 0.65 0.05 0.55 1.95 1.05 0.3 Ordering Information Part Name 2SC4964YV-TL-E Quantity 3000 Shipping Container φ 178 mm Reel, 8 mm Emboss Taping Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.3.00 Aug 10, 2005 page 5 of 5 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0