3.5x2.8 mm SMD CHIP LED LAMP Package

3.5x2.8 mm SMD CHIP LED LAMP
PRELIMINARY SPEC
APED3528CGCK
Features
Description
lSINGLE COLOR.
l SUITABLE
FOR ALL SMT ASSEMBLY AND
SOLDER PROCESS.
GREEN
The Green source color devices are made with
InGaAlP on GaAs substrate Light Emitting Diode.
lIDEAL FOR BACKLIGHTING.
l AVAILABLE
lPACKAGE
ON TAPE AND REEL.
: 500PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD3539
APPROVED : J. Lu
REV NO: V.1
CHECKED : Allen Liu
DATE: SEP/10/2003
DRAWN: D.H.FANG
PAGE: 1 OF 4
Selection Guide
P ar t N o .
Dic e
APED 3528C GC K
Iv (m c d )
@ 20 m A
L en s Ty p e
GREEN (InGaAIP)
WATER C LEAR
Mi n .
Ty p .
70
170
V i ew i n g
An g le
2θ1/2
40°
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25°°C
Sy m b o l
P ar am et er
D ev i c e
λp e a k
Peak Wavelength
Green
λD
D omi nate Wavelength
∆λ1/2
Ty p .
Max .
Un its
Tes t C o n d i t i o n s
574
nm
I F =20mA
Green
570
nm
I F =20mA
Spectral Li ne Half-wi dth
Green
20
nm
I F =20mA
C
C apaci tance
Green
15
pF
VF=0V;f=1MHz
VF
Forward Voltage
Green
2.1
2.5
V
I F =20mA
IR
Reverse C urrent
Green
10
uA
V R = 5V
Absolute Maximum Ratings at TA=25°°C
P ar am et er
Gr een
Un its
Power di ssi pati on
105
mW
Peak Forward C urrent [1]
150
mA
D C Forward C urrent
30
Reverse Voltage
5
-40°C To +85°C
Operati ng/Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAD3539
APPROVED : J. Lu
mA
REV NO: V.1
CHECKED : Allen Liu
DATE: SEP/10/2003
DRAWN: D.H.FANG
V
PAGE: 2 OF 4
Green
SPEC NO: DSAD3539
APPROVED : J. Lu
APED3528CGCK
REV NO: V.1
CHECKED : Allen Liu
DATE: SEP/10/2003
DRAWN: D.H.FANG
PAGE: 3 OF 4
APED3528CGCK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD3539
APPROVED : J. Lu
REV NO: V.1
CHECKED : Allen Liu
DATE: SEP/10/2003
DRAWN: D.H.FANG
PAGE: 4 OF 4