TA6009FM TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA6009FM Shock Sensor IC (1 ch version) TA6009FM detects an existence of external shock through the shock sensor and output. Features · TA6009FM operates from 2.7 to 5.5 V DC single power supply voltage. · Signal from the shock sensor is amplified according to setting gain, and is detected through the internal window comparator. · TA6009FM incorporates 1-ch shock detecting circuitry. · Input terminal of sensor signal is designed high impedance. Weight: 0.016 g (typ.) Differential input impedance = 100 MΩ (typ.) · LPF (Low Pass Filter) circuitry is incorporated. Cut-off frequency of LPF = 7 kHz · Sensitivity of shock detection can be adjusted by external devices. · Small package SON10-P-0303-0.50 (0.5 mm pitch) Block Diagram 10 A 1 B 2 9 BUFFER 50 MW 8 -OP-AMP + DIFF&LPF ´10 7 kHz BUFFER 50 MW ( 7 R 1.7 V (1.7 V) E 1.4 V (1.2 V) F 1.1 V (0.7 V) ) = 10 pin ® GND GUARD 0.57 V 6 VCC + - Comparator 5 GND + - Comparator 3 GUARD 4 Pin Connection (top view) SIA 1 10 W-CONT SIB 2 9 DO GUARD 3 8 AI OUT 4 7 AO GND 5 6 VCC 1 2002-01-17 TA6009FM Pin Function Pin No. Pin Name Function 1 SIA Connection terminal of shock sensor 2 SIB Connection terminal of shock sensor 3 GUARD Input (1, 2 pin) GUARD terminal 4 OUT Output terminal (output = “L” when shock is detected.) 5 GND Ground terminal 6 VCC Power supply voltage 7 AO Op-Amp output terminal 8 AI Op-Amp input terminal 9 DO Differential-Amp output terminal 10 W-CONT WindComp. trip voltage selection terminal Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VCC 7 V Power dissipation PD 150 mW Storage temperature Tstg -55 to 150 °C Symbol Rating Unit Power supply voltage VCC 2.7 to 5.5 V Operating temperature Topr -25 to 85 °C Power supply voltage Recommend Operating Condition Characteristics Note: The IC may be destroyed due to short circuit between adjacent pins, incorrect orientation of device’s mounting, connecting positive and negative power supply pins wrong way round, air contamination fault, or fault by improper grounding. 2 2002-01-17 TA6009FM Electrical Characteristics (unless otherwise specified, VCC = 3.3 V, Ta = 25°C) Symbol Test Circuit Test Condition Min Typ. Max Unit Supply voltage VCC ¾ ¾ 2.7 3.3 5.5 V Supply current ICC (1) VCC = 3.3 V 1.8 2.4 VCC = 5.0 V 1.8 2.4 Symbol Test Circuit Test Condition Min Typ. Max Unit VoGur (2) ¾ 0.52 0.57 0.62 V Symbol Test Circuit Test Condition Min Typ. Max Unit Zin ¾ ¾ 50 100 Gain GvBuf (3) ¾ 19.6 20 20.4 dB Output DC voltage VoBuf (4) Connect C = 100 pF between 1 pin and 2 pin 0.7 1 1.3 V fc (5) Frequency at -3dB point 5 7 10 kHz Output source current IBso (6) Voh = VCC - 1 V 400 800 mA Output sink current IBsi (7) Vol = 0.3 V 75 130 mA Characteristics mA (GUARD) Characteristics Output voltage (DIFF-AMP) Characteristics Input impedance (Note 1) Low pass filter cut-off freq. MW Note 1: Marked parameters are reference data. (OP-AMP) Characteristics Symbol Test Circuit Test Condition Min Typ. Max Unit Cut-off frequency (Note 1) fT ¾ ¾ 1.5 2 MHz Openloop gain (Note 1) Gvo ¾ ¾ 80 90 dB Input voltage 1 Vin1 (8) 10 pin ® OPEN (Note 2) 1.33 1.4 1.47 V Input voltage 2 Vin2 (9) 10 pin ® GND (Note 2) 1.14 1.2 1.26 V Iin (10) ¾ 25 50 nA Voff ¾ ¾ -5 0 5 mV Output source current IAso (11) Voh = VCC - 1 V 300 800 mA Output sink current IAsi (12) Vol = 0.3 V 130 200 mA Min Typ. Max Unit Input current Offset voltage (Note 1) Note 1: Marked parameters are reference data. Note 2: 10 pin must be non-connected otherwise connected to GND. (Window-comparator) Characteristics Symbol Test Circuit Test Condition Trip voltage 1 (Note 1) Vtrp1 ¾ 10 pin ® OPEN (Note 2) Vin1 ±0.285 Vin1 ±0.3 Vin1 ±0.315 V Trip voltage 2 (Note 1) Vtrp2 ¾ 10 pin ® GND (Note 2) Vin2 ±0.475 Vin2 ±0.5 Vin2 ±0.525 V Output source current IWso (13) Voh = VCC - 0.5 V 30 50 mA Output sink current IWsi (14) Vol = 0.3 V 300 800 mA Note 1: Marked parameters are reference data. Note 2: 10 pin must be non-connected otherwise connected to GND. 3 2002-01-17 TA6009FM Application Note 1.7 V (1.7 V) Buffer ´1 C2 1 R2 AMP ´10 Shock sensor LPF 9 C1 R1 8 7 Window Comparator 4 OUT 2 Buffer ´1 1.4 V (1.2 V) REF 1.1 V (0.7 V) Figure 1 The configuration of G-force sensor amplifier Figure 1 is the composition of G-Force sense amplifier. The shock sensor is connected between 1 and 2 terminal. When G-force Sensor (sensor sensibility = s (mV/G)) is used to detect external shock of g (G), the external parts are determined as following. (Gain setting) * 10 PIN ® GND 500/(s ´ g) = G1 G1/10 = G (OP-AMP) (HPF setting) fc = 1/(2 p ´ R1 ´ C1) (LPF setting) fc = 1/(2 p ´ R2 ´ C2) 4 2002-01-17 TA6009FM Reference Data (1) 9 pin (DIFF-AMP output) CMRR, PSRR CMRR, PSRR (9 pin) -30 -40 CMRR (dB) -50 -60 PSRR -70 -80 100 1000 10000 100000 (Hz) (2) 7 pin (OP-AMP output) source current Source Current (7 pin) 1800 85°C Source current (mA) 1500 1200 900 25°C 600 -25°C 300 0 1.8 2.0 2.2 2.4 2.6 Voh (V) 7 pin (OP-AMP output) sink current Sink Current (7 pin) 300 85°C (mA) 250 Sink current (3) 25°C 200 -25°C 150 100 50 0 0 0.1 0.2 0.3 Vol 0.4 0.5 (V) 5 2002-01-17 6 kW 8 AMP 10 mA 10 mA 6 10 kW 1 kW 250 W 1.5 kW 500 W 9 4 50 mA 6 kW 1.7 V VREF 22 kW 13.59 kW 50 mA 50 mA 100 W 10 mA 50 mA 100 W 10 mA TA6009FM Equivalent Circuit 7 100 W 3 7 10 kW 10 2002-01-17 TA6009FM Test Circuit Supply current ICC (2) GUARD Output voltage VoGur 30 kW (1) 8 7 6 1 2 3 4 5 M 10 9 8 7 6 1 2 3 4 5 3.3 V 9 3.3 V 10 M (3) DIFF-AMP Gain GvBuf Step 1 Step 2 M1 M2 M 9 8 7 6 1 2 3 4 5 10 9 8 7 6 1 2 3 4 5 0.6 V 0.68 V 3.3 V 10 3.3 V M Gain = DIFF-AMP Output DC voltage VoBuf (5) DIFF-AMP Low pass filter cut-off freq. fc M 9 8 7 6 1 2 3 4 5 10 9 8 7 6 0.1 mF 1 2 3 4 5 7 100 kW 100 pF 100 kW 3.3 V 10 3.3 V M 100 pF (4) Μ2 - Μ1 0.68 - 0.60 2002-01-17 TA6009FM (6) DIFF-AMP Output source current IBso (7) DIFF-AMP Output sink current IBsi 9 8 7 6 1 2 3 4 5 10 9 8 7 6 1 2 3 4 5 M 9 8 7 6 1 2 3 4 5 10 9 8 7 6 1 2 3 4 5 3.3 V 10 3.3 V M OP-AMP Input voltage 2 Vin2 30 kW (9) 30 kW OP-AMP Input voltage 1 Vin1 0.5 V 0.62 V 0.65 V 0.45 V (8) 3.3 V 10 0.3 V M 3.3 V 2.3 V M (10) OP-AMP Input current Iin 10 9 8 7 6 1 2 3 4 5 3.3 V 1.2 V M (11) OP-AMP Output source current IAso (12) OP-AMP Output sink current IAsi 8 7 6 1 2 3 4 5 10 9 8 7 6 1 2 3 4 5 3.3 V 9 1.6 V 10 0.3 V M 3.3 V 1.2 V 2.3 V M 8 2002-01-17 TA6009FM 8 7 6 1 2 3 4 5 10 9 8 7 6 1 2 3 4 5 M 0.3 V 2.85 V 3.3 V 9 1.4 V 10 0.6 V (14) Window comparator Output sink current IWsi 3.3 V 3.3 V 1.2 V (13) Window comparator Output source current IWso M Test Circuit (for reference) DIFF-AMP CMRR (b) M 10 9 8 7 6 1 2 3 4 5 10 9 8 7 6 1 2 3 4 5 3.3 V M DIFF-AMP PSRR 3.3 V (a) 9 2002-01-17 TA6009FM Marking Week 1-26 D01 D01 QA1 QA1 Week 27-53 D01 D01: Product number Q: Monthly and Weekly code A1: Lot code QA1 Mold material: Epoxy resin Lead material and disposition: An alloy of copper, soldering Production country: JAPAN Production factory: Front end process TOSHIBA Kitakyushu factory Back end process TOSHIBA Kitakyushu factory 10 2002-01-17 TA6009FM Package Dimensions Weight: 0.016 g (typ.) 11 2002-01-17 TA6009FM RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 12 2002-01-17