2SC4807 Silicon NPN Epitaxial REJ03G0731-0300 (Previous ADE-208-1122A) Rev.3.00 Aug.10.2005 Application VHF / UHF wide band amplifier Features • High gain bandwidth product fT = 4.4 GHz Typ • High output power 1 dB Power compression point Pcp = 24 dBm Typ at VCE = 5V , IC = 100 mA , f = 900 MHz Outline RENESAS Package code: PLZZ0004CA-A (Package name: UPAK R ) 1 3 2 1. Base 2. Collector 3. Emitter 4. Collector (Flange) 4 Note: Marking is “ER”. *UPAK is a trademark of Renesas Technology Corp. Absolute Maximum Ratings (Ta = 25°C) Item Symbol Collector to base voltage VCBO Collector to emitter voltage VCEO Emitter to base voltage VEBO Collector current IC Collector power dissipation PC*1 Junction temperature Tj Storage temperature Tstg Note: 1. Value on the alumina ceramics board (12.5 x 20 x 0.7 mm) Rev.3.00 Aug 10, 2005 page 1 of 7 Ratings 20 15 2 200 800 150 –55 to +150 Unit V V V mA mW °C °C 2SC4807 Electrical Characteristics (Ta = 25°C) Item Collector to base breakdown voltage Collector cutoff current Emitter cutoff current DC current transfer ratio Collector output capacitance Gain bandwidth product Power gain Noise figure Rev.3.00 Aug 10, 2005 page 2 of 7 Symbol V(BR)CBO ICBO ICEO IEBO hFE Cob fT PG Min 20 — — — 50 — 3.0 5.0 Typ 30 — — — 120 2.8 4.4 7.0 Max — 1 1 10 250 4.0 — — Unit V µA mA µA pF GHz dB NF — 2.5 4.0 dB Test conditions IC = 10 µA, IE = 0 VCB = 15 V, IE = 0 VCE = 15 V, RBE = ∞ VEB = 2 V, IC = 0 VCE = 5 V, IC = 100 mA VCB = 5 V, IE = 0, f = 1 MHz VCE = 5 V, IC = 100 mA VCE = 5 V, IC = 100 mA, f = 900 MHz VCE = 5 V, IC = 20 mA, f = 900 MHz 2SC4807 DC Current Transfer Ratio vs. Collector Current Maximum Collector Dissipation Curve 1600 DC Current Transfer Ratio hFE Collector Power Dissipation Pc (mW) (on the alumina ceramic board) Main Characteristics 1200 800 400 50 0 100 150 200 VCE = 5V 160 120 80 40 0 200 1 2 VCE = 5 V 5 4 3 2 1 0 10 20 50 100 200 Collector Output Capacitance Cob (pF) fT (GHz) Gain Bandwidth Product 6 500 50 100 200 500 Collector Output Capacitance vs. Collector to Base Voltage 5.2 IE = 0 f = 1 MHz 4.4 3.6 2.8 2.0 1.2 0.5 1 2 5 10 20 Collector Current IC (mA) Collector to Base Voltage VCB (V) Power Gain vs. Collector Current Noise Figure vs. Collector Current 10 10 Noise Figure NF (dB) f = 900 MHz Power Gain PG (dB) 10 20 Collector Current IC (mA) Ambient Temperature Ta (°C) Gain Bandwidth Product vs. Collector Current 5 VCE = 5V 8 6 4 2 f = 900 MHz 8 VCE = 5V 6 4 2 0 0 2 5 10 20 50 100 Collector Current IC (mA) Rev.3.00 Aug 10, 2005 page 3 of 7 200 2 5 10 20 50 100 Collector Current IC (mA) 200 2SC4807 Output Power vs. Input Power Output Power Pout (dBm) 32 f = 900 MHz VCE = 5V 24 I C = 100 mA 16 8 0 8 16 24 Input Power Pin (dBm) Rev.3.00 Aug 10, 2005 page 4 of 7 32 2SC4807 S21 Parameter vs. Frequency S11 Parameter vs. Frequency .8 .6 1 90° 1.5 120° 2 .4 Scale: 4 / div. 60° 3 4 5 .2 150° 30° 10 .2 0 .4 .6 .8 1.0 1.5 2 3 4 5 10 0° 180° –10 –5 –4 –3 –.2 –.4 –2 –.6 –30° –150° –60° –90° Condition: VCE = 5 V , Zo = 50 Ω 100 to 1000 MHz (100 MHz step) (I C = 20 mA) (I C = 100 mA) –120° –1.5 –.8 –1 Condition: VCE = 5 V , Zo = 50 Ω 100 to 1000 MHz (100 MHz step) (I C = 20 mA) (I C = 100 mA) S22 Parameter vs. Frequency S12 Parameter vs. Frequency 90° 120° Scale: 0.1 / div. 60° 150° .8 .6 1 1.5 2 .4 30° 3 4 5 .2 10 180° 0° .2 0 .4 .6 .8 1.0 1.5 2 3 4 5 10 –10 –5 –4 –3 –.2 –30° –150° –.4 –120° –60° –90° Condition: VCE = 5 V , Zo = 50 Ω 100 to 1000 MHz (100 MHz step) (I C = 20 mA) (I C = 100 mA) Rev.3.00 Aug 10, 2005 page 5 of 7 –2 –.6 –.8 –1.5 –1 Condition: VCE = 5 V , Zo = 50 Ω 100 to 1000 MHz (100 MHz step) (I C = 20 mA) (I C = 100 mA) 2SC4807 S Parameter (VCE = 5 V, IC = 20 mA, ZO = 50 Ω, Emitter Common) Freq. (MHz) 100 200 300 400 500 600 700 800 900 1000 S11 MAG. 0.525 0.533 0.542 0.544 0.547 0.552 0.555 0.558 0.570 0.569 S21 ANG. –150.0 –171.9 177.6 170.2 163.8 158.2 152.6 147.5 142.4 137.4 MAG. 14.03 7.16 4.75 3.60 2.91 2.46 2.14 1.90 1.72 1.58 S12 ANG. 104.7 90.9 83.2 77.5 72.1 67.4 63.3 59.3 55.2 51.9 MAG. 0.039 0.063 0.089 0.116 0.143 0.170 0.197 0.225 0.254 0.280 S22 ANG. 58.4 65.7 69.6 71.0 71.5 71.3 70.5 69.6 68.4 67.2 MAG. 0.336 0.197 0.157 0.146 0.145 0.150 0.158 0.166 0.175 0.186 ANG. –75.5 –89.9 –98.3 –104.0 –109.0 –113.7 –117.1 –121.0 –124.6 –128.1 S Parameter (VCE = 5 V, IC = 100 mA, ZO = 50 Ω, Emitter Common) Freq. (MHz) 100 200 300 400 500 600 700 800 900 1000 S11 MAG. 0.488 0.502 0.507 0.507 0.514 0.513 0.518 0.524 0.525 0.531 S21 ANG. –172.8 176.3 170.0 163.6 159.0 153.6 148.5 144.0 139.3 134.2 Rev.3.00 Aug 10, 2005 page 6 of 7 MAG. 16.32 8.08 5.34 4.03 3.27 2.75 2.40 2.13 1.93 1.77 S12 ANG. 97.8 88.0 82.0 77.2 72.8 68.8 65.1 61.3 57.8 54.6 MAG. 0.034 0.066 0.099 0.132 0.163 0.195 0.225 0.254 0.284 0.312 S22 ANG. 76.2 78.6 77.8 76.4 74.5 72.7 70.7 68.5 66.3 64.6 MAG. 0.248 0.195 0.184 0.181 0.184 0.189 0.192 0.196 0.200 0.205 ANG. –116.9 –141.9 –152.2 –157.9 –161.8 –164.0 –165.8 –167.6 –169.4 –170.8 2SC4807 Package Dimensions RENESAS Code Package Name MASS[Typ.] PLZZ0004CA-A UPAK / UPAKV 0.050g 1.5 1.5 3.0 1.5 ± 0.1 0.44 Max 2.5 ± 0.1 4.25 Max (1.5) 0.44 Max (0.2) 0.53 Max 0.48 Max 0.8 Min φ1 0.4 4.5 ± 0.1 1.8 Max Unit: mm (2.5) SC-62 (0.4) JEITA Package Code Ordering Information Part Name 2SC4807ERTR-E Quantity 1000 Shipping Container φ 178 mm Reel, 8 mm Emboss Taping Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.3.00 Aug 10, 2005 page 7 of 7 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. 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