CD/MP3 Quality Stereo 2:1 Multiplexer with Click and Pop Elimination ISL54405 Features The Intersil ISL54405 is a single supply, bidirectional, dual single-pole/double-throw (SPDT) ultra low distortion, high OFF-Isolation analog switch that can pass analog signals that are positive and negative with respect to ground. It is primarily targeted at consumer and professional audio switching applications such as computer sound cards and home theater products. The inputs can accommodate ground referenced signals up to 2VRMS while operating from a single 3.3V or 5V DC supply. The digital logic inputs are 1.8V logic-compatible when using a single 3.3V or 5V supply. It can be used in both AC or DC coupled ground referenced applications. • Clickless audio switching The ISL54405 features a soft-switch feature and click/pop circuitry at each signal pin that eliminates clicks and pops associated with power-up/down conditions of the preceding amplifier outputs. With -106dB THD+N performance with a 2VRMS signal into 20k load, superior signal muting, high PSRR and very flat frequency response, the ISL54405 meets the exacting requirements of consumer and professional audio engineers. The ISL54405 is available in 16 Ld TSSOP, 16 Ld 3mmx3mm TQFN, and 16 Ld 2.6mmx1.8mm µTQFN packages. It’s specified for operation over the -40°C to +85°C temperature range. • 2 switches • Switch type SPDT or 2 to 1 MUX • 2VRMS signal switching from 3.3V or 5V supply • -106dB THD+N into 20k load at 2VRMS • -108dB THD+N into 32 load at 3.9mW • Signal to noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >124dBV • ±0.01dB insertion loss at 1kHz, 20k load • ±0.007dB gain variation 20Hz to 20kHz • 125dB signal muting into 20k load • 90dB PSRR 20Hz to 20kHz • Single supply operation . . . . . . . . . . . . . . . . . . . . . . . . . 3.3V or 5V • Available in 16 Ld TSSOP, 16 Ld TQFN, and 16 Ld µTQFN • Pb-Free (RoHS compliant) Applications • Computer sound cards • Home theater audio products • SACD/DVD audio Related Literature • DVD player audio output switching • TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” • AN557 “Recommended Test Procedures for Analog Switches” • Headsets for MP3/cellphone switching • Hi-Fi audio switching application 5V_Supply DIR_SEL AC/DC MUTE SEL VDD ISL54405 LOGIC AND CLICK/POP CONTROL CAP_SS L1 L2 L R1 R R2 GND For 5V operation connect the 5V_Supply pin to 5V and float the VDD pin. For 3.3V operation connect the VDD pin to 3.3V and float the 5V_Supply pin. FIGURE 1. ISL54405 BLOCK DIAGRAM May 6, 2014 FN6699.2 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2008, 2014. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL54405 Pin Configurations (Note 1) ISL54405 (16 LD TQFN) TOP VIEW AC/DC 5V_Supply VDD CAP_SS AC/DC 5V_Supply VDD CAP_SS ISL54405 (16 LD µTQFN) TOP VIEW 16 15 14 13 16 15 14 13 L 2 11 L2 L 2 11 L2 R 3 10 R1 R 3 10 R1 SEL 4 9 R2 SEL 4 9 R2 5 6 7 8 5 6 7 8 GND L1 GND 12 DIR_SEL 1 GND MUTE GND L1 GND 12 DIR_SEL 1 GND MUTE ISL54405 (16 LD TSSOP) TOP VIEW 5V_Supply 1 16 VDD AC/DC 2 15 CAP_SS MUTE 3 14 L1 L 4 13 L2 R 5 12 R1 SEL 6 11 R2 GND 7 10 GND DIR_SEL 8 9 GND NOTE: 1. See Figure 1 on page 1. Submit Document Feedback 2 FN6699.2 May 6, 2014 ISL54405 Truth Table INPUTS OUTPUTS L1, R1 C/P SHUNTS L2, R2 C/P SHUNTS OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF ON OFF OFF OFF OFF ON ON ON OFF OFF OFF OFF 1 OFF ON OFF OFF OFF X OFF OFF ON OFF OFF AC/DC DIR MUTE SEL L1, R1 L2, R2 0 X 0 0 X 0 0 ON OFF 1 OFF ON 0 X 1 X OFF OFF 1 1 0 0 0 ON 0 0 1 OFF 1 0 1 X 1 1 0 0 1 1 0 1 1 1 COM (L, R) C/P SHUNTS NOTE: MUTE, AC/DC, DIR: Logic “0” 0.5V, Logic “1” 1.4V or float with a 3.3V supply or 5V supply. SEL: Logic “0” 0.5V, Logic “1” 1.4V with a 3.3V supply or 5V supply. X = Don’t Care Pin Descriptions PIN # TSSOP PIN # µTQFN, TQFN 16 14 VDD 1 15 5V_Supply 7, 9, 10 5, 7, 8 GND 15 13 CAP_SS Soft-start capacitor pin 3 1 MUTE Signal mute control pin 6 4 SEL Input select control pin 2 16 AC/DC 8 6 DIR_SEL Direction select control pin 5 3 R Analog switch common pin 4 2 L Analog switch common pin 11, 13 9, 11 R2, L2 Analog switch normally open pin 12, 14 10, 12 R1, L1 Analog switch normally closed pin PIN NAME DESCRIPTION System power supply pin (+3V to +3.6V) (float pin for 5V applications) 5V supply pin (+4.5V to +5.5V) (float pin for 3.3V applications) Ground connection AC/DC select control pin Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL54405IVZ (Notes 3, 4) 54405 IVZ -40 to +85 16 Ld TSSOP M16.173 ISL54405IRTZ (Notes 3, 4) 05TZ -40 to +85 16 Ld 3x3 TQFN L16.3x3A ISL54405IRUZ-T (Notes 2, 5) GAD -40 to+ 85 16 Ld µTQFN L16.2.6x1.8A NOTES: 2. Please refer to TB347 for details on reel specifications. 3. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate-e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Submit Document Feedback 3 FN6699.2 May 6, 2014 ISL54405 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4.0V 5V_Supply to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V Input Voltages SEL, MUTE, AC/DC, DIR_SEL (Note 6) . . . . . . . . . . -0.3 to ((VDD) + 0.3V) L1, L2, R1, R2 (Note 6) . . . . . . . . . . . . . . . . . . . . . . -3.1 to ((VDD) + 0.3V) Output Voltages R, L (Note 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3.1 to ((VDD) + 0.3V) Continuous Current L1, L2, R1, R2 or L, R . . . . . . . . . . . . . . . . . . ±300mA Peak Current L1, L2, R1, R2 or L, R (Pulsed 1ms, 10% Duty Cycle, Max). . . . . . . . . . . . . . . . . . . . . . ±500mA ESD Rating: Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >200V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2kV Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 16 Ld TSSOP Package (Note 7) . . . . . . . . . 110 41 16 Ld TQFN Package (Notes 8, 9) . . . . . . . 75 11 16 Ld µTQFN Package (Note 8) . . . . . . . . . 93 N/A Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. Signals on L1, L2, R1R2, MUTE, SEL, AC/DC, DIR_SEL, R, and L exceeding VDD or GND by specified amount are clamped. Limit current to maximum current ratings. 7. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 9. For JC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications 3.3V Supply: VDD = +3.0V to +3.6V, GND = 0V, VDIR_SEL = VAC/DC = GND, V5V_SUPPLY = Float, VSIGNAL = 2VRMS, RLOAD = 20kΩ , f = 1kHz, VSELH = VMUTEH = 1.4V, VSELL = VMUTEL = 0.5V, CAP_SS = 0.1µF, (Note 10), Unless otherwise specified. PARAMETER TEST CONDITIONS SUPPLY TEMP MIN (V) (°C) (Notes 11, 12) TYP MAX (Notes 11, 12) UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG 3.3, 5 Full - 2 - VRMS 25 - 1.9 - ON-Resistance, rON VDD = 3.3V, IR or IL = 80mA, VLx or VRx = -2.828V to +2.828V (See Figure 5) 3.3 rON Matching Between Channels, rON VDD = 3.3V, IR or IL = 80mA, VLx or VRx = Voltage at max rON over -2.828V to +2.828V (Note 15) 3.3 rON Flatness, rFLAT(ON) VDD = 3.3V, IR or IL = 80mA, VLx or VRx = -2.828V, 0V, +2.828V (Note 13) 3.3 VDD = 3.6V, VLx or VRx = -2.83V, 2.83V, VL or VR = -2.83V, 2.83V, VAC/DC = 0V, VMUTE = 3.6V, measure current, calculate resistance. 3.6 L, R, Lx, Rx Pull-down Resistance Full - 2.6 - 25 - 0.023 - Full - 0.045 - 25 - 0.003 0.01 Full - 0.009 - 25 225 300 375 k Full - 345 - k 25 - -106 - dB VSIGNAL = 1.9VRMS, f = 1kHz, A-weighted filter, RLOAD = 20k 25 - -113 - dB VSIGNAL = 1.8VRMS, f = 1kHz, A-weighted filter, RLOAD = 20k 25 - -116 - dB VSIGNAL = 0.707VRMS, f = 1kHz, A-weighted filter, RLOAD = 32 25 - -100 - dB 3.3, 5 25 - >124 - dBV 3.3 25 - ±0.01 - dB DYNAMIC CHARACTERISTICS THD+N VSIGNAL = 2VRMS, f = 1kHz, A-weighted filter, RLOAD = 20k SNR f = 20Hz to 20kHz, A-weighted filter, inputs grounded, RLOAD = 20k or 32 Insertion Loss, GON f = 1kHz, RLOAD = 20k Submit Document Feedback 4 3.3, 5 FN6699.2 May 6, 2014 ISL54405 Electrical Specifications 3.3V Supply: VDD = +3.0V to +3.6V, GND = 0V, VDIR_SEL = VAC/DC = GND, V5V_SUPPLY = Float, VSIGNAL = 2VRMS, RLOAD = 20kΩ , f = 1kHz, VSELH = VMUTEH = 1.4V, VSELL = VMUTEL = 0.5V, CAP_SS = 0.1µF, (Note 10), Unless otherwise specified. PARAMETER TEST CONDITIONS SUPPLY TEMP MIN (V) (°C) (Notes 11, 12) TYP MAX (Notes 11, 12) UNITS Gain vs Frequency, Gf f = 20Hz to 20kHz, RLOAD = 20k, reference to GON at 1kHz 3.3 25 - ±0.007 - dB Stereo Channel Imbalance L1 and R1, L2 and R2 f = 20Hz to 20kHz, RLOAD = 20k 3.3 25 - ±0.003 - dB OFF-Isolation (Muting) f = 20Hz to 22kHz, L = R = 2VRMS, RLOAD = 20k, MUTE = AC/DC = 3.3V, DIR_SEL = GND, SEL = “X” 3.3, 5 25 - 120 - dB f = 20Hz to 22kHz, L1, R1, L2, R2 = 2VRMS, RLOAD = 20kMUTE = AC/DC = DIR_SEL = 3.3V, SEL = “X” 25 - 120 - dB f = 20Hz to 22kHz, VL or VR = 0.7VRMS, RLOAD = 32 25 - 125 - dB 25 - 120 - dB 25 - 120 - dB 3.3, 5 25 - 110 - dB Crosstalk (Channel-toChannel) RL = 20k, f = 20Hz to 20kHz, VSIGNAL = 2VRMS, signal source impedance = 20, Note 16 3.3 RL = 32, f = 20Hz to 20kHz, VSIGNAL = 0.7VRMS, signal source impedance = 20, Note 16 PSRR f = 1kHz, VSIGNAL= 100mVRMS, inputs grounded 25 - 90 - dB Bandwidth, -3dB RLOAD = 50 3.3 25 - 230 - MHz ON to Mute Time, TTRANS-OM CAP_SS = 0.1µF 3.3 25 - 50 - ns Mute to ON Time, TTRANS-MO CAP_SS = 0.1µF (Selectable via soft-start capacitor value) 3.3 25 - 58 - ms Turn-ON Time, tON VDD = 3.3V, VLx or VRx = 1.5V, VMUTE = 0V, RL = 20k (See Figure 2) 3.3 25 - 45 - µs Turn-OFF Time, tOFF VDD = 3.3V, VLx or VRx = 1.5V, VMUTE = 0V, RL = 20k (See Figure 2) 3.3 25 - 50 - ns Break-Before-Make Time Delay, tD VDD = 3.6V, VLx or VRx = 1.5V, VMUTE = 0V, RL = 20k (See Figure 3) 3.6 25 - 45 - µs OFF-Isolation RL = 50, f = 1MHz, VL or VR = 1VRMS (See Figure 4) 3.3 25 - 100 - dB Crosstalk (Channel-toChannel) RL = 50, f = 1MHz, VL or VR = 1VRMS (See Figure 6) 3.3 25 - 70 - dB Lx, Rx OFF Capacitance, COFF f = 1MHz, VLx or VRx = VL or VR = 0V (See Figure 7) 3.3 25 - 10 - pF L, R ON Capacitance, CCOM(ON) f = 1MHz, VLx or VRx = VCOM = 0V (See Figure 7) 3.3 25 - 27 - pF 3.3 Full 3 - 3.6 V 5 Full 4.5 - 5.5 V 25 - 54 65 µA f = 20kHz, VSIGNAL= 100mVRMS, inputs grounded POWER SUPPLY CHARACTERISTICS Power Supply Range, VDD 5V_Supply = Float Power Supply Range, 5V_Supply VDD = Float Positive Supply Current, I+ VDD = +3.6V, VMUTE = 0V, VSEL = 0V or VDD 3.6 Full - 59 - µA VDD = +3.6V, VMUTE = VDD, VSEL = 0V or VDD 3.6 25 - 14 18 µA 3.6 Full - 15 - µA 3.6 25 - 55 65 µA 3.6 Full - 58 - µA 3.3, 5 Full - - 0.5 V VDD = +3.6V, VMUTE = 0V, VSEL = 1.8V DIGITAL INPUT CHARACTERISTICS Input Voltage Low, VSELL, VMUTEL Submit Document Feedback 5 FN6699.2 May 6, 2014 ISL54405 Electrical Specifications 3.3V Supply: VDD = +3.0V to +3.6V, GND = 0V, VDIR_SEL = VAC/DC = GND, V5V_SUPPLY = Float, VSIGNAL = 2VRMS, RLOAD = 20kΩ , f = 1kHz, VSELH = VMUTEH = 1.4V, VSELL = VMUTEL = 0.5V, CAP_SS = 0.1µF, (Note 10), Unless otherwise specified. PARAMETER SUPPLY TEMP MIN (V) (°C) (Notes 11, 12) TEST CONDITIONS Input Voltage High, VSELH, VMUTEH TYP MAX (Notes 11, 12) UNITS 3.3, 5 Full 1.4 - - V Input Current, ISELH, ISELL VDD = 3.6V, VMUTE = 0V, VSEL = 0V or VDD 3.6 Full -0.5 0.01 0.5 µA Input Current, IAC/DCL, IDIR_SELL VDD = 3.6V, VAC/DC, VDIR_SEL = 0V, VMUTE = Float, VSEL = VDD 3.6 Full -1.3 -0.7 0.3 µA Input Current, IAC/DCH, IDIR_SELH VDD = 3.6V, VAC/DC, VDIR_SEL = VDD, VMUTE = 0V, VSEL = 0V 3.6 Full -0.5 0.01 0.5 µA Input Current, IMUTEL VDD = 3.6V, VSEL = VDD, VMUTE = 0V 3.6 Full -1.3 -0.7 0.3 µA Input Current, IMUTEH VDD = 3.6V, VSEL = 0V, VMUTE = VDD 3.6 Full -0.5 0.01 0.5 µA NOTES: 10. VIN = input voltage to perform proper function. 11. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 13. Flatness is defined as the difference between maximum and minimum value of ON-resistance at the specified analog signal voltage points. 14. Limits established by characterization and are not production tested. 15. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value. 16. Crosstalk is inversely proportional to source impedance. Test Circuits and Waveforms VDD LOGIC INPUT 50% C 0V tOFF SWITCH V Lx OR VRx INPUT SWITCH INPUT VOUT Lx OR Rx L or R SEL VOUT 90% SWITCH OUTPUT VDD tr < 20ns tf < 20ns 90% LOGIC INPUT GND MUTE RL CL 0V tON Logic input waveform is inverted for switches that have the opposite logic sense. Repeat test for all switches. CL includes fixture and stray capacitance. RL ----------------------V OUT = V (Lx or Rx) R + r L ON FIGURE 2B. TEST CIRCUIT FIGURE 2A. MEASUREMENT POINTS FIGURE 2. SWITCHING TIMES Submit Document Feedback 6 FN6699.2 May 6, 2014 ISL54405 Test Circuits and Waveforms (Continued) VDD LOGIC INPUT VDD 0V C Lx VNX SWITCH OUTPUT VOUT VOUT R OR L Rx CL RL 90% SEL 0V tD GND LOGIC INPUT MUTE Repeat test for all switches. CL includes fixture and stray capacitance. FIGURE 3B. TEST CIRCUIT FIGURE 3A. MEASUREMENT POINTS FIGURE 3. BREAK-BEFORE-MAKE TIME VDD VDD C SIGNAL GENERATOR C rON = V1/80mA MUTE Lx or Rx Lx or Rx VNX SEL 0V OR VDD 80mA L, R ANALYZER SEL V1 0V OR VDD L, R GND GND MUTE RL Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. Repeat test for all switches. FIGURE 5. rON TEST CIRCUIT FIGURE 4. OFF-ISOLATION TEST CIRCUIT VDD VDD C SIGNAL GENERATOR Lx OR Rx Lx or Rx L, R SEL SEL Lx or Rx L, R GND RL MUTE Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. FIGURE 6. CROSSTALK TEST CIRCUIT Submit Document Feedback 0V OR VDD IMPEDANCE ANALYZER 0V OR VDD ANALYZER C 7 L, R NC GND MUTE Repeat test for all switches. FIGURE 7. CAPACITANCE TEST CIRCUIT FN6699.2 May 6, 2014 ISL54405 Sound Card AC Coupled Application Block Diagrams FLOAT DIR_SEL AC/DC MUTE LOGIC µ-CONTROLLER SEL 3.3V 5V_Supply VDD ISL54405 LOGIC AND CLICK/POP CONTROL CAP_SS 0.1µF L L SOFT-START CAPACITOR L1 L1 L2 FRONT PANEL LINE OUT OR HEADPHONE JACK R1 AUDIO CODEC R1 R R R2 L2 BACK PANEL LINE OUT OR HEADPHONE JACK R2 GND FLOAT DIR_SEL AC/DC MUTE LOGIC µ-CONTROLLER SEL 3.3V 5V_Supply VDD ISL54405 LOGIC AND CLICK/POP CONTROL L FRONT PANEL LINE OUT OR HEADPHONE JACK CAP_SS 0.1µF L1 L SOFT-START CAPACITOR L1 L2 AUDIO CODEC R1 R2 R R R1 L2 AUDIO GND CODEC R2 Detailed Description The ISL54405 is a single supply, bidirectional, dual single pole/double throw (SPDT) ultra low distortion, high OFF-Isolation analog switch. It was designed to operate from either a 3.3V or 5V single supply. When operated with a 3.3V or 5V single supply, the switches can accommodate ±2.83VPEAK (2VRMS) ground reference analog signals. The switch rON flatness across this range is extremely small resulting in excellent THD+N performance (0.0006% with 20k load and 0.0014% with 32 load at 707mVRMS). The T-Type configuration of the switch cells prevents signals from getting through to the output when a switch is in the OFF-state providing for superior mute performance (>120dB) in audio applications. Submit Document Feedback 8 The ISL54405 has special circuitry to eliminate click and pops in the speakers during power-up and power-down of the audio CODEC drivers, during removal and insertion of headphones, and while switching between sources and loads. The ISL54405 was designed primarily for consumer and professional audio switching applications such as computer sound cards and home theater products. The “Sound Card AC Coupled Application Block Diagrams” show two typical sound card applications. In the upper block diagram the ISL54405 is being used to route a single stereo source to either the front or back panel line outs of the computer sound card. In the lower block diagram the ISL54405 is being used to multiplex two stereo sources to a single line out of the computer sound card. FN6699.2 May 6, 2014 ISL54405 SPDT Switch Cell Architecture and Performance Characteristics Supply Voltage, Signal Amplitude, and Grounding The normally open (L2, R2) and normally closed (L1, R1) of the SPDT switches are T-Type switches that have a typical rON of 1.9and an off-isolation of >120dB. The low on-resistance (1.9and rON flatness (0.003) provide very low insertion loss and minimal distortion to applications that require hi-fidelity signal reproduction. The power supply connected at VDD or the 5V_Supply pin provides power to the ISL54405 part. The ISL54405 is a single supply device that was designed to be operated with a 3.3V ±10% DC supply connected at the VDD pin or a 5V ±10% DC supply connected at the 5V_Supply pin. The SPDT switch cells have internal charge pumps that allow for signals to swing below ground. They were specifically designed to pass audio signals that are ground referenced and have a swing of ± 2.828VPEAK while driving either 10k/20k (receiver) or 32 (headphone) loads. Each switch cell incorporates special circuitry to gradually decrease the switch resistance when transitioning from the OFF-state (high impedance) to the ON-state (1.9). The gradual decrease in the switch resistance provides for a slow ramp of the voltage at the load side of the switch which helps to eliminate clicks and pops in the speaker by suppressing the transient during switching events. The output voltage ramp time is determined by the capacitor value of the soft-start capacitor connected at the CAP_SS pin. With a 0.1µF ceramic chip capacitor the ramp time is approximately 4.6V/s. The slow ramping of the signal at the output can be disabled by floating the CAP_SS pin. In addition to the slow ramp feature (soft-start feature) of the in line switches, the part has special click and pop (C/P) shunt circuitry at each of the signal pins (L, R, L1, L2, R1, and R2). A pin’s C/P shunt circuitry is activated or deactivated depending on the logic levels applied at the AC/DC and DIR_SEL control pins. This shunt circuitry serves two functions: 1. In an AC coupled application they are activated and directed to the source side of the switch to suppress or eliminate click/pop noise in the speaker load when powering up or down of the audio CODEC drivers. 2. For superior muting the C/P shunt circuitry is activated and directed to the load side of the switch which gives >120dB of OFF-Isolation when driving a 10k/20k receiver load with an audio signal in the range of 20Hz to 22kHz. If the AC/DC pin is driven LOW, all C/P shunt circuitry at all the signal pins (L, R, L1, R1, L2, and R2) are deactivated and not operable. If the AC/DC pin is driven HIGH, then the logic at the DIR_SEL pin will determine whether the L and R (COM) C/P shunt circuitry is activated or the L1, L2, R1, and R2 (NOx, NCx) C/P shunt circuitry is activated. When the DIR_SEL is driven LOW, the L1, R1, L2, R2 C/P shunt circuitry will be activated while the L and R C/P shunt circuitry will be deactivated. When the DIR_SEL is driven HIGH, the L and R C/P shunt circuitry will be activated while the L1, R1, L2, R2 C/P shunt circuitry will be deactivated. Note: Shunt circuitry that is activated will be turned ON when a switch cell is turned OFF and will be OFF when a switch cell is turned ON. MUTE TO ON It was specifically designed to accept ground referenced 2VRMS (± 2.828VPEAK) audio signals at its signal pins while driving either 10k/20k receiver loads or 32 headphone loads. When using the part in a 3.3V application the 5V_Supply pin should be left floating. A 0.1µF decoupling capacitor should be connected from the VDD pin to ground to minimize power supply noise and transients. This capacitor should be located as close to the pin as possible. The part also has a 5V supply pin (5V_Supply) to allow it to be used in 5V ±10% applications. Special circuitry within the device converts the 5V, connected at the 5V_Supply pin, too 3.3V to properly power the internal circuitry of the device. When using the part in a 5V application the VDD pin should be left floating. A 0.1µF decoupling capacitor should be connected from the 5V_Supply pin to ground to minimize power supply noise. This capacitor should be located as close to the pin as possible. Grounding of the ISL54405 should follow a star configuration (see Figure 8). All grounds of the IC should be directly connected to the power supply ground return without cascading to other grounds. This configuration isolates shunt currents of the Click and Pop transients from the IC ground and optimizes device performance. +3.3V MUTE SEL AC/DC DIR_SEL VDD GND2 LOGIC CONTROL GND3 L L1 L2 R R1 R2 ISL54405 0.1µF GND1 FIGURE 8. STAR GROUNDING CONFIGURATION Mute Operation When the MUTE logic pin is driven HIGH the part will go into the mute state. In the mute state all switches of the SPDTs are open while the T-Shunt switches are closed. In addition any activated click and pop shunt circuitry at the signal pins is turned on. See “Logic Control” on page 10 for more details. to the ON-state in the following sequence: When the MUTE pin is driven LOW, the ISL54405 will transition Submit Document Feedback 9 FN6699.2 May 6, 2014 ISL54405 1. All active shunt switches turn off quickly. 2. The resistance of the switches selected by the SEL pin will gradually decrease in resistance. They will decrease from their high OFF-resistance to their ON-resistance of 1.9. This gradual decrease in resistance will allow for the voltage at the load to increase gradually. The voltage ramp rate at the load is determined by the value of the capacitor connected at the CAP_SS pin, see Figures 28 and 29 on page 16. Table 1 indicates how the signal ramp rate at the load changes as you change the CAP_SS capacitor value. It also shows how the mute turn-on time is affected. TABLE 1. SIGNAL RAMP-RATE LOAD CHANGE WITH CAP SS CAPACITOR VALUE RAMP RATE TURN-ON TIME No Capacitor 6250V/s 65µs 0.05µF 10.3V/s 30ms 0.1µF 4.6V/s 58ms ON TO MUTE determine the location of the C/P (click/pop) shunt circuitry and if it will be active or not. See “Truth Table” on page 3. The ISL54405 logic is 1.8V CMOS compatible (Low 0.5V and High 1.4V) over a supply range of 3.0V to 3.6V at the VDD pin or 4.5V to 5.5V at the 5V_Supply pin. This allows control via 1.8V or 3V µ-controller. SEL, MUTE CONTROL PINS The state of the SPDT switches of the ISL54405 device is determined by the voltage at the MUTE pin and the SEL pin. The SEL control pin is only active when MUTE is logic “0”. The MUTE has an internal pull-up resistor to the internal 3.3V supply rail and can be driven HIGH or tri-stated (floated) by the µ-processor. These pins are 1.8V logic compatible. When powering the part by the VDD pin the logic voltage can be as high as the VDD voltage which is typically 3.3V. When powering the part by the 5V_Supply pin the logic voltage can be as high as the 5V_Supply voltage which is typically 5V. When the MUTE pin is driven HIGH, the switches will turn off quickly (50ns) and the active shunt switches will turn on quickly. Note: There is no gradual ramping of the switch resistance in this direction. Logic Levels: MUTE = Logic “0” (Low) when 0.5V MUTE = Logic “1” (High) when 1.4V or floating SEL = Logic “0” (Low) when 0.5V SEL = Logic “1” (High) when 1.4V OFF-ISOLATION IN THE MUTE STATE AC/DC AND DIR_SEL CONTROL PINS When in the mute state, the level of OFF-Isolation across the audio band is dependent on the signal amplitude, external loading, and location of the activated C/P (click/pop) shunt circuitry. During muting, the logic of the ISL54405 can be configured to activate the C/P shunt circuitry on the load side of the switch or on the source side of the switch, or deactivated on both sides of the switch. With a 0.707VRMS signal driving a 32 headphone load, the location of the C/P shunt circuitry has little effect on the off-isolation performance (>120dB of off-isolation in all configurations), see Figure 12 on page 13. With a 2VRMS signal driving a 20k amplifier load, the best OFF-Isolation is achieved by placing the C/P shunt circuitry on the load side of the switch (>120dB across the audio band). The OFF-Isolation decreases when placing the C/P shunt circuitry on the source side of the switch (>85dB across the audio band), see Figure 11 on page 13. Note: For AC coupled applications when powering up or down of the audio drivers the C/P shunts should be activated on the source side of the switch. See “Click and Pop Operation” on page 11. When using the switch for muting of the audio signal the C/P shunt circuitry should be deactivated on the source side of the switch and directed to the load side of the switch for best possible OFF-Isolation. Logic Control The ISL54405 contains C/P (click/pop) shunt circuitry on its COM pins (L, R) and on its signal pins (L1, R1, L2, R2). The activation of this circuitry and whether it is located on the COM or signal side of the switch is determined by the logic levels applied at the AC/DC and DIR_SEL pins. The DIR_SEL control pin is only active when AC/DC is logic “1”. Note: Any activated C/P shunt circuitry is ON when in the mute state (MUTE = Logic “1”) and OFF in the audio state (MUTE = Logic “0”). When AC/DC is logic “0”, all of the C/P shunt circuitry on both sides of the switch is deactivated and not operable. When AC/DC is logic “1” then the DIR_SEL logic level determines whether the shunt circuitry will be activated on the COM side of the switch or on the signal side of the switch. When DIR_SEL = Logic “1” the C/P shunts on the COM side (L,R) are activated and inoperable on the signal side (L1, R1, L2, R2) of the switch. When DIR_SEL = Logic “0” the C/P shunts are activated on the signal side (L1, R1, L2, R2) and inoperable on the COM side (L, R). Logic Levels: AC/DC, DIR_SEL = Logic “0” (Low) when 0.5V AC/DC, DIR_SEL = Logic “1” (High) when 1.4V or Floating. The AC/DC and DIR_SEL have internal pull-up resistors to the internal 3.3V supply rail and can be driven HIGH or tri-stated (floated by the µ-processor). They should be driven to ground for a logic “0” (Low). Note: For 5V applications, the AC/DC and DIR_SEL pins should never be driven to the external 5V rail. They need to be driven with 1.8V logic or 3V logic circuit. The ISL54405 has four logic control pins; the AC/DC, DIR_SEL, MUTE, and SEL. The MUTE and SEL control pins determine the state of the switches. The AC/DC and DIR_SEL control pins Submit Document Feedback 10 FN6699.2 May 6, 2014 ISL54405 AC Coupled or DC Coupled Operation The Audio CODEC drivers can be directly coupled to the ISL54405 when the audio signals from the drivers are ground referenced or do not have a significant DC offset voltage, <50mV. Otherwise, the signal should be AC coupled to the ISL54405 part. CLICK AND POP OPERATION The ISL54405 has special circuitry to eliminate click and pops in the speakers during power-up and power-down of the Audio CODEC Drivers and during removal and insertion of headphones. A different click and pop scheme is required depending on whether the audio CODEC drivers are AC coupled or DC coupled to the inputs of the ISL54405 part. AC COUPLED CLICK AND POP OPERATION Single supply audio drivers have their signal biased at a DC offset voltage, usually at 1/2 the DC supply voltage of the driver. As this DC bias voltage comes up or goes down during power up or down of the driver a transient can be coupled into the speaker load through the DC blocking capacitor (see the “Sound Card AC Coupled Application Block Diagrams” on page 8). When a driver is off and suddenly turned on, the rapidly changing DC bias voltage at the output of the driver will cause an equal voltage at the input side of the switch due to the fact that the voltage across the blocking capacitor cannot change instantly. If the switch is in audio mode or there is no low impedance path to discharge the capacitor voltage at the input of the switch, before turning on the switch, a transient discharge will occur in the speaker, generating a click and pop noise. Proper elimination of a click/pop transient at the speaker load while powering up or down of the audio driver requires that the ISL54405 have its C/P shunts activated on the source side of the switch and then placed in mute mode. This allows the transient generated by the audio drivers to be discharged through the click and pop shunt circuitry. Once the driver DC bias has reached VDD/2 and the transient on the switch side of the DC blocking capacitor has been discharged to ground through the C/P shunt circuitry, the switches can be turned on and connected through to the speaker loads without generating an undesirable click/pop in the speakers. With a typical DC blocking capacitor of 220µF and the C/P shunt circuitry designed to have a resistance of 40allowing a 100ms wait time to discharge the transient before placing the switch in the audio mode will prevent the transient from getting through to the speaker load. See Figures 26 and 27 on page 15. CLICK AND POP ELIMINATION WHEN CONNECTED TO HIGH IMPEDANCE SOURCE AND LOAD By design, in order to flatten the RON resistance of the switch across the signal range (±3V) a current gets added to the signal path. When the ISL54405 part is connected to a high impedance source (i.e. AC coupled to the input of the switch) Submit Document Feedback 11 and a high impedance load, (such as the impedance of a 20k to 100k preamplifier stage) a DC offset voltage will be present on the signal line in the range of 35mV to 135mV. When the switch is turned off, this offset voltage gets pulled to ground. During switching, this change in the offset voltage can cause a click and pop noise to be heard in the downstream speaker. Placing a 1kresistor from the output of the switch to ground will lower the offset voltage to around 1.5mV, thereby effectively eliminating the click and pop noise. The 1k resistor is small enough to reduce the voltage offset significantly while not increasing power dissipation dramatically. Power consumption will need to be considered when using a smaller impedance under this scenario. When connected to a low impedance load such as headphones (32), the current added to the signal line results in a minimal DC offset voltage on the signal line and does not cause click and pop noise when the switch is turned off. DC COUPLED CLICK AND POP OPERATION The ISL54405 can pass ground referenced audio signals which allows it to be directly connected to audio drivers that output ground referenced audio signals, eliminating the need for a DC blocking capacitor. Audio drivers that swing around ground, however, do generate some DC offset, from a few millivolts to tens of millivolts. When switching between audio channels or muting the audio signal, these small DC offset levels of the drivers can generate a transient that can cause unwanted clicks and pops in the speaker loads. In a DC coupled application the C/P shunt resistors placed at the source side of the switch have no effect in eliminating the transients at the speaker loads when transitioning in and out of the mute state or switching between channels. In fact, having these C/P shunts active on the source side unnecessarily increases the power consumption. So, for DC coupled connection, the C/P shunt circuitry should not be applied at the source (driver) side of the switch. For DC coupled applications the ISL54405 has a special soft-start feature that slowly ramps the DC offset voltage from the audio driver to the speaker load when turning on a switch channel. The ramp rate at the load is determined by the capacitor value connected at the CAP_SS pin. Lab experimentation has shown that if you can slow the voltage ramp rate at the speaker to <10V/s, you can eliminate click/pop noise in a speaker. A soft-start capacitor value of 0.1µF provides for 4.5V/s ramp rate and is recommended. See Figures 28 and 29 on page 16. See “MUTE to ON” on page 9 for more detail of how soft-start works. Supply Sequencing and Overvoltage Protection With any CMOS device, proper power supply sequencing is required to protect the device from excessive input currents which might permanently damage the IC. All I/O pins contain ESD protection diodes or diode stacks from the pin to VDD and to GND (see Figure 9). To prevent forward biasing these diodes, FN6699.2 May 6, 2014 ISL54405 VDD must be applied before any input signals, and the signal voltages must remain between VDD and -3V and the logic voltage must remain between VDD and ground. If these conditions cannot be guaranteed, then precautions must be implemented to prohibit the current and voltage at the logic pin and signal pins from exceeding the maximum ratings of the switch. The following two methods can be used to provided additional protection to limit the current in the event that the voltage at a signal pin goes below ground by more than -3V or above the VDD rail and the logic pin goes below ground or above the VDD rail. Logic inputs can be protected by adding a 1k resistor in series with the logic input (see Figure 9). The resistor limits the input current below the threshold that produces permanent damage, and the sub-microamp input current produces an insignificant voltage drop during normal operation. This method is not acceptable for the signal path inputs. Adding a series resistor to the switch input defeats the purpose of using a low rON switch. Connecting Schottky diodes to the signal pins, as shown in Figure 9 will shunt the fault current to the supply or to ground thereby protecting the switch. These Schottky diodes must be sized to handle the expected fault current and to clamp when the voltage reaches the overvoltage limit. Submit Document Feedback 12 . OPTIONAL SCHOTTKY DIODE VDD OPTIONAL PROTECTION RESISTOR LOGIC INPUT VNX VCOM OPTIONAL SCHOTTKY DIODE GND FIGURE 9. OVERVOLTAGE PROTECTION High-Frequency Performance In 50 systems, the ISL54405 has a -3dB bandwidth of 230MHz (see Figure 30). The frequency response is very consistent over varying analog signal levels. An OFF-switch acts like a capacitor and passes higher frequencies with less attenuation, resulting in signal feed-through from a switch’s input to its output. OFF-Isolation is the resistance to this feed-through, while crosstalk indicates the amount of feed-through from one switch to another. Figure 31 details the high OFF-Isolation and crosstalk rejection provided by this part. At 1MHz, Off-Isolation is about 100dB in 50 systems, decreasing approximately 20dB per decade as frequency increases. Higher load impedances decrease OFF-Isolation and crosstalk rejection due to the voltage divider action of the switch off impedance and the load impedance. FN6699.2 May 6, 2014 ISL54405 Typical Performance Curves 80 3.0 VDD = 3.3V 90 +85°C ICOM = 80mA 2.5 VDD = 3.3V OR V_Supply = 5V C/P SHUNT ON SIGNAL SIDE RLOAD = 20k VSIGNAL = 2VRMS OFF- ISOLATION (dB) 100 2.0 rON (Ω) TA = +25°C, Unless Otherwise Specified +25°C 1.5 -40°C 1.0 110 120 NO C/P SHUNT 130 140 C/P SHUNT ON LOAD SIDE 150 0.5 160 0 -3 -2 -1 0 1 2 170 20 3 VCOM (V) VDD = 3.3V OR V_Supply = 5V RLOAD = 32 VSIGNAL = 0.707VRMS 120 C/P SHUNT ON SIGNAL SIDE 140 NO C/P SHUNT C/P SHUNT ON LOAD SIDE 150 CROSSTALK (dB) OFF- ISOLATION (dB) 110 130 160 170 180 20 50 100 200 500 1k FREQUENCY (Hz) 2k 5k 10k 20k FIGURE 12. OFF-ISOLATION, 0.707VRMS SIGNAL, 32LOAD CROSS TALK (dB) -95 -100 -80 -85 VDD = 3.3V -90 RLOAD = 20k -95 VSIGNAL = 2VRMS -100 -105 -110 -115 -120 -125 -130 -135 -140 -145 -150 -155 -160 -165 -170 20 50 100 200 500 1k FREQUENCY (Hz) VDD = 3.3V 0.045 RLOAD = 32 VDD = 3.3V RLOAD = 20k 0.040 VSIGNAL = 2VRMS VSIGNAL = 0.707VRMS -105 -110 -115 -120 -125 -130 -135 2k 5k 10k 20k 2k 5k 10k 20k 0.035 0.030 0.025 0.020 0.015 0.010 -140 -145 -150 20 1k 0.050 INSERTION LOSS (dB) -90 500 FIGURE 13. CHANNEL-TO-CHANNEL CROSSTALK -80 -85 200 FIGURE 11. OFF-ISOLATION, 2VRMS SIGNAL, 20kLOAD 80 100 100 FREQUENCY (Hz) FIGURE 10. ON-RESISTANCE vs SWITCH VOLTAGE 90 50 0.005 50 100 200 500 1k 2k FREQUENCY (Hz) 5k 10k 20k FIGURE 14. CHANNEL-TO-CHANNEL CROSSTALK Submit Document Feedback 13 0.000 20 100 1k FREQUENCY (Hz) 10k 20k FIGURE 15. INSERTION LOSS vs FREQUENCY FN6699.2 May 6, 2014 ISL54405 Typical Performance Curves 0.05 TA = +25°C, Unless Otherwise Specified (Continued) 0.020 VDD = 3.3V 0.04 RLOAD = 20k 0.03 VSIGNAL = 2VRMS 0.01 0.00 -0.01 -0.02 STEREO IMPBALNCE (dB) RELATIVE TO 1kHz 0.02 GF (dB) VDD = 3.3V RLOAD = 20k 0.015 VSIGNAL = 2VRMS 0.010 0.005 L2 AND R2 0 -0.005 L1 AND R1 -0.010 -0.03 -0.015 -0.04 -0.05 20 100 1k 10k -0.020 20 20k FREQUENCY (Hz) FIGURE 16. GAIN vs FREQUENCY -90 -94 -96 0.0020 10k 20k VDD = 3.3V RLOAD = 32 A-WEIGHTED FILTER -98 THD+N (%) -100 THD+N (%) 1k FREQUENCY (Hz) FIGURE 17. STEREO IMBALANCE vs FREQUENCY VDD = 3.3V RLOAD = 32 A-WEIGHTED FILTER -92 100 -102 -104 1VP-P -106 -108 0.0010 0.0009 0.0008 0.0007 0.0006 0.0005 1VP-P 0.0004 510mVP-P 0.0003 -110 510mVP-P -112 0.0002 -114 -116 -118 -120 20 50 100 200 500 1k 2k 5k 0.0001 10k 20k 20 50 100 FREQUENCY (Hz) -100 -101 -102 -103 -104 -105 -106 -107 -108 -109 -110 -111 -112 -113 -114 -115 -116 -117 -118 -119 -120 5k 10k 20k FIGURE 19. THD+N vs SIGNAL LEVELS vs FREQUENCY 0.0010 0.0009 0.0008 0.0007 VDD = 3.3V RLOAD = 20k A-WEIGHTED FILTER VDD = 3.3V RLOAD = 20k A-WEIGHTED FILTER 0.0006 2VRMS 0.0005 THD+N (%) THD+N( dB) FIGURE 18. THD+N vs SIGNAL LEVELS vs FREQUENCY 200 500 1k 2k FREQUENCY (Hz) 1.9VRMS 1.8VRMS 0.0004 2VRMS 0.0003 1.9VRMS 0.0002 1.8VRMS 1.5VRMS 1.5VRMS 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) FIGURE 20. THD+N vs SIGNAL LEVELS vs FREQUENCY Submit Document Feedback 14 0.0001 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) FIGURE 21. THD+N vs SIGNAL LEVELS vs FREQUENCY FN6699.2 May 6, 2014 ISL54405 -100 -101 -102 -103 -104 -105 -106 -107 -108 -109 -110 -111 -112 -113 -114 -115 -116 -117 -118 -119 -120 VDD = 3.3V RLOAD = 20k 10Hz to 30k FILTER TA = +25°C, Unless Otherwise Specified (Continued) 2VRMS 1.9VRMS 1.7VRMS TO 1.8VRMS THD+N (%) THD+N (dB) Typical Performance Curves 1.6VRMS 1.5VRMS 20 50 100 200 500 1k 2k FREQUENCY (Hz) 5k 0.00100 0.00095 0.00090 0.00085 0.00080 0.00075 0.00070 0.00065 0.00060 0.00055 0.00050 0.00045 0.00040 0.00035 0.00030 0.00025 0.00020 0.00015 0.00010 10k 20k PSRR (dB) PSRR (dB) 2VRMS 1.9VRMS 1.7VRMS TO 1.8VRMS 1.6VRMS 1.5VRMS 20 50 100 200 500 1k 2k 5k 10k 20k FIGURE 23. THD+N vs SIGNAL LEVELS vs FREQUENCY -60 -65 VDD = 3.3VDC + 100mVRMS SIGNAL -70 RLOAD = 20k OR 32 -75 INPUTS GROUNDED -80 -85 -90 -95 AUDIO MODE -100 -105 -110 -115 MUTE MODE -120 (C/P SHUNT ON LOADSIDE) -125 -130 -135 -140 20 50 100 200 500 1k 2k 5k 10k 20k 40k FREQUENCY (Hz) -50 -55 5V_Supply = 5VDC + 100MVRMS SIGNAL -60 RLOAD = 20k OR 32 -65 -70 INPUTS GROUNDED -75 -80 -85 -90 -95 -100 AUDIO MODE -105 -110 -115 MUTE MODE -120 (C/P SHUNT ON LOADSIDE) -125 -130 -135 -140 20 50 100 200 500 1k 2k 5k 10k 20k 40k FREQUENCY (Hz) FIGURE 24. PSRR vs FREQUENCY FIGURE 25. PSRR vs FREQUENCY 7 7 6 MUTE 2V/DIV VDD/2 2V/DIV 5 4 6 4 3 3 2 2 1 0 LIN -1 200mV/DIV -2 0 -1 -3 -4 LOUT -5 200mV/DIV -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 TIME (s) 100ms/DIV 15 LIN 200mV/DIV LOUT 200mV/DIV -6 0.1 0.2 0.3 FIGURE 26. 20k AC COUPLED CLICK/POP REDUCTION Submit Document Feedback 2V/DIV -2 -4 -6 VDD/2 1 -3 -5 2V/DIV MUTE 5 VOLTAGE (V) VOLTAGE (V) 10Hz TO 30k FILTER FREQUENCY (Hz) FIGURE 22. THD+N vs SIGNAL LEVELS vs FREQUENCY -7 VDD = 3.3V RLOAD = 20k 0.4 -7 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 TIME (s) 100ms/DIV 0.1 0.2 0.3 0.4 FIGURE 27. 32 AC COUPLED CLICK/POP REDUCTION FN6699.2 May 6, 2014 ISL54405 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) 80 80 LEFT INPUT LEFT INPUT 60 60 40 40 LEFT OUTPUT 0 RIGHT OUTPUT -20 4.6V/s -40 -60 -20 -20 0 20 TIME (ms) 40 60 80 RIGHT OUTPUT -20 0 20 40 60 80 100 TIME (ms) FIGURE 29. SOFT-START (0.05µF) CLICK/POP REDUCTION FIGURE 28. SOFT-START (0.1µF) CLICK/POP REDUCTION 0 VDD = 3.3V RLOAD = 50 0 10.3V/s VDD = 3.3V CAP_SS = 0.05µF -80 -100 -80 -60 -40 100 LEFT OUTPUT RIGHT INPUT -60 VDD = 3.3V 10.3V/s 0 -40 RIGHT INPUT CAP_SS = 0.1µF -80 -100 -80 -60 -40 -1 -2 OFF-ISOLATION (dB) NORMALIZED GAIN (dB) 20 -3 0 VDD = 3.3V RLOAD = 50 20 -20 40 -40 CROSSTALK 60 -60 80 -80 CROSSTALK (dB) 20 VOLTAGE (mV) VOLTAGE (mV) 4.6V/s ISOLATION 100 120 1 10 FREQUENCY (MHz) 100 FIGURE 30. FREQUENCY RESPONSE 300 -100 1k 10k 100k 1M 10M FREQUENCY (Hz) 100M -120 500M FIGURE 31. CROSSTALK AND OFF-ISOLATION Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 3376 PROCESS: Submicron CMOS Submit Document Feedback 16 FN6699.2 May 6, 2014 ISL54405 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE May 6, 2014 FN6699.2 Updated entire datasheet to new format. Updated Ordering Information on page 3. Updated ΘJA and ΘJC for the TSSOP package on page 4. Added section, “Click and POP Elimination When Connected to High Impedance Source and Load” on page 11 Replaced the PODs with the latest revision. June 5, 2008 FN6699.1 Updated typo in Figure 28 on page 16 - changed "CAP_SS = 0.5µF" to be "CAP_SS = 0.05µF" to match value in title. May 15, 2008 FN6699.0 Initial Release About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 17 FN6699.2 May 6, 2014 ISL54405 Package Outline Drawing M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 2, 5/10 A 1 3 5.00 ±0.10 SEE DETAIL "X" 9 16 6.40 PIN #1 I.D. MARK 4.40 ±0.10 2 3 0.20 C B A 1 8 B 0.65 0.09-0.20 END VIEW TOP VIEW 1.00 REF - 0.05 H C 1.20 MAX SEATING PLANE 0.90 +0.15/-0.10 GAUGE PLANE 0.25 +0.05/-0.06 5 0.10 M C B A 0.10 C 0°-8° 0.05 MIN 0.15 MAX SIDE VIEW 0.25 0.60 ±0.15 DETAIL "X" (1.45) NOTES: 1. Dimension does not include mold flash, protrusions or gate burrs. (5.65) Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. 2. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 3. Dimensions are measured at datum plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Dimension does not include dambar protrusion. Allowable protrusion shall be 0.08mm total in excess of dimension at maximum material condition. Minimum space between protrusion and adjacent lead (0.65 TYP) (0.35 TYP) TYPICAL RECOMMENDED LAND PATTERN is 0.07mm. 6. Dimension in ( ) are for reference only. 7. Conforms to JEDEC MO-153. Submit Document Feedback 18 FN6699.2 May 6, 2014 ISL54405 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D L16.2.6x1.8A B 16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS 6 INDEX AREA 2X A N SYMBOL E 0.10 C 1 2 2X 0.10 C MIN 0.10 C C A 0.05 C A1 SIDE VIEW e PIN #1 ID K 1 2 NX L L1 0.45 0.50 0.55 - - - 0.05 - 0.127 REF (DATUM B) (DATUM A) BOTTOM VIEW - b 0.15 0.20 0.25 5 D 2.55 2.60 2.65 - E 1.75 1.80 1.85 - 0.40 BSC - K 0.15 - - - L 0.35 0.40 0.45 - L1 0.45 0.50 0.55 - N 16 2 Nd 4 3 Ne 4 3 NX b 5 16X 0.10 M C A B 0.05 M C NOTES A e SEATING PLANE MAX A1 A3 TOP VIEW NOMINAL 0 - 12 4 Rev. 6 1/14 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.25mm from the terminal tip. CL (A1) NX (b) L 5 e SECTION "C-C" 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. TERMINAL TIP C C 8. Maximum allowable burrs is 0.076mm in all directions. 9. JEDEC Reference MO-255. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 3.00 1.80 1.40 1.40 2.20 0.90 0.40 0.20 0.50 0.20 0.40 10 LAND PATTERN Submit Document Feedback 19 FN6699.2 May 6, 2014 ISL54405 Package Outline Drawing L16.3x3A 16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 7/11 4X 1.5 3.00 16X 0.50 A B 13 6 PIN 1 INDEX AREA 16 6 PIN #1 INDEX AREA 1 3.00 12 1 .50 ± 0 . 15 9 (4X) 4 0.15 8 5 TOP VIEW 16X 0.40 ± 0.10 0.10 M C A B + 0.07 4 16X 0.23 - 0.05 BOTTOM VIEW SEE DETAIL "X" ( C 0.10 C BASE PLANE SEATING PLANE 0.08 C 0 . 75 ± 0.05 ( 2. 80 TYP ) 1. 50 ) SIDE VIEW ( 12X 0 . 5 ) ( 16X 0 . 23 ) C 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. ( 16X 0 . 60) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. Submit Document Feedback 20 FN6699.2 May 6, 2014