MIXA80W1200TED Six-Pack XPT IGBT VCES =1200 V IC25 = 120 A VCE(sat)= 1.8 V Part name (Marking on product) MIXA80W1200TED 15, 16 25, 26 17 1 5 9 2 6 10 NTC 18 3 4 7 11 8 12 23, 24 21, 22 19, 20 E72873 Pin configuration see outlines. 13, 14 27, 28 Features: Application: Package: •Easy paralleling due to the positive temperature coefficient of the on-state voltage •Rugged XPT design (Xtreme light Punch Through) results in: - short circuit rated for 10 µsec. - very low gate charge -square RBSOA @ 3x IC - low EMI •Thin wafer technology combined with the XPT design results in a competitive low VCE(sat) •SONIC™ diode - fast and soft reverse recovery - low operating forward voltage •AC motor drives •Solar inverter •Medical equipment •Uninterruptible power supply •Air-conditioning systems •Welding equipment •Switched-mode and resonant-mode power supplies •"E2-Pack" standard outline •Insulated copper base plate •Soldering pins for PCB mounting •Temperature sense included IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved 20100827d 1-7 MIXA80W1200TED Ouput Inverter T1 - T6 Ratings Symbol Definitions Conditions VCES collector emitter voltage VGES VGEM max. DC gate voltage max. transient collector gate voltage continuous transient IC25 IC80 collector current Ptot total power dissipation VCE(sat) min. typ. max. Unit 1200 V ±20 ±30 V V TC = 25°C TC = 80°C 120 84 A A TC = 25°C 390 W collector emitter saturation voltage IC = 77 A; VGE = 15 V TVJ= 25°C TVJ=125°C 1.8 2.1 2.1 V V VGE(th) gate emitter threshold voltage IC = 3 mA; VGE = VCE TVJ= 25°C 6.0 6.5 V ICES collector emitter leakage current VCE = VCES; VGE = 0 V TVJ= 25°C TVJ=125°C 0.03 0.6 0.2 mA mA IGES gate emitter leakage current VGE = ±20 V 500 nA QG(on) total gate charge VCE = 600 V; VGE = 15 V; IC = 75 A 230 nC td(on) tr td(off) tf Eon Eoff turn-on delay time current rise time turn-off delay time current fall time turn-on energy per pulse turn-off energy per pulse inductive load VCE = 600 V; IC = 75 A VGE = ±15 V; RG = 10 W 70 40 250 100 6.8 8.3 ns ns ns ns mJ mJ RBSOA reverse bias safe operating area VGE = ±15 V; RG = 10 W; SCSOA tSC ISC short circuit safe operating area short circuit duration short circuit current VCE = 900 V; VGE = ±15 V; RG = 10 W; non-repetitive RthJC thermal resistance junction to case (per IGBT) TVJ= 25°C 5.4 TVJ=125°C TVJ=125°C VCEK = 1200 V TVJ = 125°C 225 A 10 µs A 0.32 K/W 300 Output Inverter D1 - D6 Ratings Symbol Definitions Conditions VRRM max. repetitve reverse voltage IF25 IF80 forward current VF forward voltage Qrr IRM trr Erec reverse recovery charge max. reverse recovery current reverse recovery time reverse recovery energy VR = 600 V diF /dt = -1600 A/µs IF = 100 A; VGE = 0 V RthJC thermal resistance junction to case (per diode) min. typ. max. Unit TVJ= 25°C 1200 V TC = 25°C TC = 80°C 135 90 A A IF = 100 A; VGE = 0 V TVJ= 25°C TVJ=125°C 1.95 1.95 2.2 V V TVJ=125°C 12.5 100 350 4 µC A ns mJ 0.4 K/W TC = 25°C unless otherwise stated IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved 20100827d 2-7 MIXA80W1200TED Temperature Sensor NTC Symbol R25 B25/50 Definitions resistance Conditions Definitions Conditions TC = 25°C min. 4.75 Ratings typ. max. 5.0 5.25 3375 Unit kW K min. -40 Ratings typ. max. 125 150 125 Unit °C °C °C 3000 V~ Module Symbol TVJ TVJM Tstg operating temperature max. virtual junction temperature storage temperature VISOL isolation voltage -40 IISOL < 1 mA; 50/60 Hz CTI comparative tracking index Md mounting torque (M5) 3 dS dA creep distance on surface strike distance through air 6 6 Rpin-chip resistance pin to chip RthCH thermal resistance case to heatsink 200 with heatsink compound Weight 6 Nm mm mm 2.5 mW 0.02 K/W 180 g Equivalent Circuits for Simulation I V0 Symbol V0 R0 V0 R0 R0 Definitions IGBT Conditions T1 - T6 min. TVJ=150°C free wheeling diode D1 - D6 TVJ=150°C Ratings typ. max. 1.1 17.9 1.09 9.1 Unit V mW V mW TC = 25°C unless otherwise stated IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved 20100827d 3-7 MIXA80W1200TED Circuit Diagram 15, 16 25, 26 17 1 5 9 2 6 10 3 7 11 4 8 12 23, 24 21, 22 19, 20 NTC 18 13, 14 27, 28 Outline Drawing Detail Y Detail X Ø 2.1; l=6 15° ±0.05 1.2 baseplate typ. 100 µm convex over 75 mm before mounting ±0.05 Ø 2.1 75.7 1.5 Ø 2.5 ±0.1 +0.3 Ø6 Detail Z 82.3 ±1° 0.8 7 -0.5 ±0.02 Z 0.8 Y 17±0.5 20.5 ±0.1 3.5-0.5 Dimensions in mm (1 mm = 0.0394“) B 20 19 22 21 6 86.1 76.98 16 15 27 28 14 13 93 107.5 1112 7.62 0 7.62 A 11.43 20.95 76.98 73.17 61.74 9 10 65.55 7 8 54.12 5 6 50.31 38.88 3 4 42.69 19.83 27.45 16.02 1 2 31.26 11 11.43 18 17 25 26 Ø5.5 ±0.2 45 20.95 X 24 23 38.4 32 ±0.2 73.17 57.93 61.74 38.88 42.69 23.64 0 19.83 72.7 j n0.4 A B ±0.2 ±0.3 Product Marking Part number M = Module I = IGBT X = XPT A = standard 80 = Current Rating [A] W = Six-Pack 1200 = Reverse Voltage [V] T = NTC ED = E2-Pack XXXXXXXXXX yywwa Logo UL Part name Date Code Data Matrix Ordering Part Name Marking on Product Standard MIXA80W1200 TED MIXA80W1200TED IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved Delivering Mode Base Qty Ordering Code Box 6 508642 20100827d 4-7 MIXA80W1200TED Transistor T1 - T6 140 IC [A] 140 VGE = 15 V 120 120 100 100 TVJ = 25°C 80 60 [A] 40 20 20 0.5 1.0 1.5 2.0 2.5 3.0 9V 60 40 0 0.0 0 0.0 3.5 11 V TVJ = 125°C IC 80 TVJ = 125°C 13 V VGE = 15 V 17 V 19 V 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VCE [V] VCE [V] Fig. 1 Typ. output characteristics Fig. 2 Typ. output characteristics 20 140 IC = 75 A VCE = 600 V 120 15 100 80 VGE [A] 60 [V] IC 40 5 TVJ = 125°C 20 0 10 TVJ = 25°C 5 6 7 8 9 10 11 12 0 13 0 50 100 150 16 9 10 E E 8 [mJ] 6 [mJ] 4 Eoff 0 0 20 40 Eoff 8 7 Eon IC = 75 A VCE = 600 V VGE = ±15 V TVJ = 125°C 6 Eon 2 300 10 RG = 10 Ω VCE = 600 V VGE = ±15 V TVJ = 125°C 12 250 Fig. 4 Typ. turn-on gate charge Fig. 3 Typ. tranfer characteristics 14 200 QG [nC] VGE [V] 60 80 100 120 140 160 IC [A] Fig. 5 Typ. switching energy vs. collector current IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved 5 8 10 12 14 16 18 20 22 24 RG [Ω] Fig. 6 Typ. switching energy vs. gate resistance 20100827d 5-7 MIXA80W1200TED Inverter D1 - D6 200 24 TVJ = 125°C VR = 600 V 20 150 200 A Qrr 16 IF 100 [A] 100 A [µC] 12 TVJ = 125°C 50 TVJ = 25°C 0 0.0 0.5 1.0 50 A 8 1.5 2.0 2.5 4 1000 3.0 1200 1400 160 2000 2200 700 TVJ = 125°C 140 [A] 1800 Fig. 8 Typ. reverse recov.charge Qrr vs. di/dt Fig. 7 Typ. Forward current versus VF IRR 1600 diF /dt [A/µs] VF [V] 200 A 600 100 A 500 VR = 600 V 120 trr 50 A 100 TVJ = 125°C VR = 600 V 200 A 400 [ns] 300 80 100 A 200 60 50 A 100 40 1000 1200 1400 1600 1800 2000 0 1000 2200 1200 1400 1600 1800 2000 2200 diF /dt [A/µs] diF /dt [A/µs] Fig. 9 Typ. peak reverse current IRM vs. di/dt Fig. 10 Typ. recovery time trr versus di/dt 1 8 200 A TVJ = 125°C VR = 600 V Diode 6 IGBT 100 A Erec ZthJC 0.1 4 [mJ] 50 A IGBT [K/W] 1 2 3 4 2 0 1000 1200 1400 1600 1800 2000 2200 diF /dt [A/µs] Fig. 11 Typ. recovery energy Erec versus di/dt IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved 0.01 0.001 0.01 FRD Ri ti Ri ti 0.072 0.037 0.156 0.055 0.002 0.03 0.03 0.08 0.092 0.067 0.155 0.086 0.002 0.03 0.03 0.08 0.1 1 10 tp [s] Fig. 12 Typ. transient thermal impedance 20100827d 6-7 MIXA80W1200TED NTC 100000 10000 R 1000 [Ω] 100 10 0 25 50 75 100 125 150 TC [°C] Fig.13 Typ. NTC resistance vs. temperature IXYS reserves the right to change limits, test conditions and dimensions. © 2010 IXYS All rights reserved 20100827d 7-7