RoHS and Pb-Free Component Material

®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB1EGLTPxxxP
CZB1EGTTPxxxP
0402, 25% Bead
Part Weight (mg):
1
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
Tin (Sn)
Pb
Nickel (Ni)
Palladium
Other material
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight PPM
0.2
2000
0
0
0
0
0
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
1.8
0.2
2
0.09
18000
2000
20000
900
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
outer termination
outer termination
middle termination&inner termination
inner termination & electrodes
®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Part Weight (mg):
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB2AFTTDxxxP
CZB2AFTTDxxxP
0805, 25% Bead
1
Tin (Sn)
Pb
Nickel (Ni)
Palladium
Other material
Now Available
Now Available
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
2
0
2
0.09
20000
0
20000
900
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
outer termination
middle termination&inner termination
inner termination & electrodes
®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB1JGLTExxxP
CZB1JGTTExxxP
0402, 25% Bead
Part Weight (mg):
2.7
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
Tin (Sn)
Pb
Nickel (Ni)
Palladium
Other material
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight PPM
0.2
2000
0
0
0
0
0
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
1.8
0.2
2
0.09
18000
2000
20000
900
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
outer termination
outer termination
middle termination&inner termination
inner termination & electrodes
®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB1JGLTExxxP
CZB1JGTTExxxP
0402, 25% Bead
Part Weight (mg):
2.7
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
Tin (Sn)
Pb
Nickel (Ni)
Palladium
Other material
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight PPM
0.2
2000
0
0
0
0
0
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
1.8
0.2
2
0.09
18000
2000
20000
900
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
outer termination
outer termination
middle termination&inner termination
inner termination & electrodes
®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Part Weight (mg):
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB1JGTTExxxP
CZB1JGTTExxxP
0603, 25% Bead
2.7
Tin (Sn)
Now Available
Now Available
Nickel (Ni)
Palladium
Other material
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
2
20000
outer termination
2
0.09
20000
900
middle termination&inner termination
inner termination & electrodes
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB1JGLTExxxP
CZB1JGTTExxxP
0603, 25% Bead
Part Weight (mg):
2.7
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
Tin (Sn)
Pb
Nickel (Ni)
Palladium
Other material
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight PPM
0.2
2000
0
0
0
0
0
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
1.8
0.2
2
0.09
18000
2000
20000
900
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
outer termination
outer termination
middle termination&inner termination
inner termination & electrodes
®
RoHS and Pb-Free Component Material Declaration
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
Part Weight (mg):
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
CZB1EGTTPxxxP
CZB1EGTTPxxxP
0402, 25% Bead
1
Tin (Sn)
Pb
Nickel (Ni)
Palladium
Other material
Now Available
Now Available
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
2
0
2
0.09
20000
0
20000
900
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100
outer termination
middle termination&inner termination
inner termination & electrodes
®
RoHS and Pb-Free Component Material Declaration
material breakdown is for the KOA P/N in B7
KOA SPEER ELECTRONICS, INC.
Product Information
KOA Part Number:
RoHS/Pb-Free Compliant Part Number:
Part Description:
Breakdown of all Materials
CZB2AGTTExxxP
CZB2AGTTExxxP
0805, 25% Bead
Part Weight (mg):
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Materials
Silver (Ag)
Triiron Tetroxide
Nickel III oxide
Zinc Oxide
1
Tin (Sn)
Now Available
Now Available
Nickel (Ni)
Palladium
Other material
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
(All materials in the part)
PPM
Where Used
29100 inner termination & electrodes
465000 Ferrite material (Homogeneous)
279000 Ferrite material (Homogeneous)
186000 Ferrite material (Homogeneous)
% Weight
2.91
46.5
27.9
18.6
2
20000
outer termination
2
0.09
20000
900
middle termination&inner termination
inner termination & electrodes
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
% Weight PPM
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
0
0
Selenium & Selenium Compounds
0
0
0
0
0
0
0
0
0
0
0
0
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Reportable Substances (Con't)
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
260
5
3
1
Sn
3µm
Ni
3µm
Yes
minimum
minimum
% Weight
PPM
0
0
0
0
0
0
0
2
0
0
0
0
0
0
0
20000
0.09
900
2.91
29100