Reliability Report Litelink III CPC5620.CPC5621.CPC5622 32L

Reliability Report: Litelink III CPC5620.CPC5621.CPC5622 32L SOIC
Qualification Report No.: 2012-020
Reliability Report
Reliability Data for Litelink III CPC5620.CPC5621.CPC5622
32L SOIC
Report Title:
Reliability Data for Litelink III
CPC5620.CPC5621.CPC5622 32L SOIC
Report Number:
2012-020
Date:
8/13/12
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-273-5273, WWW.IXYSIC.COM
Page 1 of 5
Reliability Report: Litelink III CPC5620.CPC5621.CPC5622 32L SOIC
Qualification Report No.: 2012-020
Introduction:
This report summarizes the Reliability data of IXYS Integrated Circuits Division Litelink III
CPC5620.CPC5621.CPC5622. The Reliability data presented here were collected during
IXYS IC Division’s product qualification and Reliability Monitor program. The purpose of
this qualification was to verify IXYS IC Division Quality and Reliability requirements as
outlined in the internal specifications. The Litelink III CPC5620.CPC5621.CPC5622 is
manufactured at IXYS IC Division and assembled at ATEC in the Philippines. The process
is IXYS IC Division P10 and Litelink III CPC5620.CPC5621.CPC5622 is available in a
32L SOIC package type.
Reliability Tests:
Table 1 below provides the qualification tests that were performed. The stress tests and
sample size are chosen based on the IXYS IC Division internal specifications and with the
approval of the product development team and quality assurance.
Table 1: Litelink III CPC5620.CPC5621.CPC5622 Reliability Tests
Product Package Stress Test
CPC5621A/
CPC5622A
32L SOIC
CPC5621A/
CPC5622A
32L SOIC
CPC5621A/
CPC5622A
32L SOIC
CPC5621A/
CPC5622A
32L SOIC
CPC5621A/
CPC5622A
32L SOIC
THB
Applicable Specs
and Readpoints
JESD22,
A101
Stress
Conditions
85°C, 85%
1000 hrs
# Lots Sample Size Total
4
77
308
Thermal Shock Mil-Std-883,
M1011
4
55
220
Temp Cycle
4
55
220
2
50
100
2
15
30
2
9
18
High
Temp Storage
0 to 100°C,
10/10 dwells,
15 cycles
Mil-Std-883, N1010,-55 to 125°C,
“B”
10/10 dwells,
300 cycles
JESD22-A103C
125°C,
1000hrs
ESD
HBM
JESD22,
A114-E
1.5kΩ, 100pF
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-273-5273, WWW.IXYSIC.COM
Page 2 of 5
Reliability Report: Litelink III CPC5620.CPC5621.CPC5622 32L SOIC
Qualification Report No.: 2012-020
Reliability Test Results:
The stress tests and associated results for Litelink III CPC5620.CPC5621.CPC5622
qualification are summarized in Table 2. The devices chosen for the qualification were from
standard material manufactured through normal production test flow and electrically tested
to datasheet limits prior to stressing. Then reliability stresses were conducted and
electrically tested to datasheet limit at each interval and final readpoints.
Table 2: Litelink III CPC5620.CPC5621.CPC5622 Reliability Test Results
Product/
Package
Stress/
Kits
CPC5621A
32L SOIC
CPC5621A
32L SOIC
CPC5622A
32L SOIC
CPC5622A
32L SOIC
CPC5621A
32L SOIC
THB
T38184
THB
T48921
THB
T40840
THB
T51364
Thermal
Shock
T38184
Thermal
Shock
T48921
Thermal
Shock
T40840
Thermal
Shock
T51364
Temp
Cycle
T38184
Temp
Cycle
T48921
Temp
Cycle
T40840
CPC5621A
32L SOIC
CPC5622A
32L SOIC
CPC5622A
32L SOIC
CPC5621A
32L SOIC
CPC5621A
32L SOIC
CPC5622A
32L SOIC
Readpoint 1 Readpoint 2 Readpoint 3
/ Reject/
/ Reject/
/ Reject/
SS
SS
SS
168 hrs.
500 hrs.
1000 hrs.
0/77
0/77
0/77
168 hrs.
500 hrs.
1000 hrs.
0/77
0/77
0/77
168 hrs.
500 hrs.
1000 hrs.
0/77
0/77
0/77
168 hrs.
500 hrs.
1000 hrs.
0/77
0/77
0/77
15 Cycles
0/55
Comments
15 Cycles
0/55
15 Cycles
0/55
15 Cycles
0/55
300 Cycles
0/55
300 Cycles
0/55
300 Cycles
0/55
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-273-5273, WWW.IXYSIC.COM
Page 3 of 5
Reliability Report: Litelink III CPC5620.CPC5621.CPC5622 32L SOIC
Qualification Report No.: 2012-020
Product/
Package
Stress/
Kits
CPC5622A
32L SOIC
Temp
Cycle
T51364
High
Temp
Storage
T48921
High
Temp
Storage
T51364
CPC5621A
32L SOIC
CPC5622A
32L SOIC
Readpoint 1 Readpoint 2 Readpoint 3
/ Reject/
/ Reject/
/ Reject/
SS
SS
SS
300 Cycles
0/55
168 hrs.
0/50
500 hrs.
0/50
1000 hrs.
0/50
168 hrs.
0/50
500 hrs.
0/50
1000 hrs.
0/50
Comments
ESD Testing Results:
As part of this qualification, the product Litelink III CPC5620.CPC5621.CPC5622 was
subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a
KeyTek Zapmaster system. The results are summarized in Table 3. All samples were
electrically tested to data sheet limits before and after ESD stressing and they passed after
+/- 1000V zapping.
Table3: Litelink III CPC5620.CPC5621.CPC5622 ESD Characterization Results
ESD
Kit
Package
ESD Test
RC
Highest
Class
Model Number
Spec
Network Passed
HBM
CPC5621A/ 32L SOIC
JESD22,
1000V
1C
1.5kΩ,
CPC5622A
A114-E
100pF
T38184
T48921
T40840
T51364
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-273-5273, WWW.IXYSIC.COM
Page 4 of 5
Reliability Report: Litelink III CPC5620.CPC5621.CPC5622 32L SOIC
Qualification Report No.: 2012-020
FIT (Failure in Time) Rate of Litelink III CPC5620.CPC5621.CPC5622
Table 4 below summarizes the FIT rate from the THB data. For THB stress, FITs were
calculated based on the 85°C /85% RH test condition with 40°C/60% RH ambient use
conditions at the activation energy of 0.7 eV and equivalent device hours. The FIT rate
came out to be 26.29 FITs.
Table 4: Litelink III CPC5620.CPC5621.CPC5622 FIT Rate Summary
Product/
Lot
# of
# of
Hours Test
Eq. Device
Stress
Number Devices Failed Tested Temp Hours
(°°C)
CPC5621A/ T38184
308
0
1000
85
34,996,805
CPC5622A
T48921
THB
T40840
T51364
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-273-5273, WWW.IXYSIC.COM
Page 5 of 5
FITs
@ 60%
CL
26.29