Reliability Report-IXD_609 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-001 Reliability Report Reliability Data for IXD_609 Series VIS Foundry Process CU05UMS12010 Report Title: Reliability Data for IXD_609 Series VIS Foundry Process CU05UMS12010 Report Number: 2011-001 Date: 1/7/11 Clare an IXYS Company, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.CLARE.COM Page 1 of 6 Reliability Report-IXD_609 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-001 Introduction: This report summarizes the Reliability data of Clare’s IXD_609 Series. The Reliability data presented here were collected during Clare’s product qualification. The purpose of this qualification was to verify the Clare’s Quality and Reliability requirements as outlined in Clare’s internal specifications. The IXD_609 Series Gate Driver silicon is foundered at Vanguard International Semiconductor, Corp. (VIS) and assembled at Atec in the Philippines. The VIS process is CU05UMS12010. Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on the Clare’s specification P-04-25-WW, “Reliability, Risk Analysis and Qualification Procedure” and with the approval of the product development team and quality assurance. Table 1: Product Family IXD_609 Series Reliability Tests Stress Test HTOL Applicable Stress Specs Conditions Mil-Std-883 125°C, 80% HTOL Mil-Std-883 Latch Up JESD78 HAST JESD22, A110-C Thermal Mil-Std-883, Shock (T/S) M1011 Temp Cycle Mil-Std-883, (T/C) N1010, “B” High Temp JESD22Storage A103C MSL J-STD020D.1 ESD JESD22, HBM A114-E Product/ Package IXDD609 SOIC – 8L EP IXDD609PI 125°C, 80% 8 Pin DIP Trigger Pulse = 1us, IXDD609 5vpp, VCC = =18V SOIC – 8L EP IXDD604SIA 130°C, 85% SOIC – 8L EP 18.8PSI, 96hrs 0 to 100°C, 10/10 IXDD604SIA dwells, 15 cycles SOIC – 8L EP -55 to 125°C, 10/10 IXDD604SIA SOIC – 8L EP dwells, 300 cycles IXDD604SIA 125°C, 1000hrs SOIC – 8L EP IR Reflow, IXDD604SIA Level 1 SOIC – 8L EP IXDD609 1.5kΩ, 100pF SOIC – 8L EP Number Sample Total of Lots Size (SS) SS 1 77 77 1 90 90 1 2 2 2 76 152 3 55 165 3 55 165 3 50 150 3 50 150 3 25 75 Clare an IXYS Company, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.CLARE.COM Page 2 of 6 Reliability Report-IXD_609 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-001 Reliability Test Results: The stress tests and associated results for the product family IXD_609 Series qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: Product Family IXD_609 Series Reliability Test Results Stress Test HTOL HTOL Latch Up N-MOS Product/Kit Number IXDD609 S0027 Wafer 002 IXDD609PI C00039 1023 IXDD609 S0027 Wafer 002 Readpoint / (Reject/ SS) 1000 hrs. Comments Qual Lot#1 Data 0/77 1000 hrs. Qual Lot#1 Data 0/90 VNN=10.8V Qual Lot#1 Data INN=1mA Current Into Output=9Amps 0/2 Latch Up P-MOS IXDD609 S0027 Wafer 002 VPP=10.6V Qual Lot#1 Data IPP=1.1mA Current Into Output=9Amps 0/2 HAST IXDD604SIA AV0001 0928 IXDD604 C00058 1023 96 hrs. Qual Lot#1, #2 Data 0/152 Clare an IXYS Company, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.CLARE.COM Page 3 of 6 Reliability Report-IXD_609 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-001 Stress Test Product/Kit Number Thermal Shock IXDD604SIA AV0001 0928 Thermal Shock IXDD604SIA AV0002 0929 Thermal Shock IXDD604SIA AV0005 0944 Temp Cycle IXDD604SIA AV0001 0928 Temp Cycle IXDD604SIA AV0002 0929 Temp Cycle IXDD604SIA AV0005 0944 High Temp IXDD604SIA Storage AV0001 0928 High Temp Storage Readpoint / (Reject/ SS) 15 Cycles Comments Qual Lot#1 Data 0/55 15 Cycles Qual Lot#2 Data 0/55 15 Cycles Qual Lot#3 Data 0/55 300 Cycles Qual Lot#1 Data 0/55 300 Cycles Qual Lot#2 Data 0/55 300 Cycles Qual Lot#3 Data 0/55 1000 hrs. Qual Lot#1 Data 0/50 IXDD604SIA AV0002 0929 IXDD604SIA AV0005 0944 IXDD604SIA AV0001 0928 1000 hrs. IR Reflow Level 1 0/50 Qual Lot#1 Data MSL IXDD604SIA AV0002 0929 IR Reflow Level 1 0/50 Qual Lot#2 Data MSL IXDD604SIA AV0005 0944 IR Reflow Level 1 0/50 Qual Lot#3 Data High Temp Storage MSL Qual Lot#2 Data 0/50 1000 hrs. Qual Lot# 3 Data 0/50 Clare an IXYS Company, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.CLARE.COM Page 4 of 6 Reliability Report-IXD_609 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-001 ESD Testing Results: As part of this qualification, the product family IXD_609 Series was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/-3000V zapping. Table3: Product Family IXD_609 Series ESD Characterization Results ESD Product/Kit Package ESD Test RC Highest Class Model Number Spec Network Passed HBM IXDD609 SOIC – 8L EP JESD22, 3000V 2 1.5kΩ, C00038 A114-E 100pF FIT (Failure in Time) Rate on the Product Family IXD_609 Series: Table 4 summarizes the number of devices used for the product family IXD_609 Series reliability stress with associated failures. Using the HTOL data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy according to the Clare’s procedure P-04-25-WW for 125°C test temperature and 40°C use temperatures. The calculated FITs from the reliability stress came out to be 21.57 for HTOL. Using the HAST data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy according to Clare’s procedure P04-25-WW for 130°C test temperature and 40°C use temperatures. The calculated FITs from the reliability stress came out to be 44.03 for HAST. Table 4: Product Family IXD_609 Series FIT Rate Summary Qual# Stress Product/Kit # of # of Hours Act. Acc. Equivalent FIT Rate Number Devices Fails Tested Energy Factor Dev. Hours @ 60% CL 1 2 HTOL IXDD609 S0027 Wafer 002 IXDD609PI C00039 1023 HAST IXDD604SIA AV0001 0928 IXDD604SIA C00058 1023 167 0 1000 0.7 152 0 96 0.7 255.41 42,652,796 21.57 20,892,615 44.03 1.4318E +03 Clare an IXYS Company, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.CLARE.COM Page 5 of 6 Reliability Report-IXD_609 Series VIS Foundry Process CU05UMS12010 Qualification No: 2011-001 Conclusion: The qualification of the product family IXD_609 Series has been successfully completed for the production release. The reliability and process data for VIS CU05UMS12010 can be found at S:/REED/Projects/New Process Information/Vanguard. Clare an IXYS Company, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-27-CLARE, WWW.CLARE.COM Page 6 of 6