Reliability Report-CPC5002G Qualification No: 2011-011 Reliability Report Reliability Data for CPC5002G Report Title: Reliability Data for CPC5002G Report Number: 2011-011 Date: 11/16/11 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 1 of 6 Reliability Report-CPC5002G Qualification No: 2011-011 Introduction: This report summarizes the Reliability data of IXYS IC Division CPC5002G. The Reliability data presented here were collected during IXYS IC Division product qualification. The purpose of this qualification was to verify IXYS IC Division Quality and Reliability requirements as outlined in IXYS IC Division internal specifications. The CPC5002G silicon is foundered at ON-SEMI and assembled at Atec in the Philippines. The ON-SEMI process is D3N (reference qual by comparison CPC5750, CPC5902G, CPC5903G). Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on IXYS IC Division internal specifications and with the approval of the product development team and quality assurance. Table 1: Product CPC5002G Reliability Tests Stress Test HTOL Applicable Stress Specs Conditions Mil-Std-883 125°C, 80% Product/ Package CPC5002G 8 Pin Dip Thermal Mil-Std-883, 0 to 100°C, 10/10 CPC5002G Shock (T/S) M1011 dwells, 15 cycles 8 Pin Dip Temp Cycle Mil-Std-883, -55 to 125°C, 10/10 CPC5002G (T/C) N1010, “B” dwells, 8 Pin Dip 300 cycles High Temp JESD22CPC5002G 125°C, 1000hrs Storage A103C 8 Pin Dip MSL J-STDIR Reflow, CPC5002G 020D.1 Level 1 8 Pin Dip ESD JESD22, CPC5002G 1.5kΩ, 100pF HBM A114-E 8 Pin Dip Number Sample Total of Lots Size (SS) SS 3 55 165 3 50 150 3 50 150 3 50 150 1 50 50 2 9 18 Reliability Test Results: IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 2 of 6 Reliability Report-CPC5002G Qualification No: 2011-011 The stress tests and associated results for the product CPC5002G qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: Product CPC5002G Reliability Test Results Stress Test Product/Kit Number HTOL CPC5002 TE3099 1126 HTOL CPC5002 TE3100 1127 HTOL CPC5002 TE3101 1128 Thermal Shock CPC5002 TE3099 1126 Thermal Shock CPC5002 TE3100 1127 Thermal Shock CPC5002 TE3101 1128 Temp Cycle CPC5002 TE3099 1126 Temp Cycle CPC5002 TE3100 1127 Readpoint / (Reject/ SS) 1000 hrs. Comments Qual Lot#1 Data 0/55 1000 hrs. Qual Lot#2 Data 0/55* 1000 hrs. Qual Lot#3 Data 0/55 15 Cycles Qual Lot#1 Data 0/50 15 Cycles Qual Lot#2 Data 0/50 15 Cycles Qual Lot#3 Data 0/50 300 Cycles Qual Lot#1 Data 0/50 300 Cycles Qual Lot#2 Data 0/50 *NOTE: Failures not considered in FIT calculation due to results of the FA Report FA11-153 (BSOB lift 500hrs and 1000hrs). IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 3 of 6 Reliability Report-CPC5002G Qualification No: 2011-011 Stress Test Temp Cycle High Temp Storage High Temp Storage High Temp Storage MSL Product/Kit Number CPC5002 TE3101 1128 CPC5002 TE3099 1126 CPC5002 TE3100 1127 CPC5002 TE3101 1128 CPC5002 TE3099 1126 Readpoint / (Reject/ SS) 300 Cycles Comments Qual Lot#3 Data 0/50 192 hrs. Qual Lot#1 Data 0/50 192 hrs. Qual Lot#2 Data 0/50* 192hrs. Qual Lot# 3 Data 0/50 IR Reflow Level 1 0/50 Qual Lot#1 Data *Note: BSOB wire issue failure evaluated in FA Report FA11-146 ESD Testing Results: As part of this qualification, the product CPC5002G was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/-4000V testing. Table3: Product CPC5002G ESD Characterization Results ESD Product/Kit Package ESD Test RC Highest Class Model Number Spec Network Passed HBM CPC5002G 8 Pin Dip JESD22, 4000V 3A 1.5kΩ, TE3099 A114-E 100pF TE3101 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 4 of 6 Reliability Report-CPC5002G Qualification No: 2011-011 FIT (Failure in Time) Rate on the Product CPC5002G: Table 4 summarizes the number of devices used for the product CPC5002G reliability stress with associated failures. Using the HTOL data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy for 125°C test temperature and 40°C use temperatures. The calculated FITs from the reliability stress came out to be 21.83 for HTOL. Table 4: Product CPC5002G FIT Rate Summary Qual# Stress Product/Kit # of # of Hours Act. Acc. Number Devices Fails Tested Energy Factor 1 HTOL CPC5002G TE3099 TE3100 TE3101 165 0 1000 0.7 Equivalent FIT Rate Dev. Hours @ 60% CL 42,141,984 255.41 Conclusion: The qualification of the product CPC5002G has been successfully completed for the production release. The reliability and process data for D3N can be found at S:/REED/Projects/New Process Information/On-Semi. IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 5 of 6 21.83 Reliability Report-CPC5002G Qualification No: 2011-011 APPROVAL: Prepared by: _Martha W. Brandt*_________________________________11/16/11______ Martha W. Brandt Date Quality Engineer Approved by: _Ajit Patel*________________________________________12/8/111_______ Ajit Patel Date Product Engineer Approved by: _Ronald P. _Clark*___________________________________12/8/11_________ Ronald P. Clark Date Director of Quality Approved by: James Archibald*____________________________________12/8/11__________ James Archibald Date Director of Development Engineering *Signature on File IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 6 of 6