Reliability Report: CPC1593G 6 Pin DIP Qualification Report No.: 2011-013 Reliability Report Reliability Data for CPC1593G 6 Pin DIP Product Report Title: Reliability Data for CPC1593G 6 Pin DIP Product Report Number: 2011-013 Date: 5/31/12 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, www.ixysic.com Page 1 of 6 Reliability Report: CPC1593G 6 Pin DIP Qualification Report No.: 2011-013 Introduction: This report summarizes the Reliability data of IXYS Integrated Circuits Division CPC1593G. The Reliability data presented here were collected during IXYS IC Division’s product qualification. The purpose of this qualification was to verify IXYS IC Division Quality and Reliability requirements as outlined in the internal specifications. The CPC1593G Gate Driver is manufactured at IXYS IC Division and assembled at ATEC in the Philippines. The process is IXYS IC Division P10 and CPC1593G is available in a 6 Pin DIP package type. Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on the IXYS IC Division internal specifications and with the approval of the product development team and quality assurance. Table 1: CPC1593G Reliability Tests Product Package Stress Test CPC1540 6 Pin DIP CPC1563G 6 Pin DIP CPC1593G 6 Pin Dip CPC1540 6 Pin DIP CPC1540 6 Pin DIP Applicable Specs and Readpoints JESD22-A108 Stress Conditions 125C, 80% WVDC, 1000 hrs # Lots Sample Size Total 3 90 270 1 90 90 1 90 90 JESD22, A101 Thermal Shock Mil-Std-883, M1011 1 77 77 1 55 55 CPC1540 6 Pin DIP Temp Cycle 3 55 165 CPC1540 6 Pin DIP MSL 2 50 100 CPC1540 6 Pin DIP CPC1563G 6 Pin DIP CPC1593G 6 Pin Dip High Temp Storage 1 50 50 1 50 50 1 50 50 HTRB THB 85°C, 85% 1000 hrs 0 to 100°C, 10/10 dwells, 15 cycles Mil-Std-883, N1010,-55 to 125°C, “B” 10/10 dwells, 300 cycles J-STD-020D.1 IR Reflow, Level 1, Level 3 JESD22-A103C 125°C, 1000hrs IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, www.ixysic.com Page 2 of 6 Reliability Report: CPC1593G 6 Pin DIP Qualification Report No.: 2011-013 Product Package Stress Test CPC1540 6 Pin DIP CPC1563G 6 Pin DIP CPC1593G 6 Pin DIP ESD HBM Applicable Specs and Readpoints JESD22, A114-E Stress # Lots Sample Size Total Conditions 18 6 3 1.5kΩ, 100pF 1 6 6 1 6 6 Reliability Test Results: The stress tests and associated results for CPC1593G qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: CPC1593G Reliability Test Results Product/ Package Stress/ Kits CPC1540 6 Pin DIP CPC1540 6 Pin DIP CPC1540 6 Pin DIP CPC1563G 6 Pin DIP HTRB TE3089 HTRB TE3113 HTRB TE3114 HTRB TE3185 CPC1593G 6 Pin DIP CPC1540 6 Pin DIP CPC1540 6 Pin DIP HTRB TE3190 THB TE3089 Thermal Shock TE3089 Temp Cycle TE3089 CPC1540 6 Pin DIP Readpoint 1 Readpoint 2 Readpoint 3 / Reject/ / Reject/ / Reject/ SS SS SS 168 hrs. 500 hrs. 1000 hrs. 0/90 0/90 0/90 168 hrs. 500 hrs. 1000 hrs. 0/90 0/90 0/90 168 hrs. 500 hrs. 1000 hrs. 0/90 0/90 0/90 168 hrs. 500 hrs. 1000 hrs. 0/90 0/90 1/90 168 hrs. 0/90 168 hrs. 0/77 15 Cycles 0/55 500 hrs. 0/90 1000 hrs. 0/90 Comments Failure for DMOS SKS053 Ref Report FA12-060 300 Cycles 0/55 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, www.ixysic.com Page 3 of 6 Reliability Report: CPC1593G 6 Pin DIP Qualification Report No.: 2011-013 Product/ Package Stress/ Kits CPC1540 6 Pin DIP Temp Cycle TE3113 Temp Cycle TE3114 CPC1540 6 Pin DIP CPC1540 6 Pin DIP MSL 1 TE3089 CPC1540 6 Pin DIP MSL 3 TE3089 CPC1540 6 Pin DIP High Temp Storage TE3089 High Temp Storage TE3185 High Temp Storage TE3190 CPC1563G 6 Pin DIP CPC1593G 6 Pin DIP Readpoint 1 Readpoint 2 Readpoint 3 / Reject/ / Reject/ / Reject/ SS SS SS 300 Cycles 0/55 Comments (3) Failures: Ball Bond break at neck Ref Report FA11-114 300 Cycles 3/55 IR Reflow Level 1 0/50 IR Reflow Level 2 0/50 168 hrs. 0/50 500 hrs. 0/50 1000 hrs. 0/50 168 hrs. 0/50 500 hrs. 0/50 1000 hrs. 0/50 168 hrs. 0/50 500 hrs. 0/50 1000 hrs. 0/50 ESD Testing Results: As part of this qualification, the product CPC1593G was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/- 8000V zapping. ESD Model HBM Table3: Product CPC1593G ESD Characterization Results Kit Package ESD Test RC Highest Number Spec Network Passed CPC1540 6 Pin DIP JESD22, 8000V 1.5kΩ, TE3034 A114-E 100pF TE3113 TE3114 CPC1563G 3000V TE3146 CPC1593G 3000V TE3190 Class 3B 2 2 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, www.ixysic.com Page 4 of 6 Reliability Report: CPC1593G 6 Pin DIP Qualification Report No.: 2011-013 FIT (Failure in Time) Rate of CPC1593G Table 4 below summarizes the FIT rate from the HTRB data. Using the Reliability HTRB data, FIT rate was calculated based on the equivalent device hours at use condition of 40°C and stressed condition of 125°C at 0.7eV of activation energy. The FIT rate came out to be 17.66 FITs. Product/ Stress CPC1540/ HTRB CPC1563G/ HTRB CPC1593G/ HTRB Table 4: CPC1563G FIT Rate Summary Lot # of # of Hours Test Eq. Device Number Devices Failed Tested Temp Hours (°° C) TE3089 450 1 1000 125 114,932,685 TE3113 TE3114 TE3185 TE3190 Conclusion: The qualification of the product CPC1593G has been successfully completed for the production release. IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, www.ixysic.com Page 5 of 6 FITs @ 60% CL 17.66 Reliability Report: CPC1593G 6 Pin DIP Qualification Report No.: 2011-013 APPROVAL: Prepared by: _ Martha W. Brandt* 5/31/12 Date Martha W. Brandt Quality Engineer Approved by: _Ronald P. Clark*_ 6/4/12 Date Ronald P. Clark Director of Quality Approved by Ajit Patel*____ 6/5/12 Date Ajit Patel Product Engineer Approved by: _James Archibald* 6/5/12 James Archibald Date Director of Development Engineering *Signature on File IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, www.ixysic.com Page 6 of 6