TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2574NUTG SP2574NUTG 2.5V 40A Diode Array RoHS Pb GREEN The SP2574NUTG is a low-capacitance, TVS Diode Array designed to provide protection against ESD (electrostatic discharge), CDE (cable discharge events), EFT (electrical fast transients), and lightning induced surges for high-speed, differential data lines. It’s packaged in a µDFN package (3.0 x 2.0mm) and each device can protect up 4 channels or 2 differential pairs, up to 40A (IEC61000-4-5) and up to 30kV ESD (IEC61000-4-2). The “flow-through” design minimizes signal distortion, reduces voltage overshoot, and provides a simplified PCB design. The SP2574NUTG with its low capacitance and low clamping voltage makes it ideal for high-speed data interfaces such as 1GbE applications found in notebooks, switches, etc. Pinout Features 10 9 8 7 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air 6 • EFT, IEC61000-4-4, 40A (5/50ns) • Lightning, IEC61000-4-5, 40A (tP=8/20μs) 1 2 3 4 5 Functional Block Diagram • μDFN-10 package is optimized for high-speed data line routing • Provides protection for two differential data pairs (4 channels) up to 40A • Low capacitance of 3.8pF@0V (TYP) per I/O • Low operating and clamping voltage • Low leakage current of 0.1μA (TYP) at 2.5V • AEC-Q101 qualified Applications LINE1 IN (Pin 1) LINE1 OUT (Pin 10) LINE2 IN (Pin 2) LINE2 OUT (Pin 9) •10/100/1000 Ethernet • LVDS Interfaces • WAN/LAN Equipment • Integrated Magnetics • Desktops, Servers and Notebooks • Smart TV Application Example GND GND RJ-45 Connector LINE3 IN (Pin 4) Ethernet PHY TP0+ LINE3 OUT (Pin 7) TP0LINE4_IN (Pin 5) LINE4_OUT (Pin 6) TP1+ TP1TP2+ TP2TP3+ TP3- SP2574N Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 SP2574NUTG Description TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2574NUTG Absolute Maximum Ratings Symbol Parameter Value Units 40 1 A IPP Peak Current (tp=8/20μs) PPk Peak Pulse Power (tp=8/20μs) 1000 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Notes:1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10, pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA Min Reverse Leakage Current IR VRWM = 2.5V, T = 25°C Breakdown Voltage VBR It1 = 1μA 3.0 Snap Back Voltage VSB IH = 1mA 3.0 Clamp Voltage RDYN ESD Withstand Voltage Units 2.5 V 0.1 0.5 µA 3.7 4.5 V V 4.5 IPP = 10A, tp = 8/20μs Any I/O to Ground 7.5 IPP = 25A, tp = 8/20μs Any I/O to Ground 12.0 IPP = 40A, tp = 8/20μs Line-to-Line1, two I/O Pins connected together on each line 20.0 TLP, tp=100ns, Any I/O to Ground VESD Diode Capacitance Max IPP = 1A, tp = 8/20μs Any I/O to Ground VC Dynamic Resistance2 Typ 0.13 V Ω IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV CI/O to GND Between I/O Pins and Ground VR = 0V, f = 1MHz 3.8 CI/O to I/O Between I/O Pins VR = 0V, f = 1MHz 1.7 5.0 pF pF Notes: 1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10, pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6) 2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Normalized Capacitance vs. Voltage Insertion Loss (S21) 2.0 5.0 1.8 0.0 1.4 -5.0 1.2 Insertion Loss(dB) Normalized Capacitance 1.6 1.0 0.8 0.6 -10.0 -15.0 -20.0 0.4 0.2 -25.0 0.0 0 0.5 1 1.5 Bias Voltage (V) 2 2.5 -30.0 1 10 100 1000 Frequency (MHz) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2574NUTG Clamping Voltage vs. IPP (Line-to-Line, Two I/O Pins Connected Together) Clamping Voltage vs. IPP (I/O to GND) 16.0 14.0 14.0 10.0 8.0 6.0 12.0 SP2574NUTG Clamp Voltage (VC) Clamp Voltage (VC) 12.0 10.0 8.0 6.0 4.0 4.0 2.0 2.0 0.0 0.0 0 5 10 15 20 0 25 5 Peak Pulse Current-IPP (A) 15 20 25 30 35 40 Peak Pulse Current-IPP (A) Non-Repetitive Peak Pulse Power vs. Pulse Time Pulse Waveform 110% 10 Peak Pulse Power (kW) 100% 90% 80% Percent of IPP 10 70% 60% 50% 40% 30% 1 20% 10% 0.1 0% 0.0 5.0 10.0 15.0 20.0 Time (μs) 25.0 30.0 Transmission Line Pulse (TLP) 20 18 16 TLP Current (A) 14 12 10 8 6 4 2 0 0 2 4 6 TLP Voltage (V) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 8 10 1 10 100 Pulse Duration - t p (µs) 1000 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2574NUTG Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time °C Product Characteristics Ordering Information Pre-Plated Frame Lead Plating Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Part Numbering System Part Number Package Marking Min. Order Qty. SP2574NUTG µDFN-10 (3.0x2.0mm) ABR4 3000 Part Marking System SP2574N U T G TVS Diode Arrays (SPA® Diodes) Series ABR4 G= Green T= Tape & Reel Package μDFN-10 (3.0x2.0mm) Pin 1 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2574NUTG Package Dimensions — µDFN-10 (3.0x2.0mm) L b1 Package µDFN-10 (3.0x2.0mm) JEDEC E L1 e PIN1 INDICATOR b e1 e2 A A3 A1 Recommended Solder Pads 0.25 0.95 Symbol MO-229 Millimeters Inches Min Nom Max Min Nom Max A 0.50 0.60 0.65 0.020 0.024 0.026 A1 0.00 0.03 0.05 0.000 0.001 0.002 0.15 Ref A3 0.006 Ref b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.35 0.45 0.010 0.014 0.018 D 2.90 3.00 3.10 0.114 0.118 0.122 E 1.90 2.00 2.10 0.075 0.079 0.083 e 0.60 BSC 0.024 BSC e1 0.65 BSC 0.026 BSC e2 0.95 BSC 0.037 L 0.25 0.30 0.35 0.010 0.012 0.014 L1 0.95 1.00 1.05 0.037 0.039 0.041 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 1.98 1.0 1.4 3. Dimensions are exclusive of mold flash & metal burr. 2.56 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. 0.4 0.6 0.6 0.65 Tape & Reel Specification — µDFN-10 (3.0x2.0mm) P0 T P2 扑: 1.55±0.05 Package Device Orientation in Tape E Top Cover Tape 5° Max K0 W A0 F B0 P © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 ｖ: 1.0±0.1 Pin1 Location µDFN-10 (3.0x2.0mm) Symbol Millimeters A0 2.30 +/- 0.10 B0 3.20 +/- 0.10 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 1.0 +/- 0.10 P 4.00 +/- 0.10 P0 4.00 +/- 0.10 P2 2.00 +/- 0.10 T 0.3 +/- 0.05 W 8.00 + 0.30 /- 0.10 SP2574NUTG D