NTE2379 MOSFET N−Channel, Enhancement Mode High Speed

NTE2379
MOSFET
N−Channel, Enhancement Mode
High Speed Switch
TO220 Type package
Features:
D Dynamic dv/dt Rating
D Repetitive Avalanche Rated
D Fast Switching
D Ease of Paralleling
D Simple Drive Requirements
D
G
S
Absolute Maximum Ratings:
Gate−Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +20V
Drain Current, ID
Continuous (VGS = 10V)
TC = +255C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.2A
TC = +1005C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9A
Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25A
Gate Current (Pulsed), IGM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +1.5A
Single Pulsed Avalanche Energy (Note 2), EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 570mJ
Avalanche Current (Note 1), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.2A
Repetitive Avalanche Energy (Note 1), EAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13mJ
Peak Diode Recovery dv/dt (Note 3), dv/dt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V/ns
Total Power Dissipation (TC = +255C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125W
Derate Above 255C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W/5C
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −555 to +1505C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −555 to +1505C
Maximum Lead Temperature (During Soldering, 1/16” from case, 10sec), TL . . . . . . . . . . . . +3005C
Thermal Resistance:
Maximum Junction−to−Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.05C/W
Typical Case−to−Sink (Mounting surface flat, smooth, and greased), RthCS . . . . . . 0.55C/W
Maximum Junction−to−Ambient (Free Air Operation), RthJA . . . . . . . . . . . . . . . . . . . . 625C/W
Note 1. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 2. VDD = 50V, starting TJ = +255C, l = 27mH, RG = 25+ , IAS = 6.2A.
Note 3. ISD 3 6.2A, di/dt 3 80A/.A, VDD 3 V(BR)DSS, TJ 3 +1505C.
Rev. 10−13
Electrical Characteristics: (TJ = +255C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Drain−Source Breakdown Voltage
BVDSS
VGS = 0V, ID = 250.A
600
−
−
V
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250.A
2.0
−
4.0
V
Gate−Source Leakage Forward
IGSS
VGS = 20V
−
−
100
nA
Gate−Source Leakage Reverse
IGSS
VGS = −20V
−
−
−100
nA
Drain−Source Leakage Current
IDSS
VDS = 600V, VGS = 0
−
−
100
.A
VDS = 480V, VGS = 0, TC = +1505C
−
−
500
.A
RDS(on)
VGS = 10V, ID = 3.7A, Note 4
−
−
1.2
+
Forward Transconductance
gfs
VDS . 100V, ID = 3.7A, Note 4
4.7
−
−
mhos
Input Capacitance
Ciss
VGS = 0V, VDS = 25V, f = 1MHz
−
1300
−
pF
Output Capacitance
Coss
−
160
−
pF
Reverse Transfer Capacitance
Crss
−
30
−
pF
Turn−On Delay Time
td(on)
−
32
−
ns
−
18
−
ns
td(off)
−
55
−
ns
tf
−
20
−
ns
−
−
60
nC
Static Drain−Source ON Resistance
Rise Time
Turn−Off Delay Time
Fall Time
tr
VDD = 300V, ID = 6.2A, RG = 9.1+ ,
RD = 47+ , Note 4
Total Gate Charge
Qg
Gate−Source Charge
Qgs
−
−
8.3
nC
Gate−Drain (“Miller”) Charge
Qgd
−
−
30
nC
Internal Drain Inductance
LD
−
4.5
−
nH
Internal Source Inductance
LS
−
7.5
−
nH
(Body Diode)
−
−
6.2
A
VGS = 10V, ID = 6.2A, VDS = 360V
Between lead, 6mm (.250 in) from package
and center of die contact
Source−Drain Diode Ratings and Characteristics
Continuous Source Current
IS
Pulse Source Current
ISM
(Body Diode) Note 1
−
−
25
A
Diode Forward Voltage
VSD
TJ = +255C, IS = 6.2A, VGS = 0V, Note 4
−
−
1.5
V
Reverse Recovery Time
trr
−
450
940
ns
Reverse Recovery Charge
Qrr
TJ = +255C, IF = 6.2A, di/dt = 100A/.s,
Note 4
−
3.8
7.9
.C
Forward Turn−On Time
ton
Intrinsic turn−on time is neglegible (turn−on is dominated by LS + LD)
Note 1. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 4. Pulse Test: Pulse Width 3 300.s, Duty Cycle 3 2%.
.420 (10.67)
Max
.110 (2.79)
.147 (3.75)
Dia Max
.500
(12.7)
Max
.250 (6.35)
Max
.070 (1.78) Max
Gate
.100 (2.54)
.500
(12.7)
Min
Source
Drain/Tab