NTE NTE2996

NTE2996
MOSFET
N−Channel, Enhancement Mode
High Speed Switch
Features:
D Ultra Low On−Resistance
D Dynamic dv/dt Rating
D +175°C Operating Temperature
D Fast Switching
D Fully Avalanche Rated
Absolute Maximum Ratings:
Drain Current, ID
Continuous (VGS = 10V)
TC = +25°C (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84A
TC = +100°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59A
Pulsed (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330A
Total Power Dissipation (TC = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200W
Derate Above 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4W/°C
Gate−Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V
Single Pulsed Avalanche Energy (IAS = 50A, L = 260µH, Note 3), EAS . . . . . . . . . . . . . . . . . 320mJ
Avalanche Current (Note 2), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50A
Repetitive Avalanche Energy (Note 2), EAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17mJ
Peak Diode Recovery dv/dt (Note 4), dv/dt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0V/ns
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +175°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +175°C
Maximum Lead Temperature (During Soldering, 1.6mm from case, 10sec), TL . . . . . . . . . . +300°C
Maximum Thermal Resistance:
Junction−to−Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.75°C/W
Junction−to−Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Typical Thermal Resistance, Case−to−Sink (Flat, greased surface), RthCS . . . . . . . . . . . . 0.50°C/W
Note 1. Calculated continuous current based on maximum allowable junction temperature. Package
limitation current is 75A.
Note 2. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 3. This is a calculated value limited to TJ = +175°C.
Note 4. ISD ≤ 50A, di/dt ≤ 230A/µs, VDD ≤ V(BR)DSS, TJ ≤ +175°C.
Electrical Characteristics: (TJ = +25°C unless otherwise specified)
Parameter
Drain−Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Symbol
BVDSS
Test Conditions
VGS = 0V, ID = 250µA
∆V(BR)DSS/ Reference to +25°C, ID = 1mA
∆TJ
Min
Typ
Max
Unit
60
−
−
V
−
0.064
−
V/°C
−
−
12
Ω
Static Drain−Source ON Resistance
RDS(on)
VGS = 10V, ID = 50A, Note 5
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
2.0
−
4.0
V
VDS = 25V, ID = 50A, Note 5
69
−
−
mhos
VDS = 60V, VGS = 0
−
−
25
µA
VDS = 48V, VGS = 0V, TC = +150°C
−
−
250
µA
VGS = 20V
−
−
100
nA
VGS = −20V
−
−
−100
nA
VGS = 10V, ID = 50A, VDS = 48V
−
−
130
nC
Forward Transconductance
Drain−to−Source Leakage Current
Gate−Source Leakage, Forward
gfs
IDSS
IGSS
Gate−Source Leakage, Reverse
Total Gate Charge
Qg
Gate−Source Charge
Qgs
−
−
28
nC
Gate−Drain (“Miller”) Charge
Qgd
−
−
44
nC
Turn−On Delay Time
td(on)
−
12
−
ns
−
78
−
ns
td(off)
−
48
−
ns
tf
−
53
−
ns
Between lead, 6mm (0.25”) from
package and center of die contact
−
4.5
−
nH
−
7.5
−
nH
VGS = 0V, VDS = 25V, f = 1MHz
−
3210
−
pF
Rise Time
Turn−Off Delay Time
Fall Time
tr
Internal Drain Inductance
LD
Internal Source Inductance
LS
VDD = 30V, ID = 50A, RG = 3.6Ω,
VGS = 10V
10V, Note 5
Input Capacitance
Ciss
Output Capacitance
Coss
−
690
−
pF
Reverse Transfer Capacitance
Crss
−
140
−
pF
Source−Drain Diode Ratings and Characteristics
Continuous Source Current
IS
(Body Diode) Note 6
−
−
84
A
Pulse Source Current
ISM
(Body Diode) Note 2
−
−
330
A
Diode Forward Voltage
VSD
TJ = +25°C, IS = 50A, VGS = 0V, Note 5
−
−
1.3
V
Reverse Recovery Time
trr
−
73
110
ns
Reverse Recovery Charge
Qrr
TJ = +25°C, IF = 50A, di/dt = 100A/µs,
Note 5
−
220
330
µC
Forward Turn−On Time
ton
Intrinsic turn−on time is neglegible
(turn−on is dominated by LS + LD)
Note 2. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 5. Pulse Width ≤ 400µs, Duty Cycle ≤ 2%.
Note 6. Calculated continuous current based on maximum allowable junction temperature. Package
limitation current is 75A.
.420 (10.67)
Max
.110 (2.79)
.147 (3.75) Dia Max
.500
(12.7)
Max
.250 (6.35)
Max
.500
(12.7)
Min
.070 (1.78) Max
Gate
.100 (2.54)
Source
Drain/Tab