Revision: Date: Statement of Materials, Construction LEAD-FREE -- 6L-SOT23 -- TABLE OF MATERIAL DECLARATION Component Materials CAS Number Weight Analysis (grams) (Element / Compound) No. Component Name Material Name 1 Leadframe Copper Alloy 0.00494 2 3 Die Die attach material Silicon Chip Conductive Epoxy 0.00033 0.00017 4 5 6 Wire Lead Finish Encapsulation Gold Tin Epoxy Resin Total Package weight Note: 0.00008 0.0004743 0.0072021 Material Mass (Gram) Material Weight % (of Total Pkg) Material Weight % (of Component) Cu Ni Si Mg Ag Si Silver (70-85) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-21-3 7440-21-3 0.00475 0.00015 0.00003 0.00001 0.00000 0.00033 0.00014 36.03754 1.12383 1.12383 0.05432 0.00187 2.46345 1.03953 96.2 3 0.65 0.145 0.005 100 79 Epoxy resin ( 5-25) Aromatic Amine (1-10) Au Sn Fused Silica Epoxy resin Carbon Black Antimony trioxide Amine Compound Proprietary Proprietary 7440-57-5 7440-31-5 7631-86-9 29690-82-2 1333-86-4 1309-64-4 9003-35-4 0.00003 0.00001 0.00008 0.00047 0.00504 0.00180 0.00007 0.00022 0.00007 0.19738 0.07895 0.57374 3.59512 38.21351 13.64768 0.54591 1.63772 0.54591 15 6 99.99 100 70 25 1 3 1 0.01319 Composition derived from MSDS and material C of C from Vendors; Component Weight based on assembly of generic parts. Conclusion: The analysis table above shows that this package meets the following RoHS requirements for EACH PACKAGE COMPONENT (mold compound, lead frame, etc.) Lead* Mercury Cadmium Hexavalent Chromium Polybrominated Biphenyls (PBB) Polybrominated Biphenylethers (PBDE) Maximum Allowable Limit (ppm) 1000 ppm 1000 ppm 100 ppm 1000 ppm 1000 ppm 1000 ppm * Lead is allowed up to 4% as an alloying agent in copper-based alloys 1.0 4-Mar-05 Maximum Allowable Limit (wt %) 0.10% 0.10% 0.01% 0.10% 0.10% 0.10%