Material Declaration Sheet

Revision:
Date:
Statement of Materials, Construction
LEAD-FREE -- 8L-SOICN -- TABLE OF MATERIAL DECLARATION
Component
Materials
CAS Number
Weight
Analysis
(grams)
(Element / Compound)
No.
Component
Name
Material
Name
1
Leadframe
Copper Alloy
0.02426
2
3
Die
Die attach
material
Silicon Chip
Conductive Epoxy
0.00263
0.00113
4
5
6
Wire
Lead Finish
Encapsulation
Gold
Tin
Epoxy Resin
Total Package weight
0.00030
0.00146
0.04438
Material
Mass
(Gram)
Material
Weight %
(of Total Pkg)
1.0
10-Feb-05
Cu
Fe
Pb
P
Zn
Si
Epoxy resin
7440-50-8
7439-89-6
7439-92-1
7723-14-0
7440-66-6
7440-21-3
Proprietary
0.02364
0.00057
0.00001
0.00002
0.00003
0.00262
0.00017
31.87233
0.76876
0.00981
0.02715
0.03598
3.52865
0.22856
97.43
2.35
0.03
0.08
0.11
99.50
15.00
Silver
Aromatic Amine
Au
Sn
Fused Silica
Epoxy resin
Phenol Resin
Phenol Novolac
Antimony trioxide
Brominated Epoxy resin
Carbon Black
7440-21-3
Proprietary
7440-57-5
7440-31-5
60676-86-0
Proprietary
Proprietary
9003-35-4
1309-64-4
68541-56-0
1333-86-4
0.00090
0.00006
0.00030
0.00146
0.03581
0.00444
0.00067
0.00133
0.00089
0.00111
0.00013
1.21137
0.08381
0.40449
1.96872
48.29377
5.98436
0.89765
1.79531
1.19687
1.49609
0.17953
79.50
5.50
99.99
100.00
80.70
10.00
1.50
3.00
2.00
2.50
0.30
0.07416
Note: Composition derived from MSDS and material C of C from Vendors;
Component Weight based on assembly of generic parts.
Conclusion:
The analysis table above shows that this package meets the following RoHS requirements for EACH PACKAGE COMPONENT (mold compound, lead frame, etc.)
Lead*
Mercury
Cadmium
Hexavalent Chromium
Polybrominated Biphenyls (PBB)
Polybrominated Biphenylethers (PBDE)
Maximum Allowable Limit (aximum Allowable Limit (wt %)
1000 ppm
0.10%
1000 ppm
0.10%
100 ppm
0.01%
1000 ppm
0.10%
1000 ppm
0.10%
1000 ppm
0.10%
* Lead is allowed up to 4% as an alloying agent in copper-based alloys
Material
Weight %
(of Component)