Revision: Date: Statement of Materials, Construction LEAD-FREE -- 8L-PDIP -- TABLE OF MATERIAL DECLARATION Component Materials CAS Number Weight Analysis (grams) (Element / Compound) No. Component Name Material Name 1 Leadframe Copper Alloy 0.15453 2 3 Die Die attach material Silicon Chip Conductive Epoxy 0.00250 0.00090 4 5 6 Wire Lead Finish Encapsulation Gold Tin Epoxy Resin Total Package weight 0.00026 0.0131 0.3284 Material Mass (Gram) Material Weight % (of Total Pkg) Material Weight % (of Component) Cu Fe Pb P Zn Ag Si Epoxy resin ( 5-25) 7440-50-8 7439-89-6 7439-92-1 7723-14-0 7440-66-6 7440-22-4 7440-21-3 Proprietary 0.15022 0.00363 0.00005 0.00013 0.00019 0.00031 0.00249 0.00014 30.06329 0.72674 0.00928 0.02551 0.03866 0.06185 0.49781 0.02702 97.213 2.35 0.03 0.0825 0.125 0.2 99.5 15 Silver (70-85) Aromatic Amine (1-10) Au Sn Fused Silica Epoxy resin Phenol Resin Antimony trioxide Brominated Epoxy Resin Carbon Black 7440-21-3 Proprietary 7440-57-5 7440-31-5 7631-86-9 29690-82-2 9003-35-4 1309-64-4 40039-93-8 1333-86-4 0.00072 0.00005 0.00026 0.01310 0.22988 0.05583 0.02529 0.00985 0.00657 0.00099 0.14319 0.00991 0.05203 2.62163 46.00452 11.17253 5.06050 1.97162 1.31441 0.19716 79.5 5.5 99.99 100 70 17 7.7 3 2 0.3 0.49969 Note: Composition derived from MSDS and material C of C from Vendors; Component Weight based on assembly of generic parts. Conclusion: The analysis table above shows that this package meets the following RoHS requirements for EACH PACKAGE COMPONENT (mold compound, lead frame, etc.) Lead* Mercury Cadmium Hexavalent Chromium Polybrominated Biphenyls (PBB) Polybrominated Biphenylethers (PBDE) Maximum Allowable Limit (ppm) Maximum Allowable Limit (wt %) 1000 ppm 0.10% 1000 ppm 0.10% 100 ppm 0.01% 1000 ppm 0.10% 1000 ppm 0.10% 1000 ppm 0.10% * Lead is allowed up to 4% as an alloying agent in copper-based alloys 1.0 7-Feb-05