NJG1681MD7 HIGH POWER SPDT SWITCH GaAs MMIC

NJG1681MD7
HIGH POWER SPDT SWITCH GaAs MMIC
I GENERAL DESCRIPTION
The NJG1681MD7 is a GaAs SPDT switch MMIC suitable for
LTE/UMTS/CDMA/GSM applications.
The NJG1681MD7 features very low insertion loss, high isolation
and excellent linearity performance down to 1.8V control voltage at
high frequency up to 6GHz. In addition, this switch is able to handle
high power signals.
The NJG1681MD7 has ESD protection devices to achieve
excellent ESD performances. No DC Blocking capacitors are
required for all RF ports unless DC is biased externally. And the
ultra small & ultra thin EQFN14-D7 package is adopted.
I PACKAGE OUTLINE
NJG1681MD7
I APPLICATIONS
LTE, UMTS, CDMA, GSM applications
IEEE802.11p application
Antenna switching, bands switching, post PA switching applications
I FEATURES
G Low voltage logic control
G Low voltage operation
G Low distortion
VCTL(H)=1.8V typ.
VDD=2.7V typ.
IIP3=+73dBm typ. @f=829+849MHz, PIN=24dBm
IIP3=+71dBm typ. @f=1870+1910MHz, PIN=24dBm
2nd harmonics=-85dBc typ. @ f=0.9GHz, PIN=35dBm
3rd harmonics=-90dBc typ. @ f=0.9GHz, PIN=35dBm
G P-0.1dB
+36dBm min.
G Low insertion loss
0.18dB typ. @f=0.9GHz, PIN=35dBm
0.20dB typ. @f=1.9GHz, PIN=33dBm
0.23dB typ. @f=2.7GHz, PIN=27dBm
0.45dB typ. @f=6.0GHz, PIN=27dBm
G Ultra small & ultra thin package
EQFN14-D7 (Package size: 1.6 x 1.6 x 0.397mm.)
G RoHS compliant and Halogen Free, MSL1
I PIN CONFIGURATION
(TOP VIEW)
11
10
9
8
7
DECODER
12
13
6
14
5
1
2
3
Pin connection
1. GND
8. GND
2. NC(GND)
9. P1
3. P2
10. GND
4. GND
11. GND
5. GND
12. VDD
6. PC
13. NC(GND)
7. GND
14. VCTL
Exposed PAD: GND
4
I TRUTH TABLE
“H”=VCTL(H), “L”=VCTL(L)
VCTL
Path
H
PC-P1
L
PC-P2
NOTE: Please note that any information on this datasheet will be subject to change.
Ver.2015-07-17
-1-
NJG1681MD7
I ABSOLUTE MAXIMUM RATINGS
(Ta=+25°C, Zs=Zl=50Ω)
PARAMETER
CONDITIONS
SYMBOL
RATINGS
UNITS
37
dBm
RF Input Power
PIN
VDD =2.7V
Supply Voltage
VDD
5.0
V
Control Voltage
VCTL
5.0
V
1300
mW
Four-layer FR4 PCB with through-hole
(74.2x74.2mm), Tj=150°C
Power Dissipation
PD
Operating Temp.
Topr
-40 to +105
°C
Storage Temp.
Tstg
-55 to +150
°C
I ELECTRICAL CHARACTERISTICS 1 (DC)
(General conditions: Ta=+25°C, VDD=2.7V, VCTL(L)=0V, VCTL(H)=1.8V)
PARAMETERS
SYMBOL
Supply Voltage
VDD
Operating Current
IDD
CONDITIONS
No RF input, VDD=2.7V
MIN
TYP
MAX
UNITS
2.375
2.7
5.0
V
-
95
180
µA
Control Voltage (LOW)
VCTL(L)
0
-
0.45
V
Control Voltage (HIGH)
VCTL(H)
1.35
1.8
5.0
V
-
4
10
µA
Control Current
-2-
ICTL
VCTL(H)=1.8V
NJG1681MD7
I ELECTRICAL CHARACTERISTICS 2 (RF)
(General conditions: Ta=+25°C, Zs=Zl=50Ω, VDD=2.7V, VCTL(L)=0V, VCTL(H)=1.8V)
PARAMETERS
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS
Insertion Loss 1
LOSS1
f=0.9GHz, PIN=35dBm
-
0.18
0.33
dB
Insertion Loss 2
LOSS2
f=1.9GHz, PIN=33dBm
-
0.20
0.40
dB
Insertion Loss 3
LOSS3
f=2.7GHz, PIN=27dBm
-
0.23
0.43
dB
Insertion Loss 4
LOSS4
f=6.0GHz, PIN=27dBm
-
0.45
0.65
dB
Isolation 1
ISL1
f=0.9GHz, PIN=35dBm
40
45
-
dB
Isolation 2
ISL2
f=1.9GHz, PIN=33dBm
30
35
-
dB
Isolation 3
ISL3
f=2.7GHz, PIN=27dBm
25
30
-
dB
Isolation 4
ISL4
f=6.0GHz, PIN=27dBm
16.5
20
-
dB
Input Power at 0.1dB
Compression Point
P-0.1dB
f=0.9GHz, f=1.9GHz,
f=2.7GHz, f=6.0GHz
+36
-
-
dBm
2nd Harmonics 1
2fo(1)
f=0.9GHz, PIN=35dBm
-
-85
-70
dBc
2nd Harmonics 2
2fo(2)
f=1.9GHz, PIN=33dBm
-
-90
-70
dBc
2nd Harmonics 3
2fo(3)
f=2.7GHz, PIN=27dBm
-
-90
-70
dBc
3rd Harmonics 1
3fo(1)
f=0.9GHz, PIN=35dBm
-
-90
-70
dBc
3rd Harmonics 2
3fo(2)
f=1.9GHz, PIN=33dBm
-
-80
-70
dBc
3rd Harmonics 3
3fo(3)
f=2.7GHz, PIN=27dBm
-
-90
-70
dBc
Input 3rd order
intercept point1
IIP3(1)
f=829+849MHz,
PIN=24dBm each
+65
+73
-
dBm
Input 3rd order
intercept point2
IIP3(2)
f=1870+1910MHz,
PIN=24dBm each
+65
+71
-
dBm
VSWR 1
VSWR 1
on-state ports, f=2.7GHz
-
1.1
1.4
VSWR 2
VSWR 2
on-state ports, f=6.0GHz
-
1.1
1.4
TSW
50% VCTL to 10/90% RF
-
1
5
Switching time
µs
*1: IIP3 are defined by the following equations.
IIP3=(3 x Pout-IM3)/2+LOSS
-3-
NJG1681MD7
I TERMINAL INFORMATION
No.
SYMBOL
DESCRIPTION
1
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
2
NC(GND)
No connected terminal. Please connect this terminal with ground plane as
close as possible for excellent RF performance.
3
P2
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally.
4
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
5
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
6
PC
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally. Please connect an inductor with GND
terminal for ESD protection.
7
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
8
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
9
P1
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally.
10
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
11
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
12
VDD
Positive voltage supply terminal. The positive voltage (+2.375~+5V) has to
be supplied. Please connect a bypass capacitor with GND terminal for
excellent RF performance.
13
NC(GND)
No connected terminal. Please connect this terminal with ground plane as
close as possible for excellent RF performance.
14
VCTL
Control signal input terminal. This terminal is set to High-Level (+1.35~+5.0V)
or Low-Level (0~+0.45V).
Exposed
Pad
GND
Ground terminal.
-4-
NJG1681MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
0
-0.4
-10
-0.8
-20
-1.2
-30
-1.6
-40
-2.0
-50
-2.4
0.0
1.0
2.0
3.0
4.0
5.0
(PC-P2 ON, V =2.7V, V =0V)
DD
CTL
(Losses of external circuits are excluded)
0.0
Insertion Loss (dB)
Insertion Loss (dB)
0.0
Loss, ISL vs Frequency
PC-P2 Isolation (dB)
(PC-P1 ON, V =2.7V, V =1.8V)
DD
CTL
(Losses of external circuits are excluded)
-60
6.0
-0.4
-10
-0.8
-20
-1.2
-30
-1.6
-40
-2.0
-50
-2.4
0.0
1.0
2.0
3.0
4.0
Frequency (GHz)
VSWR vs Frequency
VSWR vs Frequency
DD
CTL
=1.8V)
(PC-P2 ON, V =2.7V, V
DD
2.0
CTL
=0V)
2.0
PC Port
P1 Port
PC Port
P2 Port
1.8
1.8
1.6
1.6
VSWR
VSWR
-60
6.0
5.0
Frequency (GHz)
(PC-P1 ON, V =2.7V, V
0
PC-P1 Isolation (dB)
Loss, ISL vs Frequency
1.4
1.2
1.4
1.2
1.0
0.0
1.0
2.0
3.0
4.0
5.0
1.0
0.0
6.0
1.0
2.0
Frequency (GHz)
IDD vs. VDD
(No RF input, PC-P1 ON, V
CTL
200
3.0
4.0
5.0
6.0
Frequency (GHz)
Control Current vs. VCTL
=1.8V)
(No RF input, PC-P1 ON, V =2.7V)
DD
12
Control Current (µ
µ A)
10
IDD (µ
µ A)
150
100
50
8
6
4
2
0
0
2.5
3
3.5
VDD (V)
4
4.5
5
1.5
2
2.5
3
3.5
4
4.5
5
VCTL (V)
-5-
NJG1681MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
Output Power, I
DD
vs Input Power
Output Power, I
DD
(f=0.9GHz, PC-P1 ON, V =1.8V)
CTL
(Losses of external circuits are excluded)
36
200
VV =2.375V
=2.5V
DD
DD
150
30
28
100
26
24
50
22
DD
32
150
30
28
100
26
24
50
22
20
20
0
22
24
26
28
30
32
34
36
0
20
22
24
Input Power (dBm)
Output Power, I
DD
Output Power, I
vs Input Power
DD
36
200
30
100
28
26
50
24
22
0
20
26
36
vs Input Power
200
28
30
32
Input Power (dBm)
34
36
VVDD=2.7V
=2.7V
34
Output Power (dBm)
(µ
µ A)
150
32
DD
DD
Operation Current I
Output Power (dBm)
DD
24
34
DD
=3.6V
VVDD=5V
22
32
VVDD=2.375V
=2.5V
DD
DD
VVDD=2.7V
=2.7V
20
30
(f=6.0GHz, PC-P1 ON, V =1.8V)
CTL
(Losses of external circuits are excluded)
VV =2.375V
=2.5V
34
28
Input Power (dBm)
(f=2.7GHz, PC-P1 ON, V =1.8V)
CTL
(Losses of external circuits are excluded)
36
26
DD
=3.6V
VVDD=5V
DD
150
32
30
100
28
26
50
24
22
0
20
20
22
24
26
28
30
32
Input Power (dBm)
34
36
Operation Current I (µ
µ A)
DD
20
-6-
(µ
µ A)
DD
=3.6V
VVDD=5V
DD
32
VVDD=2.7V
=2.7V
34
Output Power (dBm)
(µ
µ A)
DD
DD
DD
=3.6V
VVDD=5V
Operation Current I
Output Power (dBm)
34
200
VV =2.375V
=2.5V
DD
DD
VVDD=2.7V
=2.7V
Operation Current I
36
vs Input Power
(f=1.9GHz, PC-P1 ON, V =1.8V)
CTL
(Losses of external circuits are excluded)
NJG1681MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
Loss, ISL vs Input Power
(f=1.9GHz, PC-P1 ON, V
=1.8V)
CTL
=1.8V)
(Losses of external circuits are excluded)
0
0.0
-0.2
-5
-0.2
-5
-0.4
-10
-0.4
-10
VV =2.5V
=2.375V
DD
DD
-0.8
-20
VV =2.7V
=2.7V
DD
DD
VV =3.6V
=5V
-1.0
-25
DD
DD
24
26
28
30
32
34
VV =2.7V
=2.7V
-20
VVDD=3.6V
=5V
-25
DD
DD
-1.0
DD
-1.6
-40
-45
-1.8
-45
-50
-2.0
-40
22
-0.8
-35
-1.6
20
DD
DD
-30
-35
-2.0
VV =2.5V
=2.375V
-1.4
-1.4
-1.8
-15
-0.6
-1.2
-30
-1.2
PC-P2 Isolation (dB)
-15
-0.6
Insertion Loss (dB)
0
0.0
-50
20
36
22
24
CTL
28
30
32
34
36
Loss, ISL vs Input Power
Loss, ISL vs Input Power
(f=2.7GHz, PC-P1 ON, V
26
Input Power (dBm)
Input Power (dBm)
=1.8V)
(Losses of external circuits are excluded)
(f=6.0GHz, PC-P1 ON, V =1.8V)
CTL
(Losses of external circuits are excluded)
0
-0.2
-5
-0.2
-5
-0.4
-10
-0.4
-10
-0.6
-15
-0.8
-20
-1.0
-25
-1.2
-30
-15
-0.6
VV =2.5V
=2.375V
DD
DD
-0.8
VV =2.7V
=2.7V
-20
VVDD=3.6V
=5V
-25
DD
DD
-1.0
DD
-30
-1.2
-35
-1.4
-40
-1.6
Insertion Loss (dB)
0.0
PC-P2 Isolation (dB)
0
0.0
Insertion Loss (dB)
Insertion Loss (dB)
CTL
-1.4
-35
VVDD=2.375V
=2.5V
DD
-1.6
-40
=2.7V
VVDD=2.7V
DD
PC-P2 Isolation (dB)
(f=0.9GHz, PC-P1 ON, V
(Losses of external circuits are excluded)
PC-P2 Isolation (dB)
Loss, ISL vs Input Power
V =3.6V
-1.8
-45
-1.8
-2.0
-50
-2.0
20
22
24
26
28
30
32
Input Power (dBm)
34
36
V DD=5V
-45
DD
-50
20
22
24
26
28
30
32
34
36
Input Power (dBm)
-7-
NJG1681MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
Loss, ISL vs Ambient Temperature
Loss, ISL vs Ambient Temperature
-0.4
-20
VV =2.5V
=2.375V
DD
DD
VVDD=2.7V
=2.7V
V DD=3.6V
VDD =5V
DD
-0.6
-30
-0.8
-1.0
-50
-40
-25
0
25
50
75
100
IN
=2.375V
VV =2.5V
-0.4
DD
DD
DD
DD
DD
DD
-0.6
-30
-0.8
-40
-25
=2.375V
VV =2.5V
-20
DD
DD
VV =3.6V
=5V
DD
DD
-0.6
-30
-0.8
-40
Insertion Loss (dB)
Insertion Loss (dB)
100
IN
0.0
PC-P2 Isolation (dB)
-10
DD
DD
75
-50
125
(f=6.0GHz, PC-P1 ON, P =27dBm)
0
VV =2.7V
=2.7V
50
Loss, ISL vs Ambient Temperature
(f=2.7GHz, PC-P1 ON, P =27dBm)
-0.4
25
Ambient Temperature ( C)
Loss, ISL vs Ambient Temperature
-0.2
0
o
Ambient Temperature ( C)
IN
-20
VV =2.7V
=2.7V
VV =3.6V
=5V
-1.0
-50
-50
125
-10
o
0.0
0
-0.2
Insertion Loss (dB)
-10
PC-P2 Isolation (dB)
-0.2
Insertion Loss (dB)
(f=1.9GHz, PC-P1 ON, P =33dBm)
0.0
0
0
-0.2
-10
-0.4
-20
-0.6
-30
V
V =2.5V
=2.375V
DD
-0.8
-40
DD
V
V =2.7V
=2.7V
PC-P2 Isolation (dB)
IN
0.0
PC-P2 Isolation (dB)
(f=0.9GHz, PC-P1 ON, P =35dBm)
DD
DD
V =3.6V
VDD =5V
DD
-1.0
-50
-25
0
25
50
75
100
-50
125
-1.0
-50
-25
o
50
30
150
I
DD
100
20
50
10
I
25
50
CTL
75
100
o
Ambient Temperature ( C)
-8-
0
125
Switching Time (µ
µ s)
CTL
Control Current (µ
µ A)
Operating Current (µ
µ A)
40
DD
DD
I
0
-50
125
DD
Trise
Trise
Tfall
Tfall
VV =2.7V
=2.7V
DD
DD
VV =3.6V
=5V
-25
100
(V =2.7V, VCTL=0/1.8V)
5
DD
DD
0
-50
75
Switching Time vs Ambient Temperature
VV =2.5V
=2.375V
200
50
Ambient Temperature ( C)
DC Current vs Ambient Temperature
250
25
o
Ambient Temperature ( C)
(No RF Signal)
0
4
3
2
1
0
-50
-25
0
25
50
75
o
100
Ambient Temperature ( C)
125
NJG1681MD7
I APPLICATION CIRCUIT
(TOP VIEW)
P1
11
9
8
7
DECODER
12
VDD
2.7V
10
C1
13
6
L1*
14
VCTL
0/1.8V
PC
5
1
2
3
4
P2
Note: No DC blocking capacitors are required on all RF ports, unless DC is biased externally.
* The Inductor L1 is required for enhancing ESD protection level.
The inductor L1 is recommended in order to keep the DC bias level of each RF port at 0 V level tightly.
I PARTS LIST
No.
Parameters
Note
C1
1000pF
MURATA (GRM15)
L1
68nH
TAIYO-YUDEN (HK1005)
I PCB LAYOUT
(TOP VIEW)
GND
VDD
NC
VCTL
PCB SIZE: 19.4 x 15.0 mm
PCB: FR-4, t=0.5mm
Capacitor size: 1005
MICROSTRIP LINE WIDTH: 0.98mm
C1
P1
P2
Losses of PCB and connectors, Ta=+25°C
Frequency (GHz)
Loss (dB)
0.9
0.09
1.9
0.18
2.7
0.26
6.0
0.48
PC
I PRECAUTIONS
[1] No DC blocking capacitors are required at each RF port normally. When the other device is biased at
certain voltage and connected to the NJG1681MD7, a DC block capacitor is required between the device
and the switch IC. This is because the each RF port of NJG1681MD7 is biased at 0 V (GND).
[2] For avoiding the degradation of RF performance, the bypass capacitor (C1) should be placed as close as
possible to VDD terminal
[3] For good RF performance, all GND terminals are must be connected to PCB ground plane of substrate, and
through - holes for GND should be placed the IC near.
-9-
NJG1681MD7
I RECOMMENDED FOOTPRINT PATTERN (EQFN14-D7 PACKAGE Reference)
:Land
:Mask (Open area) *Metal mask thickness : 100µm
:Resist(Open area)
Detail A
- 10 -
PKG:
1.6mm x 1.6mm
Pin pitch: 0.4mm
NJG1681MD7
I PACKAGE OUTLINE (EQFN14-D7)
Units
Board
Terminal treat
Molding material
Weight
: mm
: Cu
: SnBi
: Epoxy resin
: 3.4mg
Exposed PAD
Ground connection is required.
Cautions on using this product
This product contains Gallium-Arsenide (GaAs) which is a harmful material.
• Do NOT eat or put into mouth.
• Do NOT dispose in fire or break up this product.
• Do NOT chemically make gas or powder with this product.
• To waste this product, please obey the relating law of your country.
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle
with care to avoid these damages.
- 11 -