NJG1682MD7 HIGH POWER SP3T SWITCH GaAs MMIC

NJG1682MD7
HIGH POWER SP3T SWITCH GaAs MMIC
I GENERAL DESCRIPTION
The NJG1682MD7 is a GaAs SP3T switch MMIC suitable for
LTE/UMTS/CDMA/GSM applications.
The NJG1682MD7 features very low insertion loss, high isolation
and excellent linearity performance down to 1.8V control voltage at
high frequency up to 2.7GHz. In addition, this switch is able to handle
high power signals.
The NJG1682MD7 has ESD protection devices to achieve excellent
ESD performances. No DC Blocking capacitors are required for all RF
ports unless DC is biased externally. And the ultra small & ultra thin
EQFN14-D7 package is adopted.
I PACKAGE OUTLINE
NJG1682MD7
I APPLICATIONS
LTE, UMTS, CDMA, GSM applications
Post PA Switching, Antenna Switching and Bands Switching applications
General Purpose Switching applications
I FEATURES
G Low voltage logic control
G Low voltage operation
G Low distortion
VCTL(H)=1.8V typ.
VDD=2.7V typ.
IIP3=+71dBm typ. @f=829+849MHz, PIN=24dBm,
IIP3=+70dBm typ. @f=1870+1910MHz, PIN=24dBm,
2nd harmonics=-85dBc typ. @f=0.9GHz, PIN=35dBm
3rd harmonics=-80dBc typ. @f=0.9GHz, PIN=35dBm
G P-0.1dB
36dBm min.
G Low insertion loss
0.22dB typ. @f=0.9GHz, PIN=35dBm
0.25dB typ. @f=1.9GHz, PIN=33dBm
0.30dB typ. @f=2.7GHz, PIN=27dBm
G Ultra small & ultra thin package
EQFN14-D7 (Package size: 1.6 x 1.6 x 0.397mm.)
G RoHS compliant and Halogen Free, MSL1
I PIN CONFIGURATION
(TOP VIEW)
GND
VCTL1
VCTL2
VDD
14
13
12
1
11
GND
DECODER
P1
2
10
GND
GND
3
9
PC
GND
4
8
GND
5
6
7
P2
GND
P3
Pin connection
1. GND
8. GND
2. P1
9. PC
3. GND
10. GND
4. GND
11. GND
5. P2
12. VDD
6. GND
13. VCTL2
7. P3
14. VCTL1
Exposed PAD: GND
I TRUTH TABLE
VCTL1
L
H
L
H
“H”=VCTL(H), “L”=VCTL(L)
VCTL2
Path
L
ALL OFF
L
P1-PC
H
P2-PC
H
P3-PC
NOTE: Please note that any information on this catalog will be subject to change.
Ver.2013-09-18
-1-
NJG1682MD7
I ABSOLUTE MAXIMUM RATINGS
Ta=+25°C, Zs=Zl=50 ohm
PARAMETER
CONDITIONS
SYMBOL
RATINGS
UNITS
37
dBm
RF Input Power
PIN
VDD =2.7V
Supply Voltage
VDD
5.0
V
Control Voltage
VCTL
5.0
V
1300
mW
Four-layer FR4 PCB with through-hole
(74.2x74.2mm), Tj=150°C
Power Dissipation
PD
Operating Temp.
Topr
-40~+85
°C
Storage Temp.
Tstg
-55~+150
°C
I ELECTRICAL CHARACTERISTICS 1 (DC)
General conditions: Ta=+25°C, VDD=2.7V, VCTL(L)=0V, VCTL(H)=1.8V
PARAMETERS
SYMBOL
Supply Voltage
VDD
Operating Current
IDD
CONDITIONS
No RF input, VDD=2.7V
MIN
TYP
MAX
UNITS
2.375
2.7
5.0
V
-
150
300
µA
Control Voltage (LOW)
VCTL(L)
0
-
0.45
V
Control Voltage (HIGH)
VCTL(H)
1.35
1.8
5.0
V
-
4
10
µA
Control Current
-2-
ICTL
VCTL(H)=1.8V
NJG1682MD7
I ELECTRICAL CHARACTERISTICS 2 (RF)
General conditions: Ta=+25°C, Zs=Zl=50 ohm, VDD=2.7V, VCTL(L)=0V, VCTL(H)=1.8V
PARAMETERS
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS
Insertion Loss 1
LOSS1
f=0.9GHz, PIN=35dBm
-
0.22
0.37
dB
Insertion Loss 2
LOSS2
f=1.9GHz, PIN=33dBm
-
0.25
0.45
dB
Insertion Loss 3
LOSS3
f=2.7GHz, PIN=27dBm
-
0.30
0.50
dB
Isolation 1
ISL1
f=0.9GHz, PIN=35dBm
30
35
-
dB
Isolation 2
ISL2
f=1.9GHz, PIN=33dBm
25
30
-
dB
Isolation 3
ISL3
f=2.7GHz, PIN=27dBm
22
27
-
dB
Isolation 4
ISL4
f=0.9GHz, PIN=10dBm,
ALL OFF mode
30
35
-
dB
Isolation 5
ISL5
f=1.9GHz, PIN=10dBm,
ALL OFF mode
25
30
-
dB
Isolation 6
ISL6
f=2.7GHz, PIN=10dBm,
ALL OFF mode
21
25
-
dB
Input Power at 0.1dB
Compression Point
P-0.1dB
f=0.9GHz, 1.9GHz, 2.7GHz
36
-
-
dBm
2nd Harmonics 1
2fo(1)
f=0.9GHz, PIN=35dBm
-
-85
-70
dBc
2nd Harmonics 2
2fo(2)
f=1.9GHz, PIN=33dBm
-
-85
-70
dBc
2nd Harmonics 3
2fo(3)
f=2.7GHz, PIN=27dBm
-
-90
-70
dBc
3rd Harmonics 1
3fo(1)
f=0.9GHz, PIN=35dBm
-
-80
-70
dBc
3rd Harmonics 2
3fo(2)
f=1.9GHz, PIN=33dBm
-
-80
-70
dBc
3rd Harmonics 3
3fo(3)
f=2.7GHz, PIN=27dBm
-
-90
-70
dBc
Input 3rd order
intercept point1
IIP3(1)
f=829+849MHz,
PIN=+24dBm each*1
+65
+71
-
dBm
Input 3rd order
intercept point2
IIP3(2)
f=1870+1910MHz,
PIN=+24dBm each*1
+63
+70
-
dBm
VSWR
VSWR
on-state ports, f=2.7GHz
-
1.2
1.4
TSW
50% VCTL to 10/90% RF
-
1
5
Switching time
µs
*1: IIP3 are defined by the following equations.
IIP3=(3 x Pout-IM3)/2+LOSS
-3-
NJG1682MD7
I TERMINAL INFORMATION
No.
SYMBOL
DESCRIPTION
1
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
2
P1
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally.
3
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
4
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
5
P2
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally.
6
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
7
P3
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally.
8
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
9
PC
RF transmitting/receiving port. No DC blocking capacitor is required for this
port unless DC is biased externally. Please connect an inductor with GND
terminal for ESD protection.
10
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
11
GND
Ground terminal. Please connect this terminal with ground plane as close as
possible for excellent RF performance.
12
VDD
Positive voltage supply terminal. The positive voltage (+2.375~+5V) has to
be supplied. Please connect a bypass capacitor with GND terminal for
excellent RF performance.
13
VCTL2
Control signal input terminal. This terminal is set to High-Level
(+1.35~+5.0V) or Low-Level (0~+0.45V).
14
VCTL1
Control signal input terminal. This terminal is set to High-Level
(+1.35~+5.0V) or Low-Level (0~+0.45V).
Exposed
Pad
GND
-4-
Ground terminal.
NJG1682MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
Loss, ISL vs Frequency
Loss, ISL vs Frequency
-10
-0.8
-20
-1.2
-30
-1.6
-40
PC-P3 ISL
PC-P2 ISL
-2.0
-2.4
0.0
0.5
1.0
1.5
2.0
2.5
Insertion Loss (dB)
-0.4
0.0
-50
(PC-P2 ON, V =2.7V, V =0/1.8V)
DD
CTL
(Losses of external circuits are excluded)
-0.4
-10
-0.8
-20
-1.2
-30
-1.6
-40
PC-P3 ISL
PC-P1 ISL
-2.0
-60
3.0
-2.4
0.0
0.5
1.0
Frequency (GHz)
DD
-0.8
-20
-1.2
-30
-1.6
-40
0.5
1.0
1.5
2.0
Frequency (GHz)
2.5
-60
3.0
2.5
-50
-60
3.0
CTL
=0V)
(Losses of external circuits are excluded)
-10
Isolation (dB)
-10
PC-P2 ISL
PC-P1 ISL
0
0
-0.4
-2.4
0.0
2.0
ISL vs Frequency
(ALL OFF, V =2.7V, V
Isolation (dB)
Insertion Loss (dB)
(PC-P3 ON, V =2.7V, V =1.8V)
DD
CTL
(Losses of external circuits are excluded)
-2.0
1.5
-50
Frequency (GHz)
Loss, ISL vs Frequency
0.0
0
Isolation (dB)
0
Isolation (dB)
Insertion Loss (dB)
0.0
(PC-P1 ON, V =2.7V, V =0/1.8V)
DD
CTL
(Losses of external circuits are excluded)
-20
-30
-40
PC-P1 ISL
PC-P2 ISL
PC-P3 ISL
-50
-60
0.0
0.50
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
-5-
NJG1682MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
VSWR vs Frequency
(PC-P1 ON, V =2.7V, V
DD
CTL
VSWR vs Frequency
=0/1.8V)
(PC-P2 ON, V =2.7V, V
DD
2.0
CTL
=0/1.8V)
2.0
PC Port
P2 Port
1.8
1.8
1.6
1.6
VSWR
VSWR
PC Port
P1 Port
1.4
1.2
1.4
1.2
1.0
0.0
0.5
1.0
1.5
2.0
2.5
1.0
0.0
3.0
0.5
Frequency (GHz)
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
VSWR vs Frequency
(PC-P3 ON, V =2.7V, V
DD
CTL
=1.8V)
2.0
PC Port
P3 Port
VSWR
1.8
1.6
1.4
1.2
1.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
IDD vs. VDD
(No RF input, PC-P1 ON, V
CTL
300
Control Current vs. VCTL
=0/1.8V)
(No RF input, PC-P1 ON, V =2.7V)
10
Control Current (µ
µ A)
250
IDD (µ
µ A)
200
150
100
50
8
6
4
2
0
0
2.5
3
3.5
VDD (V)
-6-
DD
12
4
4.5
5
1.5
2
2.5
3
3.5
VCTL (V)
4
4.5
5
NJG1682MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
Output Power, I
DD
vs Input Power
Output Power, I
DD
(f=0.9GHz, PC-P1 ON, V =0/1.8V)
CTL
(Losses of external circuits are excluded)
(f=1.9GHz, PC-P1 ON, V =0/1.8V)
CTL
(Losses of external circuits are excluded)
36
400
VV =2.375V
=2.5V
30
250
28
200
26
150
24
100
22
20
22
24
26
28
30
32
34
32
300
30
250
28
200
26
150
24
100
50
22
50
0
20
36
22
24
Input Power (dBm)
Output Power, I
DD
vs Input Power
32
34
36
DD
300
30
250
28
200
26
150
Insertion Loss (dB)
=3.6V
VVDD=5V
32
(µ A)
350
DD
DD
VVDD=2.7V
=2.7V
CTL
=0/1.8V)
(Losses of external circuits are excluded)
0.0
400
Operation Current I
Output Power (dBm)
30
Loss, ISL vs Input Power
DD
DD
0
-0.2
-5
-0.4
-10
-15
-0.6
VV =2.5V
=2.375V
DD
DD
-0.8
VV =2.7V
=2.7V
-20
VVDD=3.6V
=5V
-25
DD
DD
-1.0
DD
-1.2
-30
-1.4
-35
24
100
-1.6
-40
22
50
-1.8
-45
0
-2.0
20
20
22
24
26
28
30
32
34
36
-50
20
22
24
Input Power (dBm)
(f=1.9GHz, PC-P1 ON, V
CTL
26
28
30
32
34
36
Input Power (dBm)
Loss, ISL vs Input Power
Loss, ISL vs Input Power
=0/1.8V)
(f=2.7GHz, PC-P1 ON, V
(Losses of external circuits are excluded)
CTL
=0/1.8V)
(Losses of external circuits are excluded)
-0.2
-5
-0.4
-10
-0.4
-10
-0.6
-15
VV =2.5V
=2.375V
DD
DD
-0.8
VV =2.7V
=2.7V
-20
VVDD=3.6V
=5V
-25
DD
DD
-1.0
DD
Insertion Loss (dB)
0.0
-5
PC-P2 Isolation (dB)
0
-0.2
0.0
Insertion Loss (dB)
28
(f=0.9GHz, PC-P1 ON, V
VV =2.375V
=2.5V
34
26
Input Power (dBm)
(f=2.7GHz, PC-P1 ON, V =0/1.8V)
CTL
(Losses of external circuits are excluded)
36
-1.6
-40
-1.8
-45
-50
-2.0
26
28
30
32
Input Power (dBm)
34
36
VV =2.7V
=2.7V
-20
VVDD=3.6V
=5V
-25
DD
DD
-35
24
DD
DD
-1.0
-30
22
-15
VV =2.5V
=2.375V
-0.8
-1.4
-2.0
0
-0.6
-1.2
20
(µ A)
0
20
PC-P2 Isolation (dB)
20
DD
DD
300
350
DD
=3.6V
VVDD=5V
Operation Current I
32
VVDD=2.7V
=2.7V
34
Output Power (dBm)
DD
DD
350
DD
=3.6V
VVDD=5V
(µ A)
DD
DD
Operation Current I
Output Power (dBm)
34
400
VV =2.375V
=2.5V
DD
DD
VVDD=2.7V
=2.7V
DD
-1.2
-30
-1.4
-35
-1.6
-40
-1.8
-45
PC-P2 Isolation (dB)
36
vs Input Power
-50
20
22
24
26
28
30
32
34
36
Input Power (dBm)
-7-
NJG1682MD7
I ELECTRICAL CHARACTERISTICS (With application circuit)
Loss, ISL vs Ambient Temperature
V =2.375V
-20
V DD=2.5V
VVDD=2.7V
=2.7V
DD
DD
VVDD=3.6V
=5V
DD
-0.6
-30
-0.8
-40
-1.0
-50
0
-0.4
VVDD=2.5V
=2.375V
DD
VVDD=3.6V
=5V
DD
-0.6
-30
-0.8
-40
-1.0
-50
0
-50
100
50
o
Ambient Temperature ( C)
Ambient Temperature ( C)
Loss, ISL vs Ambient Temperature
DC Current vs Ambient Temperature
(f=2.7GHz, PC-P1 ON, P =27dBm)
IN
(Losses of external circuits are excluded)
-20
DD
VVDD=2.7V
=2.7V
o
0.0
0
-10
-0.2
-50
100
50
(f=1.9GHz, PC-P1 ON, P =33dBm)
IN
(Losses of external circuits are excluded)
PC-P2 Isolation (dB)
0.0
Insertion Loss (dB)
Insertion Loss (dB)
0
-10
-0.2
-0.4
Loss, ISL vs Ambient Temperature
PC-P2 Isolation (dB)
0.0
(f=0.9GHz, PC-P1 ON, P =35dBm)
IN
(Losses of external circuits are excluded)
(No RF Signal)
300
0
30
VV =2.5V
=2.375V
-20
DD
VVDD=2.7V
=2.7V
DD
VVDD=3.6V
=5V
DD
-30
-0.6
-40
-0.8
250
VV =2.7V
=2.7V
DD
DD
VV =3.6V
=5V
25
DD
DD
I
200
I
CTL
20
DD
150
15
100
10
5
50
I
CTL
-1.0
-50
0
-50
100
50
o
Switching Time vs Ambient Temperature
(V =2.7V, V CTL=0/1.8V)
DD
Switching Time (µ s)
Trise
Trise
Tfall
Tfall
4
3
2
1
0
-50
0
50
o
Ambient Temperature ( C)
-8-
0
0
100
50
o
Ambient Temperature ( C)
Ambient Temperature ( C)
5
0
-50
100
Control Current (µ A)
Insertion Loss (dB)
-0.4
VVDD=2.5V
=2.375V
Operating Current (µ A)
-10
-0.2
PC-P2 Isolation (dB)
DD
DD
NJG1682MD7
I APPLICATION CIRCUIT
(TOP VIEW)
VCTL1
0/1.8V
VCTL2
0/1.8V
VDD
2.7V
C1
14
GND
13
12
1
11
GND
2
10
GND
3
9
DECODER
P1
GND
PC
L1*
GND
4
8
5
6
GND
7
GND
P2
P3
* The Inductor L1 is required for enhancing ESD protection level.
No DC blocking capacitors are required on all RF ports, unless DC is biased externally.
I PARTS LIST
No.
Parameters
Note
C1
1000pF
MURATA(GRM15)
L1
68nH
TAIYO-YUDEN (HK1005)
I PCB LAYOUT
PCB size: 26.0 x 15.0 mm
PCB: FR-4, t=0.2mm
Capacitor size: 1005
Microstrip line width: 0.38mm
(TOP VIEW)
GND
VDD
NC
VCTL2
VCTL1
C1
Losses of PCB and connectors, Ta=+25°C
P1
PC
Path
PC-P1
P2
P3
PC-P2
PC-P3
Frequency
(GHz)
0.9
1.9
2.7
0.9
1.9
2.7
Loss (dB)
0.18
0.34
0.42
0.17
0.32
0.40
I PRECAUTIONS
[1] No DC blocking capacitors are required at each RF port normally. When the other device is biased at
certain voltage and connected to the NJG1682MD7, a DC block capacitor is required between the device and
the switch IC. This is because the each RF port of NJG1682MD7 is biased at 0 V (GND).
[2] For avoiding the degradation of RF performance, the bypass capacitor (C1) should be placed as close as
possible to VDD terminal
[3] For good RF performance, all GND terminals are must be connected to PCB ground plane of substrate, and
through - holes for GND should be placed the IC near.
-9-
NJG1682MD7
I RECOMMENDED FOOTPRINT PATTERN (EQFN14-D7 PACKAGE Reference)
:Land
:Mask (Open area) *Metal mask thickness : 100um
:Resist(Open area)
Detail A
- 10 -
PKG:
1.6mm x 1.6mm
Pin pitch: 0.4mm
NJG1682MD7
I PACKAGE OUTLINE (EQFN14-D7)
Units
Board
Terminal treat
Molding material
Weight
: mm
: Cu
: SnBi
: Epoxy resin
: 3.4mg
Exposed PAD
Ground connection is required.
Cautions on using this product
This product contains Gallium-Arsenide (GaAs) which is a harmful material.
• Do NOT eat or put into mouth.
• Do NOT dispose in fire or break up this product.
• Do NOT chemically make gas or powder with this product.
• To waste this product, please obey the relating law of your country.
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle
with care to avoid these damages.
- 11 -