NJG1682MD7 HIGH POWER SP3T SWITCH GaAs MMIC I GENERAL DESCRIPTION The NJG1682MD7 is a GaAs SP3T switch MMIC suitable for LTE/UMTS/CDMA/GSM applications. The NJG1682MD7 features very low insertion loss, high isolation and excellent linearity performance down to 1.8V control voltage at high frequency up to 2.7GHz. In addition, this switch is able to handle high power signals. The NJG1682MD7 has ESD protection devices to achieve excellent ESD performances. No DC Blocking capacitors are required for all RF ports unless DC is biased externally. And the ultra small & ultra thin EQFN14-D7 package is adopted. I PACKAGE OUTLINE NJG1682MD7 I APPLICATIONS LTE, UMTS, CDMA, GSM applications Post PA Switching, Antenna Switching and Bands Switching applications General Purpose Switching applications I FEATURES G Low voltage logic control G Low voltage operation G Low distortion VCTL(H)=1.8V typ. VDD=2.7V typ. IIP3=+71dBm typ. @f=829+849MHz, PIN=24dBm, IIP3=+70dBm typ. @f=1870+1910MHz, PIN=24dBm, 2nd harmonics=-85dBc typ. @f=0.9GHz, PIN=35dBm 3rd harmonics=-80dBc typ. @f=0.9GHz, PIN=35dBm G P-0.1dB 36dBm min. G Low insertion loss 0.22dB typ. @f=0.9GHz, PIN=35dBm 0.25dB typ. @f=1.9GHz, PIN=33dBm 0.30dB typ. @f=2.7GHz, PIN=27dBm G Ultra small & ultra thin package EQFN14-D7 (Package size: 1.6 x 1.6 x 0.397mm.) G RoHS compliant and Halogen Free, MSL1 I PIN CONFIGURATION (TOP VIEW) GND VCTL1 VCTL2 VDD 14 13 12 1 11 GND DECODER P1 2 10 GND GND 3 9 PC GND 4 8 GND 5 6 7 P2 GND P3 Pin connection 1. GND 8. GND 2. P1 9. PC 3. GND 10. GND 4. GND 11. GND 5. P2 12. VDD 6. GND 13. VCTL2 7. P3 14. VCTL1 Exposed PAD: GND I TRUTH TABLE VCTL1 L H L H “H”=VCTL(H), “L”=VCTL(L) VCTL2 Path L ALL OFF L P1-PC H P2-PC H P3-PC NOTE: Please note that any information on this catalog will be subject to change. Ver.2013-09-18 -1- NJG1682MD7 I ABSOLUTE MAXIMUM RATINGS Ta=+25°C, Zs=Zl=50 ohm PARAMETER CONDITIONS SYMBOL RATINGS UNITS 37 dBm RF Input Power PIN VDD =2.7V Supply Voltage VDD 5.0 V Control Voltage VCTL 5.0 V 1300 mW Four-layer FR4 PCB with through-hole (74.2x74.2mm), Tj=150°C Power Dissipation PD Operating Temp. Topr -40~+85 °C Storage Temp. Tstg -55~+150 °C I ELECTRICAL CHARACTERISTICS 1 (DC) General conditions: Ta=+25°C, VDD=2.7V, VCTL(L)=0V, VCTL(H)=1.8V PARAMETERS SYMBOL Supply Voltage VDD Operating Current IDD CONDITIONS No RF input, VDD=2.7V MIN TYP MAX UNITS 2.375 2.7 5.0 V - 150 300 µA Control Voltage (LOW) VCTL(L) 0 - 0.45 V Control Voltage (HIGH) VCTL(H) 1.35 1.8 5.0 V - 4 10 µA Control Current -2- ICTL VCTL(H)=1.8V NJG1682MD7 I ELECTRICAL CHARACTERISTICS 2 (RF) General conditions: Ta=+25°C, Zs=Zl=50 ohm, VDD=2.7V, VCTL(L)=0V, VCTL(H)=1.8V PARAMETERS CONDITIONS SYMBOL MIN TYP MAX UNITS Insertion Loss 1 LOSS1 f=0.9GHz, PIN=35dBm - 0.22 0.37 dB Insertion Loss 2 LOSS2 f=1.9GHz, PIN=33dBm - 0.25 0.45 dB Insertion Loss 3 LOSS3 f=2.7GHz, PIN=27dBm - 0.30 0.50 dB Isolation 1 ISL1 f=0.9GHz, PIN=35dBm 30 35 - dB Isolation 2 ISL2 f=1.9GHz, PIN=33dBm 25 30 - dB Isolation 3 ISL3 f=2.7GHz, PIN=27dBm 22 27 - dB Isolation 4 ISL4 f=0.9GHz, PIN=10dBm, ALL OFF mode 30 35 - dB Isolation 5 ISL5 f=1.9GHz, PIN=10dBm, ALL OFF mode 25 30 - dB Isolation 6 ISL6 f=2.7GHz, PIN=10dBm, ALL OFF mode 21 25 - dB Input Power at 0.1dB Compression Point P-0.1dB f=0.9GHz, 1.9GHz, 2.7GHz 36 - - dBm 2nd Harmonics 1 2fo(1) f=0.9GHz, PIN=35dBm - -85 -70 dBc 2nd Harmonics 2 2fo(2) f=1.9GHz, PIN=33dBm - -85 -70 dBc 2nd Harmonics 3 2fo(3) f=2.7GHz, PIN=27dBm - -90 -70 dBc 3rd Harmonics 1 3fo(1) f=0.9GHz, PIN=35dBm - -80 -70 dBc 3rd Harmonics 2 3fo(2) f=1.9GHz, PIN=33dBm - -80 -70 dBc 3rd Harmonics 3 3fo(3) f=2.7GHz, PIN=27dBm - -90 -70 dBc Input 3rd order intercept point1 IIP3(1) f=829+849MHz, PIN=+24dBm each*1 +65 +71 - dBm Input 3rd order intercept point2 IIP3(2) f=1870+1910MHz, PIN=+24dBm each*1 +63 +70 - dBm VSWR VSWR on-state ports, f=2.7GHz - 1.2 1.4 TSW 50% VCTL to 10/90% RF - 1 5 Switching time µs *1: IIP3 are defined by the following equations. IIP3=(3 x Pout-IM3)/2+LOSS -3- NJG1682MD7 I TERMINAL INFORMATION No. SYMBOL DESCRIPTION 1 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 2 P1 RF transmitting/receiving port. No DC blocking capacitor is required for this port unless DC is biased externally. 3 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 4 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 5 P2 RF transmitting/receiving port. No DC blocking capacitor is required for this port unless DC is biased externally. 6 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 7 P3 RF transmitting/receiving port. No DC blocking capacitor is required for this port unless DC is biased externally. 8 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 9 PC RF transmitting/receiving port. No DC blocking capacitor is required for this port unless DC is biased externally. Please connect an inductor with GND terminal for ESD protection. 10 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 11 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 12 VDD Positive voltage supply terminal. The positive voltage (+2.375~+5V) has to be supplied. Please connect a bypass capacitor with GND terminal for excellent RF performance. 13 VCTL2 Control signal input terminal. This terminal is set to High-Level (+1.35~+5.0V) or Low-Level (0~+0.45V). 14 VCTL1 Control signal input terminal. This terminal is set to High-Level (+1.35~+5.0V) or Low-Level (0~+0.45V). Exposed Pad GND -4- Ground terminal. NJG1682MD7 I ELECTRICAL CHARACTERISTICS (With application circuit) Loss, ISL vs Frequency Loss, ISL vs Frequency -10 -0.8 -20 -1.2 -30 -1.6 -40 PC-P3 ISL PC-P2 ISL -2.0 -2.4 0.0 0.5 1.0 1.5 2.0 2.5 Insertion Loss (dB) -0.4 0.0 -50 (PC-P2 ON, V =2.7V, V =0/1.8V) DD CTL (Losses of external circuits are excluded) -0.4 -10 -0.8 -20 -1.2 -30 -1.6 -40 PC-P3 ISL PC-P1 ISL -2.0 -60 3.0 -2.4 0.0 0.5 1.0 Frequency (GHz) DD -0.8 -20 -1.2 -30 -1.6 -40 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 -60 3.0 2.5 -50 -60 3.0 CTL =0V) (Losses of external circuits are excluded) -10 Isolation (dB) -10 PC-P2 ISL PC-P1 ISL 0 0 -0.4 -2.4 0.0 2.0 ISL vs Frequency (ALL OFF, V =2.7V, V Isolation (dB) Insertion Loss (dB) (PC-P3 ON, V =2.7V, V =1.8V) DD CTL (Losses of external circuits are excluded) -2.0 1.5 -50 Frequency (GHz) Loss, ISL vs Frequency 0.0 0 Isolation (dB) 0 Isolation (dB) Insertion Loss (dB) 0.0 (PC-P1 ON, V =2.7V, V =0/1.8V) DD CTL (Losses of external circuits are excluded) -20 -30 -40 PC-P1 ISL PC-P2 ISL PC-P3 ISL -50 -60 0.0 0.50 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) -5- NJG1682MD7 I ELECTRICAL CHARACTERISTICS (With application circuit) VSWR vs Frequency (PC-P1 ON, V =2.7V, V DD CTL VSWR vs Frequency =0/1.8V) (PC-P2 ON, V =2.7V, V DD 2.0 CTL =0/1.8V) 2.0 PC Port P2 Port 1.8 1.8 1.6 1.6 VSWR VSWR PC Port P1 Port 1.4 1.2 1.4 1.2 1.0 0.0 0.5 1.0 1.5 2.0 2.5 1.0 0.0 3.0 0.5 Frequency (GHz) 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) VSWR vs Frequency (PC-P3 ON, V =2.7V, V DD CTL =1.8V) 2.0 PC Port P3 Port VSWR 1.8 1.6 1.4 1.2 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) IDD vs. VDD (No RF input, PC-P1 ON, V CTL 300 Control Current vs. VCTL =0/1.8V) (No RF input, PC-P1 ON, V =2.7V) 10 Control Current (µ µ A) 250 IDD (µ µ A) 200 150 100 50 8 6 4 2 0 0 2.5 3 3.5 VDD (V) -6- DD 12 4 4.5 5 1.5 2 2.5 3 3.5 VCTL (V) 4 4.5 5 NJG1682MD7 I ELECTRICAL CHARACTERISTICS (With application circuit) Output Power, I DD vs Input Power Output Power, I DD (f=0.9GHz, PC-P1 ON, V =0/1.8V) CTL (Losses of external circuits are excluded) (f=1.9GHz, PC-P1 ON, V =0/1.8V) CTL (Losses of external circuits are excluded) 36 400 VV =2.375V =2.5V 30 250 28 200 26 150 24 100 22 20 22 24 26 28 30 32 34 32 300 30 250 28 200 26 150 24 100 50 22 50 0 20 36 22 24 Input Power (dBm) Output Power, I DD vs Input Power 32 34 36 DD 300 30 250 28 200 26 150 Insertion Loss (dB) =3.6V VVDD=5V 32 (µ A) 350 DD DD VVDD=2.7V =2.7V CTL =0/1.8V) (Losses of external circuits are excluded) 0.0 400 Operation Current I Output Power (dBm) 30 Loss, ISL vs Input Power DD DD 0 -0.2 -5 -0.4 -10 -15 -0.6 VV =2.5V =2.375V DD DD -0.8 VV =2.7V =2.7V -20 VVDD=3.6V =5V -25 DD DD -1.0 DD -1.2 -30 -1.4 -35 24 100 -1.6 -40 22 50 -1.8 -45 0 -2.0 20 20 22 24 26 28 30 32 34 36 -50 20 22 24 Input Power (dBm) (f=1.9GHz, PC-P1 ON, V CTL 26 28 30 32 34 36 Input Power (dBm) Loss, ISL vs Input Power Loss, ISL vs Input Power =0/1.8V) (f=2.7GHz, PC-P1 ON, V (Losses of external circuits are excluded) CTL =0/1.8V) (Losses of external circuits are excluded) -0.2 -5 -0.4 -10 -0.4 -10 -0.6 -15 VV =2.5V =2.375V DD DD -0.8 VV =2.7V =2.7V -20 VVDD=3.6V =5V -25 DD DD -1.0 DD Insertion Loss (dB) 0.0 -5 PC-P2 Isolation (dB) 0 -0.2 0.0 Insertion Loss (dB) 28 (f=0.9GHz, PC-P1 ON, V VV =2.375V =2.5V 34 26 Input Power (dBm) (f=2.7GHz, PC-P1 ON, V =0/1.8V) CTL (Losses of external circuits are excluded) 36 -1.6 -40 -1.8 -45 -50 -2.0 26 28 30 32 Input Power (dBm) 34 36 VV =2.7V =2.7V -20 VVDD=3.6V =5V -25 DD DD -35 24 DD DD -1.0 -30 22 -15 VV =2.5V =2.375V -0.8 -1.4 -2.0 0 -0.6 -1.2 20 (µ A) 0 20 PC-P2 Isolation (dB) 20 DD DD 300 350 DD =3.6V VVDD=5V Operation Current I 32 VVDD=2.7V =2.7V 34 Output Power (dBm) DD DD 350 DD =3.6V VVDD=5V (µ A) DD DD Operation Current I Output Power (dBm) 34 400 VV =2.375V =2.5V DD DD VVDD=2.7V =2.7V DD -1.2 -30 -1.4 -35 -1.6 -40 -1.8 -45 PC-P2 Isolation (dB) 36 vs Input Power -50 20 22 24 26 28 30 32 34 36 Input Power (dBm) -7- NJG1682MD7 I ELECTRICAL CHARACTERISTICS (With application circuit) Loss, ISL vs Ambient Temperature V =2.375V -20 V DD=2.5V VVDD=2.7V =2.7V DD DD VVDD=3.6V =5V DD -0.6 -30 -0.8 -40 -1.0 -50 0 -0.4 VVDD=2.5V =2.375V DD VVDD=3.6V =5V DD -0.6 -30 -0.8 -40 -1.0 -50 0 -50 100 50 o Ambient Temperature ( C) Ambient Temperature ( C) Loss, ISL vs Ambient Temperature DC Current vs Ambient Temperature (f=2.7GHz, PC-P1 ON, P =27dBm) IN (Losses of external circuits are excluded) -20 DD VVDD=2.7V =2.7V o 0.0 0 -10 -0.2 -50 100 50 (f=1.9GHz, PC-P1 ON, P =33dBm) IN (Losses of external circuits are excluded) PC-P2 Isolation (dB) 0.0 Insertion Loss (dB) Insertion Loss (dB) 0 -10 -0.2 -0.4 Loss, ISL vs Ambient Temperature PC-P2 Isolation (dB) 0.0 (f=0.9GHz, PC-P1 ON, P =35dBm) IN (Losses of external circuits are excluded) (No RF Signal) 300 0 30 VV =2.5V =2.375V -20 DD VVDD=2.7V =2.7V DD VVDD=3.6V =5V DD -30 -0.6 -40 -0.8 250 VV =2.7V =2.7V DD DD VV =3.6V =5V 25 DD DD I 200 I CTL 20 DD 150 15 100 10 5 50 I CTL -1.0 -50 0 -50 100 50 o Switching Time vs Ambient Temperature (V =2.7V, V CTL=0/1.8V) DD Switching Time (µ s) Trise Trise Tfall Tfall 4 3 2 1 0 -50 0 50 o Ambient Temperature ( C) -8- 0 0 100 50 o Ambient Temperature ( C) Ambient Temperature ( C) 5 0 -50 100 Control Current (µ A) Insertion Loss (dB) -0.4 VVDD=2.5V =2.375V Operating Current (µ A) -10 -0.2 PC-P2 Isolation (dB) DD DD NJG1682MD7 I APPLICATION CIRCUIT (TOP VIEW) VCTL1 0/1.8V VCTL2 0/1.8V VDD 2.7V C1 14 GND 13 12 1 11 GND 2 10 GND 3 9 DECODER P1 GND PC L1* GND 4 8 5 6 GND 7 GND P2 P3 * The Inductor L1 is required for enhancing ESD protection level. No DC blocking capacitors are required on all RF ports, unless DC is biased externally. I PARTS LIST No. Parameters Note C1 1000pF MURATA(GRM15) L1 68nH TAIYO-YUDEN (HK1005) I PCB LAYOUT PCB size: 26.0 x 15.0 mm PCB: FR-4, t=0.2mm Capacitor size: 1005 Microstrip line width: 0.38mm (TOP VIEW) GND VDD NC VCTL2 VCTL1 C1 Losses of PCB and connectors, Ta=+25°C P1 PC Path PC-P1 P2 P3 PC-P2 PC-P3 Frequency (GHz) 0.9 1.9 2.7 0.9 1.9 2.7 Loss (dB) 0.18 0.34 0.42 0.17 0.32 0.40 I PRECAUTIONS [1] No DC blocking capacitors are required at each RF port normally. When the other device is biased at certain voltage and connected to the NJG1682MD7, a DC block capacitor is required between the device and the switch IC. This is because the each RF port of NJG1682MD7 is biased at 0 V (GND). [2] For avoiding the degradation of RF performance, the bypass capacitor (C1) should be placed as close as possible to VDD terminal [3] For good RF performance, all GND terminals are must be connected to PCB ground plane of substrate, and through - holes for GND should be placed the IC near. -9- NJG1682MD7 I RECOMMENDED FOOTPRINT PATTERN (EQFN14-D7 PACKAGE Reference) :Land :Mask (Open area) *Metal mask thickness : 100um :Resist(Open area) Detail A - 10 - PKG: 1.6mm x 1.6mm Pin pitch: 0.4mm NJG1682MD7 I PACKAGE OUTLINE (EQFN14-D7) Units Board Terminal treat Molding material Weight : mm : Cu : SnBi : Epoxy resin : 3.4mg Exposed PAD Ground connection is required. Cautions on using this product This product contains Gallium-Arsenide (GaAs) which is a harmful material. • Do NOT eat or put into mouth. • Do NOT dispose in fire or break up this product. • Do NOT chemically make gas or powder with this product. • To waste this product, please obey the relating law of your country. [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle with care to avoid these damages. - 11 -