PYX28C64 - Pyramid Semiconductor

PYX28C64
8K x 8 EEPROM
FEATURES
Access Times of 200, 250, 300 and 350 ns
Software Data Protection
Single 5V±10% Power Supply
Fully TTL Compatible Inputs and Outputs
Simple Byte and Page Write
Endurance: 10,000 or 100,000 Cycles
Low Power CMOS:
- 60 mA Active Current
- 200 µA Standby Current
Data Retention: 100 Years
Available in the following Packages:
– 32-Pin Ceramic LCC (450 x 550 mils)
– 28-Pin 600 mil Ceramic DIP
Fast Write Cycle Times
DESCRIPTION
PIN CONFIGURATIONS
The PYX28C64 is a 5 Volt 8Kx8 EEPROM using floating
gate CMOS Technology. The device supports 64-byte
page write operation. The PYX28C64 features DATA and
Toggle Bit Polling as well as a system software scheme
used to indicate early completion of a Write Cycle. The
device also includes user-optional software data protection. Endurance is 10,000 or 100,000 Cycles and Data
Retention is 100 Years. The device is available in a 32-Pin
LCC package as well as a 28-Pin 600 mil wide Ceramic
DIP.
DIP (C5-1)
FUNCTIONAL BLOCK DIAGRAM
1519B
LCC
(L6)
Document # EEPROM101 REV B
Revised July 2007
1
PYX28C64
MAXIMUM RATINGS(1)
Symbol
Parameter
Value
Unit
V CC
Power Supply Pin with
Respect to GND
–0.3 to +6.25
V
V TERM
Terminal Voltage with
Respect to GND
(up to 6.25V)
–0.5 to
+6.25
V
TA
Operating Temperature
–55 to +125
°C
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Grade(2)
Military
Ambient
Temperature
GND
V CC
–55°C to +125°C
0V
5.0V ± 10%
Symbol
Parameter
Value
Unit
TBIAS
Temperature Under
Bias
–55 to +125
°C
TSTG
Storage Temperature
–65 to +150
°C
PT
Power Dissipation
1.0
W
IOUT
DC Output Current
50
mA
CAPACITANCES(4)
VCC = 5.0V, TA = 25°C, f = 1.0MHz
Symbol
Parameter
Conditions Typ. Unit
CIN
Input Capacitance
COUT
Output Capacitance
VIN = 0V
10
pF
VOUT = 0V
10
pF
DC ELECTRICAL CHARACTERISTICS
Over recommended operating temperature and supply voltage(2)
Symbol
VIH
Parameter
Test Conditions
Input High Voltage
P5C164
Unit
Min
Max
2.0
VCC +0.3
V
0.8
V
VCC +0.5
V
0.2
V
0.4
V
–0.5
(3)
VIL
Input Low Voltage
V HC
VLC
CMOS Input High Voltage
VOL
Output Low Voltage
(TTL Load)
IOL = +8 mA, VCC = Min.
VOH
Output High Voltage
(TTL Load)
IOH = –4 mA, VCC = Min.
2.4
ILI
Input Leakage Current
VCC = Max.
–10
+10
µA
ILO
Output Leakage Current
VCC = Max., CE = VIH,
–10
+10
µA
ISB
Standby Power Supply
Current (TTL Input Levels)
CE ≥ VIH, OE = VIL,
VCC= Max,
f = Max., Outputs Open
___
3
mA
ISB1
Standby Power Supply
Current
(CMOS Input Levels)
CE ≥ VHC,
VCC= Max,
f = 0, Outputs Open
VIN ≤ VLC or VIN ≥ VHC
___
250
µA
Supply Current
CE = OE = VIL,
WE = VIH,
All I/O's = Open,
Inputs = VCC = 5.5V
ICC
VCC –0.2
–0.5
CMOS Input Low Voltage
V
VIN = GND to VCC
VOUT = GND to VCC
Notes:
1. Stresses greater than those listed under MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification
is not implied. Exposure to MAXIMUM rating conditions for extended
periods may affect reliability.
Document # EEPROM101 REV B
(3)
___
60
mA
2. Extended temperature operation guaranteed with 400 linear feet per
minute of air flow.
3. Transient inputs with VIL and IIL not more negative than –3.0V and
–100mA, respectively, are permissible for pulse widths up to 20 ns.
4. This parameter is sampled and not 100% tested.
Page 2 of 11
PYX28C64
AC ELECTRICAL CHARACTERISTICS—READ CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Symbol
Parameter
-200
Min Max
-250
Min Max
-300
Min Max
-350
Unit
Min Max
200
250
300
350
tAVAV
Read Cycle Time
tAVQV
Address Access Time
200
250
300
350
ns
tELQV
Chip Enable Access Time
200
250
300
350
ns
tOLQV
Output Enable Access Time
100
100
100
100
ns
tELQX
Chip Enable to Output in Low Z
tEHQZ
Chip Disable to Output in High Z
tOLQX
Output Enable to Output in Low Z
tOHQZ
Output Disable to Output in High Z
tAVQX
Output Hold from Address Change
tPU
Chip Enable to Power Up Time
tPD
Chip Disable to Power Down Time
10
10
80
10
10
80
10
80
0
10
80
10
80
0
ns
ns
80
10
80
0
ns
ns
80
0
ns
ns
250
250
250
250
ns
50
50
50
50
ns
TIMING WAVEFORM OF READ CYCLE
Document # EEPROM101 REV B
Page 3 of 11
PYX28C64
AC CHARACTERISTICS—WRITE CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Symbol
tWHWL1
tEHEL1
tAVEL
tAVWL
tELAX
tWLAX
tWLEL
tELWL
tWHEH
tOHEL
tOHWL
tWHOL
tELEH
tWLWH
tDVEH
tDVWH
tEHDX
tWHDX
tEHEL2
tWHWL2
tELWL
Parameter
-200
Min Max
Write Cycle Time
-250
Min Max
10
-300
Min Max
10
-350
Unit
Min Max
10
10
ms
Address Setup Time
20
20
20
20
ns
Address Hold Time
150
150
150
150
ns
Write Setup Time
0
0
0
0
ns
Write Hold Time
0
0
0
0
ns
OE Setup Time
20
20
20
20
ns
OE Hold Time
20
20
20
20
ns
WE Pulse Width
150
150
150
150
ns
Data Setup Time
50
50
50
50
ns
Data Hold Time
10
10
10
10
ns
Byte Load Cycle Time
0.2
CE Setup Time
tOVHWL Output Setup Time
2
0.2
2
0.2
2
0.2
2
µs
1
1
1
1
µs
1
1
1
1
µs
tEHWH
CE Hold Time
1
1
1
1
µs
tWHOH
OE Hold Time
1
1
1
1
µs
tOHAV
Erase Time
200
200
200
200
ms
150
150
150
150
ns
tWLWH2 Chip Erase Time
VH
High Voltage for Chip Clear
Document # EEPROM101 REV B
12
13
12
13
12
13
12
13
V
Page 4 of 11
PYX28C64
CE CONTROLLED)
TIMING WAVEFORM OF BYTE WRITE CYCLE (CE
WE CONTROLLED)
TIMING WAVEFORM OF BYTE WRITE CYCLE (WE
Document # EEPROM101 REV B
Page 5 of 11
PYX28C64
TIMING WAVEFORM OF PAGE WRITE CYCLE
TIMING WAVEFORM OF CHIP CLEAR CYCLE
Document # EEPROM101 REV B
Page 6 of 11
PYX28C64
WRITE SEQUENCE FOR SOFTWARE
DATA PROTECTION
Document # EEPROM101 REV B
SOFTWARE SEQUENCE TO
DE-ACTIVATE SOFTWARE DATA
PROTECTION
Page 7 of 11
PYX28C64
AC TEST CONDITIONS
Input Pulse Levels
TRUTH TABLE
GND to 3.0V
Input Rise and Fall Times
10ns
Input Timing Reference Level
1.5V
Output Timing Reference Level
1.5V
Output Load
See Fig. 1
Mode
CE
OE
WE
I/O
Read
VIL
VIL
VIH
DOUT
Chip clear
VIL
VH
VIL
X
Byte write
VIL
VIH
VIL
DIN
Write inhibit
X
VIL
X
High Z/DOUT
Write inhibit
X
X
VIH
High Z/DOUT
VIH
X
X
Standby
High Z
FIGURE 1. OUTPUT LOAD
Document # EEPROM101 REV B
Page 8 of 11
PYX28C64
ORDERING INFORMATION
ENDURANCE
DEVICE
MINIMUM ENDURANCE
PYX28C64
10,000 cycles (Standard)
PYX28C64X 100,000 cycles (High Endurance)
Document # EEPROM101 REV B
Page 9 of 11
PYX28C64
Pkg #
# Pins
Symbol
A
b
b2
C
D
E
eA
e
L
Q
S1
S2
Pkg #
# Pins
Symbol
A
A1
B1
D
D1
D2
D3
E
E1
E2
E3
e
h
j
L
L1
L2
ND
NE
C5-1
SIDE BRAZED DUAL IN-LINE PACKAGE (600 mils)
28 (600 mil)
Min
Max
0.232
0.014
0.026
0.045
0.065
0.008
0.018
1.490
0.500
0.610
0.600 BSC
0.100 BSC
0.125
0.200
0.015
0.060
0.005
0.005
-
L6
RECTANGULAR LEADLESS CHIP CARRIER
32
Min
Max
0.060
0.075
0.050
0.065
0.022
0.028
0.442
0.458
0.300 BSC
0.150 BSC
0.458
0.540
0.560
0.400 BSC
0.200 BSC
0.558
0.050 BSC
0.040 REF
0.020 REF
0.045
0.055
0.045
0.055
0.075
0.095
7
9
Document # EEPROM101 REV B
Page 10 of 11
PYX28C64
REVISIONS
DOCUMENT NUMBER:
DOCUMENT TITLE:
EEPROM101
PYX28C64 8K x 8 EEPROM
REV.
ISSUE
DATE
ORIG. OF
CHANGE
OR
Jul-06
JDB
New Data Sheet
A
May-07
JDB
Renamed device from P5C164 to P6C28C64
B
Jul-07
JDB
Renamed device from P6C28C64 to PYX28C64
Document # EEPROM101 REV B
DESCRIPTION OF CHANGE
Page 11 of 11