Material Declaration Report Package Type: TQFN 56L Component Weight (mg): 144.0000 Pericom Package Code: ZB56 (Pb-free) MSL Rating: 2 Termination Plating: NiPdAu RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e4 Applicable Exemption: N/A Max Time (sec): 30 Plating Thickness (um): 0.5~2.2 Reflow Cycles: 3 Tin Whisker Mitigation: N/A Rev Date: 2012/2/9 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) MOLD COMPOUND 95.75330 LEADFRAME 44.64000 SILICON DIE ASSEMBLY SUBCON MATERIAL COMPOSITION GTK CAS NO. COMPOSITION % COMPOSITION WEIGHT(mg) Epoxy Resin A Epoxy Resin B Phenol Resin Metal Hydroxide Carbon black Silica fused Silica fused Silica crystalline Trade secret Trade secret Trade secret Trade secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 5.00 2.50 5.00 3.00 0.50 68.50 15.00 0.50 4.78767 2.39383 4.78767 2.87260 0.47877 65.59101 14.36300 0.47877 Copper Iron Zinc Phosphorus Nickel(Ni) palladium(Pd) Gold(Au) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 95.74 2.31 0.12 0.08 1.58 0.15 0.02 42.73834 1.03118 0.05357 0.03571 0.70531 0.06696 0.00893 2.93300 Silicon (Si) Non-hazardous Metal 7440-21-3 Proprietary 99.19 0.81 2.90930 0.02370 DIE ATTACH EPOXY 0.28770 Silver Epoxy resin A Epoxy resin B Epoxy resin C Acrylate Phenolic Hardener Dicyandiamide Organic peroxide 7440-22-4 9003-36-5 Trade secret Trade secret Trade secret Trade secret 461-58-5 Trade secret 71.00 5.00 6.00 6.00 6.00 5.00 0.30 0.70 0.20427 0.01439 0.01726 0.01726 0.01726 0.01439 0.00086 0.00201 WIRE BOND 0.38600 Copper Palladium 7440-50-8 7440-5-3 97.30 2.70 0.37558 0.01042 NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) Device MATERIAL Pb Hg Cr+6 Cd PBB Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 PBDE <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive <1000ppm O Hg <1000ppm O Cr+6 <1000ppm O Cd <100ppm O PBB <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. PBDE <1000ppm O