Material Declaration Report

Material Declaration Report
Package Type: QSOP 24L
Component Weight (mg): 135.875
Pericom Package Code: Q24(Pb-free)
MSL Rating: 1
Termination Plating: Matte Tin
RoHS Compliance: Yes
Peak Body Temp (C): 260
JESD 97 Pb-free Category: e3
Applicable Exemption: N/A
Max Time (sec): 40
Plating Thickness (um): 10~20
Reflow Cycles: 3
Tin Whisker Mitigation: Anneal, 150C/1hr
Rev Date: 6/4/2008
Homogeneous Material Declaration
MATERIAL
ITEM
MATERIAL
WEIGHT(mg)
ASSEMBLY
SUBCON
MATERIAL
COMPOSITION
85.024
MOLD COMPOUND
UTL and SPEL
46.860
LEADFRAME
SILICON DIE
1.916
0.357
DIE ATTACH EPOXY
UTL
SPEL
CAS NO.
COMPOSITION
%
COMPOSITION
WEIGHT(mg)
Silica Fused
Epoxy Resin
Epoxy, Cresol Novolac
Phenolic Resin
Carbon Black
60676-86-0
Proprietary
29690-82-2
Proprietary
1333-86-4
88.000
5.000
2.000
4.500
0.500
74.8211
4.2512
1.7005
3.8261
0.4251
Copper
Iron
Silver
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7723-14-0
97.021
2.350
0.453
0.111
0.065
45.4639
1.1012
0.2124
0.0519
0.0305
Silicon (Si)
Non-hazardous Metal
7440-21-3
Proprietary
99.192
0.808
1.9005
0.0155
Silver
Functionalized Urethane
Diester Resin
Epoxy Resin
7440-22-4
Proprietary
Proprietary
Proprietary
80.000
8.000
7.000
5.000
0.2856
0.0286
0.0250
0.0179
Silver
Epoxy Resin
Diluent
Hardener
Dicyandamide
7440-22-4
9003-36-5
26447-14-3
620-92-8
461-58-5
80.000
10.000
6.000
3.250
0.750
0.2856
0.0357
0.0214
0.0116
0.0027
GOLD WIRE
0.524
Gold(Au)
Impurities
7440-57-5
-
99.990
0.010
0.5239
0.0001
SOLDER PLATING
1.194
Tin (Sn)
Impurity
7440-31-5
-
99.990
0.010
1.1939
0.0001
NOTE: The device contents disclosed are approximated and are based on engineering estimates.
3rd Party Analysis Results (PPM)
Device
MATERIAL
Pb
Hg
Cr+6
Cd
PBB
Mold Compound
Leadframe
Silicon Die
Die Attach Epoxy
Gold Wire
Solder Plating
<2
<50
<2
<2
<2
<50
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<5
<5
<5
<5
<5
<5
PBDE
<5
<5
<5
<5
<5
<5
ROHS MATERIAL COMPOSITION DECLARATION
EU RoHS
Directive
2002/95/EC
Declaration
Statement:
Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury,
Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE);
and Quantity limit of 0.01% (100 PPM) for Cadmium
and
Pb
China RoHS
Directive
<1000ppm
O
Hg
<1000ppm
O
Cr+6
<1000ppm
O
Cd
<100ppm
O
PBB
<1000ppm
O
SJ/T11363-2006
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous
materials for this part is below the limit requirement in SJ/T11363-2006.
X: Indicates that this toxic or hazardous substance contained in at least one of the
homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006.
PBDE
<1000ppm
O