Material Declaration Report Package Type: QSOP 24L Component Weight (mg): 135.875 Pericom Package Code: Q24(Pb-free) MSL Rating: 1 Termination Plating: Matte Tin RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e3 Applicable Exemption: N/A Max Time (sec): 40 Plating Thickness (um): 10~20 Reflow Cycles: 3 Tin Whisker Mitigation: Anneal, 150C/1hr Rev Date: 6/4/2008 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) ASSEMBLY SUBCON MATERIAL COMPOSITION 85.024 MOLD COMPOUND UTL and SPEL 46.860 LEADFRAME SILICON DIE 1.916 0.357 DIE ATTACH EPOXY UTL SPEL CAS NO. COMPOSITION % COMPOSITION WEIGHT(mg) Silica Fused Epoxy Resin Epoxy, Cresol Novolac Phenolic Resin Carbon Black 60676-86-0 Proprietary 29690-82-2 Proprietary 1333-86-4 88.000 5.000 2.000 4.500 0.500 74.8211 4.2512 1.7005 3.8261 0.4251 Copper Iron Silver Zinc Phosphorus 7440-50-8 7439-89-6 7440-22-4 7440-66-6 7723-14-0 97.021 2.350 0.453 0.111 0.065 45.4639 1.1012 0.2124 0.0519 0.0305 Silicon (Si) Non-hazardous Metal 7440-21-3 Proprietary 99.192 0.808 1.9005 0.0155 Silver Functionalized Urethane Diester Resin Epoxy Resin 7440-22-4 Proprietary Proprietary Proprietary 80.000 8.000 7.000 5.000 0.2856 0.0286 0.0250 0.0179 Silver Epoxy Resin Diluent Hardener Dicyandamide 7440-22-4 9003-36-5 26447-14-3 620-92-8 461-58-5 80.000 10.000 6.000 3.250 0.750 0.2856 0.0357 0.0214 0.0116 0.0027 GOLD WIRE 0.524 Gold(Au) Impurities 7440-57-5 - 99.990 0.010 0.5239 0.0001 SOLDER PLATING 1.194 Tin (Sn) Impurity 7440-31-5 - 99.990 0.010 1.1939 0.0001 NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) Device MATERIAL Pb Hg Cr+6 Cd PBB Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating <2 <50 <2 <2 <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 PBDE <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive <1000ppm O Hg <1000ppm O Cr+6 <1000ppm O Cd <100ppm O PBB <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. PBDE <1000ppm O