Reliability Report AE Series

Reliability Report
AE Series
SOIC-8 Package
AE Series Part Number
AE368, AE367, AE514, AE617, AE618
Description
This document describes the reliability performance of AE368, AE367, AE514, AE617
Package : SOIC-8
and AE618 based on a series of reliability tests conducted. AE368, AE367, AE514, AE617 and AE618 reliability
performances were leveraged on AE368, based on similarities in wafer fabrication, packaging process and
technologies.
AE368, AE367, AE514, AE617 and AE618 are RFHIC’s proprietary E-pHEMT (Enhancement Mode Pseudomorphic
High Electron Mobility Transistor) MMIC specifically designed for various applications such as Cellular, GSM, PCS,
DCS, W-CDMA, Wibro, WiMax, WiFi, RFID, Femtocell, Multi-metering, HDTV, CATV set-top box, HD cable modem,
HD satellite set-top box, VOD and IPTV. These MMICs are based on Gallium Arsenide Enhancement Mode E-pHEMT
which generates low current draw and very low noise. All RFHIC’s AD series is valid only for 50ohm and 75ohm
application.
Qualification Methodology
RFHIC’s qualification process consists of a series of tests designed to stress various potential failure mechanisms.
This testing is performed to ensure that RFHIC products are robust against potential failure modes that could arise
from the various die and package failure mechanisms stressed. The qualification testing is based on JEDEC test
methods common to the semiconductor industry, and the specifications are used as the PASS/FAIL criteria for initial
and final DC/RF tests.
1. Estimates for various channel temperature are as follows
<Graph-1>MTTF
For product information and a complete list of distributors, please go to our web site: www.rfhic.com
RFHIC and its logo are trademarks of RFHIC Corporation in Korea and other countries.
Data subject to change. Copyright @ 2010 RFHIC Corporation. All rights reserved.
<Graph-2>FIT
RHQD-1009-008
Reliability Report
AE Series
SOIC-8 Package
2. Thermal information
<Figure-1>Infrared Thermal Image of AE368
Condition
Tc = 85℃, Tj = 141℃ Vdd = 5V, Ids = 301mA
3. Product Qualification - Operational Life Test Results
Test Name
Standard
Test Condition
Duration
Sample Size
Results
JESD22-A108B
Tj=150°C
1000hours
77
Pass
JESD22-A110C
+130°C/85%/230kPa
96hours
77
Pass
High Temperature
Operating
Life(HTOL)
High Accelerated
Temperature and
Humidity Stress
Test(HAST)
4. Product Qualification - Environment Stress Results
Test Name
Temperature
Cycling(TC)
Unbiased
Autoclave(UA)
Standard
Test Condition
Duration
Sample Size
Results
JESD22-A104D
-65°C to +150°C 2cycle=1hours
500cycles
77
Pass
JESD22-A102C
+121°C/100%/205kPa
96hours
77
Pass
11
Pass
Dip & Look Sn/Ag/Cu solder
Solderability
JESD22-B102E
Steam Age Condition C
Dip Condition B, 245°C
For product information and a complete list of distributors, please go to our web site: www.rfhic.com
RFHIC and its logo are trademarks of RFHIC Corporation in Korea and other countries.
Data subject to change. Copyright @ 2010 RFHIC Corporation. All rights reserved.
RHQD-1009-008
AE Series
Reliability Report
SOIC-8 Package
5. Electrostatic Discharge Test Results
ESD TEST
Human Body Model(HBM)
Machine Model(MM)
Standard
Part Number
Results
AE617, AE618
Class1A
AE368
Class1B
AE379, AE514
Class1C
JESD22-A114F
JESD22-A115A
AE368, AE379
Class A
AE514, AE617, AE618
6. Moisture Sensitivity Level 1 Test
Standard
JESD020C
Test Condition
+85℃/85% 168hours
Sample Size
Results
38
Pass
Reflow Pack Temperature 260℃ 3Cycles
For product information and a complete list of distributors, please go to our web site: www.rfhic.com
RFHIC and its logo are trademarks of RFHIC Corporation in Korea and other countries.
Data subject to change. Copyright @ 2010 RFHIC Corporation. All rights reserved.
RHQD-1009-008