SHARP PC410L0NIP

PC410L0NIP
PC410L0NIP
High Speed Response, High
CMR OPIC Photocoupler
■ Features
■ Outline Dimensions
6
5
4
(Unit : mm)
1.27±0.25
internal connection
diagram
6
Anode mark
1
2.54±0.25
3
C0.4
(Input side)
(Ta=25°C)
Unit
mA
V
mW
V
V
mA
mW
kV
°C
°C
°C
2.6±0.2
3.6±0.3
+0.4
0.5−0.2
5.3±0.3
0.2±0.05
1
0.1±0.1
Input
Output
3
0.4
1. Programmable controllers
2. Inverters
Parameter
Symbol
Rating
*1 Forward current
IF
20
Reverse voltage
VR
5
Power dissipation
P
40
Supply voltage
VCC
7
High level output voltage VOH
7
Low level output current
IOL
50
*2 Collector power dissipation
PC
85
*3
3.75
Viso (rms)
Isolation voltage
−40 to +85
Operating temperature
Topr
−40 to +125
Storage temperature
Tstg
*4 Soldering temperature
Tsol
270
4
±0.1
■ Applications
■ Absolute Maximum Ratings
5
PC410L
4.4±0.2
1. High resistance to noise due to high common rejection
voltage (CMR:MIN. 10kV/µs)
2. High speed response (tpLH, tpHL:MAX.75ns)
3. Isolation voltage between input and output
(Viso (rms):3.75kV)
4. Mini-flat package
+0.2
7.0−0.7
6˚
1
Anode
4
3
Cathode
5
GND
VO (Open collector)
6
VCC
∗ “OPIC”(Optical IC) is a trademark of the SHARP Corporation.
An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip.
*1 Refer to Fig.4
*2 Refer to Fig.5
*3 40 to 60%RH, AC for 1minute
*4 For 10s
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/
PC410L0NIP
(Unless otherwise spesified, Ta=−40 to 85°C)
TYP. MAX.
MIN.
Unit
Conditions
1.6
−
V
Ta=25˚C, IF=10mA
1.9
−
−
µA
Ta=25˚C, VR=5V
10
−
60
Ta=25˚C, V=0, f=1MHz
pF
150
−
0.4
0.6
V
IOL=13mA, VCC=5.5V, IF=5mA
−
0.02
100
µA
VCC=VO=5.5V, IF=250µA
−
7
mA
13
VCC=5.5V, IF=10mA
VCC=5.5V, IF=0
−
mA
5
10
VCC=5V, VO=0.8V, RL=350Ω
2.5
mA
−
5
Ta=25˚C, DC=500V, 40 to 60%RH 5×1010 1×1011
Ω
−
−
0.6
−
pF
Ta=25˚C, V=0, f=1MHz
Response time
Output
Transfer characteristics
Parameter
Forward voltage
Reverse current
Terminal capacitance
Low level output voltage
High level output current
Low level supply current
High level supply current
"High→Low" threshold input current
Isolation resistance
Floating capacitance
"High→Low" propagation delay time
"Low→High" propagation delay time
Rise time
Fall time
*5
Pulse width distortion
Instantaneous common mode
rejection voltage
"Output : High level"
CMR
Input
■ Electro-optical Characteristics
Instantaneous common mode
rejection voltage
"Output : Low level"
Symbol
VF
IR
Ct
VOL
IOH
ICCL
ICCH
IFHL
RISO
Cf
tPHL
tPLH
tr
tf
∆tW
Ta=25˚C
VCC=5V, IF=7.5mA
RL=350Ω, CL=15pF
CMH
IF=0
VO (Min)=2V
CML
IF=5mA
VO (Max)=0.8V
Note) All typical values:at Ta=25°C , VCC=5V
*5 Pulse width distortion ∆ tW=tPHL−tPLH
■ Recommended Operating Conditions
Parameter
Low level input current
High level input current
Supply voltage
Fanout (TTL load)
Operating temperature
Symbol MIN.
IFL
0
IFH
8
VCC
4.5
N
−
Topr
−40
MAX.
250
15
5.5
5
+85
Unit
µA
mA
V
−
°C
Connect a by-pass ceramic capacitor (0.01 to 0.1µF) between VCC and GND at the
position within 1cm from lead pin
Fig.1 Block Diagram
Anode
1
Cathode
3
6
VCC
5
VO
4
GND
Ta=25˚C
VCC=5V
VCM=1kV(P-P)
RL=350Ω
25
25
−
−
−
48
50
10
20
−
75
75
−
−
35
ns
ns
ns
ns
ns
10
20
−
kV/µs
−10
−20
−
kV/µs
PC410L0NIP
Fig.2 Test Circuit for tPHL, tPLH, tr and tf
7.5mA
IF
IF
Pulse input
5V
6
1
3.75mA
0mA
350Ω
4
3
tPHL
VO
0.01µF
5
tPHL
5V
90%
CL
VO
1.5V
10%
VOL
47Ω
tf
tr
*CL includes the probe
and wiring capacitance.
Fig.3 Test Circuit for Common Mode Rejection Voltage
IF
GL SW
5V
6
1
1kV
5
A
B
3
4
+
VCM
0.01µF
350Ω
VCM
VO
0V
CL
VO
−
When the switch for
infrared light emitting
diode sets to A.
5V
(IF=0mA)
VO(MIN.)
When the switch for
infrared light emitting
diode sets to B.
VO(MAX.)
*CL includes the probe
and wiring capacitance.
Fig.4 Forward Current vs. Ambient
Temperature
VO
VOL
(IF=5mA)
Fig.5 Collector Power Dissipation vs.
Ambient Temperature
100
Collector power dissipation PC (mW)
Forward current IF (mA)
25
20
15
10
5
0
−40 −25
0
25
50
70 85 100
Ambient temperature Ta (°C)
125
85
80
60
40
20
0
−40 −25
0
25
50
70
85 100
Ambient temperature Ta (°C)
125
PC410L0NIP
Fig.6 Forward Current vs. Forward
Voltage
Fig.7 High Level Output Current vs.
Ambient Temperature
100
100
Ta=85˚C
Ta=−20˚C
Ta=−40˚C
1
0.1
1.00
1.20
1.40
1.60
1.80
High level output current IOH (µA)
Forward current IF (mA)
Ta=50˚C
10
IF=250µA
VCC=5.5V
VO=5.5V
Ta=0˚C
Ta=25˚C
10
1
0.1
0.01
0.001
−40 −25
2.00
0
Forward voltage VF (V)
Fig.8 Low Level Output Voltage vs.
Ambient Temperature
IO=16.0mA
IO=12.8mA
0.4
IO=9.6mA
0.2
4
3
2
RL=1kΩ
IO=6.4mA
1
RL=350Ω
RL=4kΩ
0
0
25
50
75
100
0
Ambient temperature Ta (˚C)
1
2
3
4
100
Propagation delay time tPHL, tPLH (ns)
VCC=5.0V
VO=0.8V
RL=350Ω
4.0
3.0
2.0
1.0
0
25
50
Ambient temperature Ta (˚C)
6
Fig.11 Propagation Delay Time vs.
Forward Current
6.0
5.0
5
Forward current IF (mA)
Fig.10 Threshold Input Current vs.
Ambient Temperature
0.0
−40 −25
100
VCC=5.0V
VO=0.8V
Ta=25˚C
5
0.6
0.0
−40 −25
75
6
IF=5.0mA
VCC=5.5V
Output voltage VO (V)
Low level output voltage VOL (V)
50
Fig.9 Output Voltage vs. Forward Current
0.8
Threshold input current IFHL (mA)
25
Ambient temperature Ta (˚C)
75
100
Ta=25˚C
VCC=5.0V
RL=350kΩ
80
60
tPLH
40
tPHL
20
0
5
10
15
Forward current IF (mA)
20
PC410L0NIP
Fig.12 Propagation Delay Time vs.
Ambient Temperature
Propagation delay time tPHL, tPLH (ns)
100
IF=7.5mA
VCC=5.0V
RL=350kΩ
80
60
tPLH
40
tPHL
20
0
−40 −25
0
25
50
Ambient temperature Ta (˚C)
75
100
NOTICE
●
The circuit application examples in this publication are provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes
no responsibility for any problems related to any intellectual property right of a third party resulting from the use of
SHARP's devices.
●
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP
reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents
described herein at any time without notice in order to improve design or reliability. Manufacturing locations are
also subject to change without notice.
●
Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage
caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used
specified in the relevant specification sheet nor meet the following conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
- - - Personal computers
- -- Office automation equipment
- -- Telecommunication equipment [terminal]
- - - Test and measurement equipment
- - - Industrial control
- -- Audio visual equipment
- -- Consumer electronics
(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when
SHARP devices are used for or in connection with equipment that requires higher reliability such as:
- -- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
- - - Traffic signals
- - - Gas leakage sensor breakers
- - - Alarm equipment
- -- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of
reliability and safety such as:
- - - Space applications
- -- Telecommunication equipment [trunk lines]
- -- Nuclear power control equipment
- -- Medical and other life support equipment (e.g., scuba).
●
If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
●
This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright
laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written
permission is also required before any use of this publication may be made by a third party.
●
Contact and consult with a SHARP representative if there are any questions about the contents of this publication.