RENESAS HD74LS95BFPEL

HD74LS95B
4-bit Parallel Access Shift Register
REJ03D0424-0400
Rev.4.00
May 10, 2006
The 4-bit register features parallel and serial inputs, parallel outputs, mode control, and two clock inputs. The register
has three mode operation:
• Parallel (broadside) load
• Shift right (the direction QA toward QD)
• Shift left (the direction QD toward QA)
Parallel loading is accomplished by applying the four bits of data and taking the mode control input high. The data is
loaded into the associated flip-flops and appears at the outputs after the high-to-low transition of the clock-2 input.
During loading, the entry of serial data is inhibited. Shift right is accomplished on the high-to-low transition of clock-1
when the mode control is low; shift left is accomplished on the high-to-low transition of clock-2 when the mode control
is high by connecting the output of each flip-flop to the parallel input of the previous flip-flop (QD to input C, etc.) and
serial data is entered at input D. The clock input may be applied commonly to clock-1 and clock-2 if both modes can be
clocked from the same source. Changes at the mode control inputs are low; however, conditions described in the last
three lines of the function table will also ensure that register contents are protected.
Features
• Ordering Information
Part Name
Package Type
Package Code
(Previous Code)
Package
Abbreviation
Taping Abbreviation
(Quantity)
HD74LS95BFPEL
SOP-14 pin (JEITA)
PRSP0014DF-B
(FP-14DAV)
FP
EL (2,000 pcs/reel)
Pin Arrangement
Serial Input
1
14
VCC
13
QA
A
2
Serial Input
A
QA
B
3
B
QB
12
QB
C
4
C
QC
11
QC
D
5
D
QD
10
QD
Mode Control
6
Mode
CK1
9
GND
7
CK2
8
Clock1
R-Shift
Clock2
L-Shift (Load)
Inputs
(Top view)
Rev.4.00, May 10, 2006, page 1 of 6
Outputs
HD74LS95B
Function Table
Inputs
Clocks
Mode
control
2(L)
H
↓
↓
L
X
X
L
L
L
H
H
H
H
H
L
L
L
↑
↓
↓
↑
↑
1(R)
X
X
X
H
↓
↓
L
L
H
L
H
Serial
X
X
X
X
H
L
X
X
X
X
X
Outputs
Parallel
A
X
a
QB*
X
X
X
X
X
X
X
X
B
X
b
QC*
X
X
X
X
X
X
X
X
C
X
c
QD*
X
X
X
X
X
X
X
X
D
X
d
d
X
X
X
X
X
X
X
X
QA
QB
QC
QD
QAO
a
QBn
QAO
H
L
QAO
QAO
QAO
QAO
QAO
QBO
b
QCn
QBO
QAn
QAn
QBO
QBO
QBO
QBO
QBO
QCO
c
QDn
QCO
QBn
QBn
QCO
QCO
QCO
QCO
QCO
QDO
d
d
QDO
QCn
QCn
QDO
QDO
QDO
QDO
QDO
Notes: 1.
2.
3.
4.
5.
H; high level, L; low level, X; irrelevant
↑; transition from low to high level
↓; transition from high to low level
a to d; the level of steady-state input at inputs A, B, C, or D, respectively.
QAO to QDO; the level of QA, QB, QC, or QD, respectively, before the indicated steady-state input conditions
were established.
6. QAn to QDn; the level of QA, QB, QC, or QD, respectively, before the most-recent (↑) transition of the clock.
7. *; Shifting left require external connection of QB to A, QC to B, and QD to C. Serial data is entered at input D.
Block Diagram
Data Inputs
A
B
C
D
Mode
Control
Serial
Input
Clock1
Right -shift
Clock2
Left-shift
R
R
CK
CK
S QA
S QB
QA
R
CK
CK
S QC
QB
S QD
QC
Outputs
Rev.4.00, May 10, 2006, page 2 of 6
R
QD
HD74LS95B
Absolute Maximum Ratings
Item
Symbol
VCC
VIN
PT
Tstg
Supply voltage
Input voltage
Power dissipation
Storage temperature
Ratings
7
7
400
–65 to +150
Unit
V
V
mW
°C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item
Symbol
VCC
IOH
IOL
Topr
fclock
tw (CK)
tsu
th
tenable 1
tenable 2
tinhibit 1
tinhibit 2
Supply voltage
Output current
Operating temperature
Clock frequency
Clock pulse width
Setup time
Hold time
Enable time 1
Enable time 2
Inhibit time 1
Inhibit time 2
Min
4.75
—
—
–20
0
20
20
10
20
20
20
20
Typ
5.00
—
—
25
—
—
—
—
—
—
—
—
Max
5.25
–400
8
75
25
—
—
—
—
—
—
—
Unit
V
µA
mA
°C
MHz
ns
ns
ns
ns
ns
ns
ns
Electrical Characteristics
(Ta = –20 to +75 °C)
Item
Input voltage
Symbol
VIH
VIL
min.
2.0
—
typ.*
—
—
max.
—
0.8
Unit
V
V
VOH
2.7
—
—
V
II
—
—
—
—
—
—
—
—
—
—
0.4
0.5
20
–0.4
0.1
µA
mA
mA
VCC = 5.25 V, VI = 2.7 V
VCC = 5.25 V, VI = 0.4 V
VCC = 5.25 V, VI = 7 V
IOS
–20
—
–100
mA
VCC = 5.25 V
ICC
—
13
21
mA
VCC = 5.25 V
VIK
—
—
–1.5
V
Output voltage
VOL
Input current
Short-circuit output
current
Supply current**
Input clamp voltage
IIH
IIL
V
Condition
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V,
IOH = –400 µA
IOL = 4 mA
VCC = 4.75 V, VIH = 2 V,
VIL = 0.8 V
IOL = 8 mA
VCC = 4.75 V, IIN = –18 mA
Notes: * VCC = 5 V, Ta = 25°C
** ICC is measured with all outputs and serial input open; A, B, C, and D inputs grounded; mode control at 4.5 V;
and momentary 3 V, then ground, applied both clock inputs.
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item
Maximum clock frequency
Propagation delay time
Symbol
fmax
tPLH
tPHL
Rev.4.00, May 10, 2006, page 3 of 6
min.
25
—
—
typ.
36
18
21
max.
—
27
32
Unit
MHz
ns
ns
Condition
CL = 15 pF, RL = 2 kΩ
HD74LS95B
Clock Enable / Inhibit Times
VIH
Serial
Input
VIL
VIH
Mode
Control
Input
1.3V
1.3V
VIL
t enable 1
t inhibit 1
VIH
1.3V
Clock1
Input
1.3V
VIL
t inhibit 2
t enable 2
VIH
Clock2
Input
1.3V
1.3V
VIL
VOH
QA Output
VOL
Testing Method
Test Circuit
VCC
Output
4.5V
RL
Load circuit 1
QA
Input
Input
P.G.
Zout = 50Ω
See Testing Table
Mode Control
P.G.
Zout = 50Ω
CK1
CK2
A
B
Same as Load Circuit 1.
Same as Load Circuit 1.
Output
QD
GND
Rev.4.00, May 10, 2006, page 4 of 6
QB
QC
C
1. CL includes probe and jig capacitance.
2. All diodes are 1S2074(H).
Output
Output
D
Notes:
CL
Serial Input
Same as Load Circuit 1.
HD74LS95B
Testing Table
Item
fmax
tPLH
tPHL
Inputs
From
input to
output
CK-1
CK-2
CK-1 → Q
CK-2 → Q
CK-1 → Q
CK-2 → Q
IN
4.5 V
IN
4.5 V
4.5 V
IN
4.5 V
IN
Mode
control
0V
4.5 V
0V
4.5 V
Serial
Inputs
IN
4.5 V
IN
4.5 V
Outputs
A
B
C
D
QA
QB
QC
QD
4.5 V
IN
4.5 V
IN
4.5 V
IN
4.5 V
IN
4.5 V
IN
4.5 V
IN
4.5 V
IN
4.5 V
IN
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
Waveform
tTLH
Data
Input
tTHL
90%
10%
tw (data)
3V
90%
1.3V
1.3V
1.3V
10%
tsu
0V
th
tsu
th
3V
Clock1 or 2
Input
1.3V
1.3V
1.3V
tw (ck)
0V
VOH
Outputs
QA, QB, QC or QD
1.3V
tPHL
Note:
1.3V
tPLH
Input pulse; tTLH, tTHL ≤ 10 ns, Data PRR = 500 kHz, Clock PRR = 1 MHz,
Rev.4.00, May 10, 2006, page 5 of 6
VOL
HD74LS95B
Package Dimensions
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
*1
Previous Code
FP-14DAV
MASS[Typ.]
0.23g
D
F
14
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
8
c
HE
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
7
e
*3
bp
x
Reference Dimension in Millimeters
Symbol
M
A
L1
A1
θ
y
L
Detail F
Rev.4.00, May 10, 2006, page 6 of 6
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Min Nom Max
10.06 10.5
5.50
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
7.50 7.80 8.00
1.27
0.12
0.15
1.42
0.50 0.70 0.90
1.15
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0