To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. “Standard”: 8. 9. 10. 11. 12. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET MOS INTEGRATED CIRCUIT μ PD166005 SINGLE N-CHANNEL HIGH SIDE INTELLIGENT POWER DEVICE DESCRIPTION The μ PD166005 is N-channel high side driver with charge pump, diagnostic function, embedded protection functions. When the device is over temperature or over current is generated in output MOS, the protection function operates while the built-in diagnosis output signal is output. In addition, the built-in diagnosis signal is output when open status of the output pin is detected. FEATURES • High temperature operation (Tch = 175°C MAX.) • Built-in charge pump circuit • Low on-state resistance • Built-in protection circuit RDS(on) = 100 mΩ MAX. (VIN = VIH, IO = 1.5 A, Tch = 25°C) - Current limitation - Over temperature protection • Built-in open load detection circuit • Built-in diagnosis output circuit • Package: Power SOP 8 ORDERING INFORMATION Part Number Note μ PD166005GR-E1-AZ Note μ PD166005GR-E2-AZ Lead plating Packing Package Sn-Bi Tape 2500 p/reel Power SOP 8 Sn-Bi Tape 2500 p/reel Power SOP 8 Note Pb-free (This product does not contain Pb in the external electrode.) QUALITY GRADE Part Number Quality Grade Note μ PD166005GR-E1-AZ Note μ PD166005GR-E2-AZ Special Special Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. APPLICATION • Switching of types of 14 V loads such as L load, resistance and capacity. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. S19284EJ1V0DS00 (1st edition) Date Published July 2008 NS Printed in Japan 2008 μ PD166005 BLOCK DIAGRAM 5V Vbat ICC 5, 6, 7, 8 VCC IDIAG Charge Pump Internal Power Supply Current Detector 2 Diagnosis DIAG (Nch open drain) 1 IN Control Logic RDIAG Power Supply Voltage Sense ROPEN VO 4 OUT Output Voltage Sense IOHL IO IIN VDIAG Temperature Sensor Load VOUT VIN GND 3 PIN CONFIGURATION • Power SOP 8 Top View IN 1 8 VCC DIAG 2 7 VCC GND 3 6 VCC OUT 4 5 VCC PIN FUNCTIONS Pin No. 2 Pin Name Function 1 IN Input pin 2 DIAG DIAG output pin 3 GND Ground pin 4 OUT High side output pin 5 VCC Power supply pin 6 VCC Power supply pin 7 VCC Power supply pin 8 VCC Power supply pin Data Sheet S19284EJ1V0DS VCC μ PD166005 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Power supply voltage Condition VCC1 VCC2 RS = 1 Ω, τ = 250 ms Rating Unit −0.3 to +35 V 60 V V mA Input voltage VIN −0.5 to +7.0 Input current IIN ±10 Output current IOA 2 A Output negative voltage VOA VCC − 60 V Power dissipation PD 1.0 W Operation temperature Topt −40 to +125 °C Storage temperature Tstg −55 to +175 °C DIAG output voltage VDIAG 7.0 V DIAG output current IDIAG 10 mA TA = 25°C Note Note When mounted on a glass substrate epoxy (where FR-4 is 10 cm x 10 cm, dimension of copper foil is 15% and thickness of copper foil is 35 μm) Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameters. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and conditions indicated for DC characteristics and AC characteristics represent the quality assurance range during normal operation. RECOMMENDED OPERATIONG CONDITIONS (TA = −40°C to +125°C, unless otherwise specified) Parameter Power supply voltage Symbol VCC Conditions VIH = 3 V, VO = VCC − 0.4 V (RL = 9.3 Ω), MIN. 4.5 TYP. MAX. Unit 16 V VIL = 1 V, VO = 0.2 V (RL = 9.3 Ω), VDIAG = 0.5 V (IDIAG = 0.6 mA) Input voltage VIH VCC = 4.5 to 16 V VIL VCC = 8 to 16 V 3 7.0 V 0 1.0 V 0 1.5 A Output current IOA DIAG output voltage VDIAG 0 7.0 V DIAG output current IDIAG 0 0.6 mA Data Sheet S19284EJ1V0DS 3 μ PD166005 ELECTRICAL SPECIFICATIONS (VCC = 8 to 16 V, Tch = −40 to +175°C, unless otherwise specified) Parameter Symbol Input voltage VIH Conditions MIN. VCC = 4.5 to 16 V VIL Input current Standby current Note1 Output leakage current V 1.0 V 400 μA 4 mA VIN = 5.5 V 30 −10 ICCH VIN = VIH μA ICCL VIN = VIL 0.2 mA IOH1 VIN = VIL, VO = VCC 2000 μA IOH2 VIN = VIL, VO = 4 V 400 μA μA −240 VIN = VIL, VO = 0 V VCC = 4.5 to 16 V, IDIAG = 0.6 mA DIAG output leakage current IDIAG VDIAG = 7.0 V Open load detection VOIH VIN = 0 V, VDIAG changing point (L→H) Load connection detection VOIL VIN = 0 V, VDIAG changing point (H→L) Drain to source on-state RDS(on) VIN = VIH, IO = 1.5 A resistance Over temperature detection 7.0 VIN = 0 V IOL 0.5 V 10 μA 1.45 V 4 V Tch = 25°C 80 100 mΩ Tch = 150°C 150 180 mΩ (10) A IS Note2 Unit 0 IIL VDIAG Note2 MAX. 3 IIH DIAG output low level voltage Over current detection TYP. 2 Tth °C (175) 5 50 μs 50 200 μs 30 200 μs 20 200 μs 200 μs RL = 9.3 Ω, VCC = 14 V Turn on delay time tD(ON) Turn off delay time tD(OFF) Rise time tON Fall time tOFF DIAG output delay time tDpd RL = 13 Ω, VCC = 14 V Negative output voltage −VO IO = −60 mA VCC − 50 V Output oscillation cycle at over tS Over current 14 ms 30 % current condition Output on duty at over current DS condition Notes 1. OUT current and DIAG current are not included. 2. ( ) is a reference value. TRUTH TABLE MEASUREMENT CONDITION 50% Input voltage Parameter 50% Normal operation Over temperature detection tD(OFF) tD(ON) 90% 90% tOFF H H H L L L H L L L L H Chopping L L L L Open load detection H H H L H H 90% tDpd DIAG output voltage 4 VDIAG L 10% tON VOUT Over current detection Output voltage 10% VIN Data Sheet S19284EJ1V0DS μ PD166005 OUTLINE OF FUNCTIONS Pre-Driver (Charge Pump Circuit) ON/OFF Control When the input voltage of the input pin (IN) is high level (3.0 V or more), the output MOS (Nch) turns on. When the output voltage of the input pin (IN) is low level (1.0 V or less), the output MOS (Nch) turns off. Charge pump circuit is built-in to drive the output MOS (Nch) that is connected to the high side. Over Current Detection Circuit This circuit detects over current to output pin (OUT) caused by short circuit etc., and feeds back detection signal to control circuit. When the over current is detected, the current limitation circuit and the control circuit start operation. The output current is restricted and chopping operation begins. The DIAG output is low level at this time. Over temperature Detection Circuit This circuit detects over temperature by output MOS (Nch) driving, and feeds back detection signal to control circuit. When the circuit detects over temperature, the protection function of the control circuit operates and output is shutdown. Output MOS (Nch) automatically restarts when channel temperature cools down after shutdown. “H” 5V VIN “L” “L” GND VCC VOUT THIH THIL Tch Open Load Detection Circuit This circuit detects connection/open load of output pin (OUT) when OFF (VIN = VIL). When using the open load detection function, pull-up the output pin (OUT) to VCC. (Recommended value: 5.1 kΩ±10%) Open load is detected by inputting low level input voltage (1.0 V or less) to input pin (IN). DAIG pin outputs Hi-Z (pull-up: high level) when the output pin is open. 5V VIN “L” “H” “L” VOUT OFF ON OFF OFF VDIAG ON OFF ON OFF GND VCC 5 V (Pull-up) ON GND Open load condition Remark The pull-up resistance does not affect other circuits and electronic characteristics. Diagnostic Output Circuit This circuit controls output of diagnosis signal form DIAG pin when Over current or Over temperature or Open load is detected. Data Sheet S19284EJ1V0DS 5 μ PD166005 TIMING CHART Over temperature release Over temperature detection VIN Over current detection Over current release VOUT VDIAG Normal operation Over temperature detection Normal operation Over current detection Normal operation EXAMPLE OF APPLICATION CIRCUIT Vbat 5V Micro. 1) μ PD166005 R 2) VCC INPUT PORT DIAG R 5.1 kΩ R OUTPUT PORT IN OUT 3) GND GND Load Cautions 1. DIAG pin is Nch open drain structure. When using diagnostic function, pull-up DIAG pin to 5 V. (power supply lines such as Microcomputer) 2. When using Open load detection function, Pull-up OUT pin to VCC. (Recommended value: 5.1 kΩ±10%) (The pull-up resistance does not affect other circuits and electronic characteristics.) 3. If output load voltage exceeds VCC − 50 V when L load is driven, it is necessary to protect this product with an external rectifying diode or zener diode. 4. This circuit diagram is shown as an example of connection, and is not intended for mass production design. 6 Data Sheet S19284EJ1V0DS μ PD166005 INPUT VOLTAGE vs. POWER SUPPLY VOLTAGE INPUT VOLTAGE vs. AMBIENT TEMPERATURE 3 3 2.5 VIH 2 VIL 2.5 VIH/VIL - Input Voltage - V VIH/VIL - Input Voltage - V TYPICAL CHARACTERISTICS 1.5 1 0.5 VIH 2 VIL 1.5 1 0.5 0 0 0 5 10 15 20 -50 VCC - Power Supply Voltage - V 100 150 200 LOW LEVEL INPUT CURRENT vs. AMBIENT TEMPERATURE 10 IIL - Low Level Input Current - μA 400 IIH - High Level Input Current - μA 50 TA - Ambient Temperature - °C HIGH LEVEL INPUT CURRENT vs. AMBIENT TEMPERATURE 300 200 100 0 6 2 -2 -6 -10 -50 0 50 100 150 200 -50 0 50 100 150 TA - Ambient Temperature - °C TA - Ambient Temperature - °C STUNDBY CURRENT vs. AMBIENT TEMPERATURE OUTPUT LEAKAGE CURRENT vs. AMBIENT TEMPERATURE 200 200 IOH - Output Leakage Current - μA 1 ICCH /ICCL - Standby Current - mA 0 0.8 0.6 ICCH 0.4 0.2 ICCL 160 120 0 IOH2 80 40 IOH1 0 -50 0 50 100 150 200 TA - Ambient Temperature - °C -50 0 50 100 150 200 TA - Ambient Temperature - °C Data Sheet S19284EJ1V0DS 7 μ PD166005 OUTPUT LEAKAGE CURRENT vs. AMBIENT TEMPERATURE IOL - Output Leakage Current - μA 0 -20 -40 -60 -80 -100 -50 0 50 100 150 200 TA - Ambient Temperature - °C 0.4 0.3 0.2 0.1 0 0 5 10 15 20 VDIAG - DIAG Output Low Level Voltage - V 0.5 DIAG OUTPUT LOW LEVEL VOLTAGE vs. AMBIENT TEMPERATURE 0.4 0.3 0.2 0.1 0 -50 0 50 100 150 200 TA - Ambient Temperature - °C OPEN LOAD/LOAD CONNECTION DETECTION VOLTAGE vs. POWER SUPPLY VOLTAGE OPEN LOAD / LOAD CONNECTION DETECTION VOLTAGE vs. AMBIENT TEMPERATURE 4 4 3.5 3 VOIH 2.5 VOIL 2 1.5 1 0.5 0 0 5 10 15 20 VCC - Power Supply Voltage - V 8 0.5 VCC - Power Supply Voltage - V VOIH/VOIL - Open Load/Load Connection Detection Voltage - V VOIH/VOIL - Open Load/Load Connection Detection Voltage - V VDIAG - DIAG Output Low Level Voltage - V DIAG OUTPUT LOW LEVEL VOLTAGE vs. POWER SUPPLY VOLTAGE 3.5 3 VOIH 2.5 VOIL 2 1.5 1 0.5 0 -50 0 50 100 150 TA - Ambient Temperature - °C Data Sheet S19284EJ1V0DS 200 μ PD166005 200 160 120 80 40 0 0 5 10 15 20 DRAIN TO SOURCE ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE RDS(on) - Drain to Source On-state Resistance - mΩ RDS(on) - Drain to Source On-state Resistance - mΩ DRAIN TO SOURCE ON-STATE RESISTANCE vs. POWER SUPPLY VOLTAGE 200 160 120 80 40 0 -50 100 150 OVER CURRENT DETECTION vs. POWER SUPPLY VOLTAGE OVER CURRENT DETECTION vs. AMBIENT TEMPERATURE 200 8 IS - Over Current Detection - A IS - Over Current Detection - A 50 TA - Ambient Temperature - °C 8 6 4 2 6 4 2 0 0 0 5 10 15 20 -50 VCC - Power Supply Voltage - V 0 50 100 150 200 TA - Ambient Temperature - °C OUTPUT OSCILLATION CYCLE AT OVER CURRENT CONDITION vs. AMBIENT TEMPERATURE OUTPUT OSCILLATION CYCLE AT OVER CURRENT CONDITION vs. POWER SUPPLY VOLTAGE 7 tS - Output Oscillation Cycle at Over Current Condition - ms 7 tS - Output Oscillation Cycle at Over Current Condition - ms 0 VCC - Power Supply Voltage - V 6 5 4 3 2 1 0 6 5 4 3 2 1 0 0 5 10 15 20 VCC - Power Supply Voltage - V -50 0 50 100 150 200 TA - Ambient Temperature - °C Data Sheet S19284EJ1V0DS 9 μ PD166005 OUTPUT ON DUTY AT OVER CURRENT CONDITION vs. POWER SUPPLY VOLTAGE OUTPUT ON DUTY AT OVER CURRENT CONDITION vs. AMBIENT TEMPERATURE 16 DS - Output On Duty at Over Current Detection - % DS - Output On Duty at Over Current Detection - % 16 14 12 10 8 6 4 2 14 12 10 8 6 4 2 0 0 0 5 10 15 20 -50 VCC - Power Supply Voltage - V 150 200 160 tD(OFF) - Turn Off Delay Time - μs tD(ON) - Turn On Delay Time - μs 100 TURN OFF DELAY TIME vs. AMBIENT TEMPERATURE 20 16 12 8 4 140 120 100 80 60 40 20 0 0 -50 0 50 100 150 -50 200 0 50 100 150 200 TA - Ambient Temperature - °C TA - Ambient Temperature - °C RISE TIME vs. AMBIENT TEMPERATURE FALL TIME vs. AMBIENT TEMPERATURE 100 100 80 80 tOFF - Fall Time - μs tON - Rise Time - μs 50 TA - Ambient Temperature - °C TURN ON DELAY TIME vs. AMBIENT TEMPERATURE 60 40 60 40 20 20 0 0 -50 0 50 100 150 200 -50 0 50 100 150 TA - Ambient Temperature - °C TA - Ambient Temperature - °C 10 0 Data Sheet S19284EJ1V0DS 200 μ PD166005 DIAG OUTPUT DELAY TIME vs. AMBIENT TEMPERATURE NEGATIVE OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 0 −VO - Negative Output Voltage - V tDpd - DIAG Output Delay Time - μs 160 140 120 100 80 60 40 20 0 -10 -20 -30 -40 -50 -60 -70 -80 -50 0 50 100 150 200 -50 TA - Ambient Temperature - °C 0 50 100 150 200 TA - Ambient Temperature - °C TRANSIENT THERMAL RESISTANCE CHARACTERISTICS TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH rth(ch-A) - Transient Thermal Resistance - °C/W 1000 Rth(ch-A) = 125°C/Wi 100 Rth(ch-C) = 30°C/Wi 10 1 0.1 When mounted on a glass substrate epoxy (where FR-4 is 10 cm x 10 cm, dimension of copper foil is 15% and thickness of copper foil is 35 μm) 1m 10 m 100 m 1 10 100 1000 PW - Pulse Width - s Data Sheet S19284EJ1V0DS 11 μ PD166005 5 1 4 6.0 ±0.3 4.4 5.37 MAX. 0.8 0.15 +0.10 –0.05 1.44 8 0.05 MIN. 1.8 MAX. PACKAGE DRAWING 0.5 ±0.2 0.10 1.27 0.78 MAX. 0.40 +0.10 –0.05 0.12 M TAPE INFORMATION There are two types (-E1, -E2) of taping depending on the direction of the device. Reel side Draw-out side −E1 TYPE −E2 TYPE MARKING INFORMATION This figure indicates the marking items and arrangement. However, details of the letterform, the size and the position aren't indicated. 6005 Pb-free plating marking Internal administrative code 1 pin mark 12 Lot code Data Sheet S19284EJ1V0DS μ PD166005 RECOMMENDED SOLDERING CONDITIONS The μ PD166005 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) • μ PD166005GR-E1-AZ • μ PD166005GR-E2-AZ Note : Power SOP 8 Note : Power SOP 8 Process Infrared reflow Conditions Maximum temperature (package’s surface temperature): 260°C or below, Symbol IR60-00-3 Time at maximum temperature: 10 seconds or less, Time at temperature higher than 220°C: 60 seconds or less, Preheating time at 160°C to 180°C: 60 to 120 seconds, Times: Three times, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Partial Heating Method Pin temperature: 300°C or below, − Heat time: 3 seconds or less (Per each side of the device), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Note Pb-free (This product does not contain Pb in the external electrode.) Data Sheet S19284EJ1V0DS 13 μ PD166005 NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. 14 Data Sheet S19284EJ1V0DS μ PD166005 • The information in this document is current as of July, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1