To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. “Standard”: 8. 9. 10. 11. 12. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET MOS INTEGRATED CIRCUIT µP D 4 7 2 1 RS-232 LINE DRIVER/RECEIVER AT 3.3 V/5 V The µPD4721 is a high-breakdown voltage silicon gate CMOS line driver/receiver based on the EIA/TIA-232E standard. The internal DC/DC converter can switch between multiple voltages, realizing the allowing it to operate with a single +3.3 V or +5 V power supply. It also provides standby function. This IC incorporates 2 driver circuits and 2 receiver circuits. An RS-232 interface circuit can be easily configured by connecting 5 capacitors externally. FEATURES • Conforms to EIA/TIA-232-E (former name, RS-232C) standards • Selectable +3.3 V/+5 V single power supply (selected by VCHA pin) • By setting the standby pin to a low level (standby mode), circuit current can be reduced. At such times, the driver output is in a high-impedance state. ORDERING INFORMATION Part number µPD4721GS-GJG Document No. S12198EJ2V0DS00 (2nd edition) (Previous No. IC-3279) Date Published January 1997 N Printed in Japan Package 20-pin plastic SSOP (300 mil) © 1993 µ PD4721 BLOCK DIAGRAM/PIN CONFIGURATION (Top View) +10 V C3 1 + C4 2 +3.3 V or +5 V C1 C4+ 20 VDD + C1+ GND 19 + C2 + 3 VCC C4– 18 4 C1– VSS 17 5 C5+ 6 C5– –10 V 16 STBY C5 + 15 VCHA Note 4 300 Ω DIN1 7 DIN2 8 13 DOUT2 ROUT1 9 12 RIN1 14 DOUT1 300 Ω 5.5 kΩ ROUT2 10 11 RIN2 5.5 kΩ Note 1. V DD and V SS are output pins stepped up internally. These pins should not be loaded directly. 2. Capacitors C 1 to C 5 with a breakdown voltage of 20 V or higher are recommended. And it is recommended to insert the capacitor that is 0.1 µF to 1 µF between V CC and GND. 3. If V CHA is kept low level (in 5 V mode), capacitor C5 is not necessary. 4. The pull-up resistors at driver input are active resistors. 2 µ PD4721 Truth Table Driver STBY D IN DOUT Remarks L × Z Standby mode (DC/DC converter is stopped) H L H Space level output H H L Mark level output STBY R IN ROUT L × H Standby mode (DC/DC converter is stopped) H L H Mark level input H H L Space level input Receiver 3 V ↔ 5 V switching V CHA Remarks Note 5 Operating mode L 5 V mode (double step-up) H 3 V mode (3 times step-up) H: high-level, L: low-level, Z: high-impedance, ×: H or L Note 5. When switching VCHA, standby mode must be selected (STBY = L). 3 µ PD4721 ABSOLUTE MAXIMUM RATINGS (T A = 25 °C) Parameter Symbol Ratings Unit Supply Voltage (V CHA = L) V CC –0.5 to +7.0 V Supply Voltage (V CHA = H) V CC –0.5 to +4.5 V Driver Input Voltage D IN –0.5 to V CC +0.5 V Receiver Input Voltage R IN –30.0 to +30.0 V Control Input Voltage (STBY, V CHA) V IN –0.5 to V CC +0.5 V –25.0 to +25.0 Note 6 Driver Output Voltage D OUT V Receiver Output Voltage R OUT –0.5 to V CC +0.5 V Input Current (D IN , STBY, V CHA) I IN ±20.0 mA Operating Ambient Temperature TA –40 to +85 °C Storage Temperature T stg –55 to +150 °C Total Power Dissipation PT 0.5 W Note 6. Pulse width = 1 ms, duty = 10 % MAX. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (V CHA = L, 5 V mode) V CC 4.5 5.0 5.5 V Supply Voltage (V CHA = H, 3 V mode) V CC 3.0 3.3 3.6 V High-Level Input Voltage (D IN ) V IH 2.0 V CC V Low-Level Input Voltage (D IN) V IL 0 0.8 V High-Level Input Voltage (STBY, V CHA ) V IH 2.4 V CC V Low-Level Input Voltage (STBY, V CHA ) V IL 0 0.6 V Receiver Input Voltage R IN –30 +30 V Operating Ambient Temperature TA –40 +85 °C Note 7 0.33 4.7 µF Capacitance of External Capacitor Note 7. In low temperature (below 0 ˚C), the capacitance of electrolytic capacitor becomes lower. Therefore, set higher values when using in low temperature. Concerning the wiring length between the capacitor and the IC, the shorter the better. Capacitors with good frequency characteristics such as tantalum capacitors, laminated ceramic capacitors, and aluminum electrolytic capacitors for switching power supply are recommended for the external capacitors. 4 µ PD4721 ELECTRICAL SPECIFICATIONS (TOTAL) (Unless otherwise specified, T A = –40 to +85 °C, C 1 to C5 = 1 µF) Parameter Symbol Circuit Current I CC1 Circuit Current I CC2 Circuit Current at Standby I CC3 Conditions MIN. TYP. MAX. Unit V CC = +3.3 V, No load, R IN pin OPEN, STBY = H 6.5 13 mA V CC = +5.0 V, No load, R IN pin OPEN, STBY = H 4.5 9 mA V CC = +3.3 V, R L = 3 kΩ (DOUT ), D IN = GND, R IN , R OUT pin OPEN, STBY = H 19 24 mA V CC = +5.0 V,R L = 3 kΩ (DOUT ), D IN = GND, R IN , R OUT pin OPEN, STBY = H 14 18 mA V CC = +3.3 V, No load, D IN and R IN pins are OPEN, STBY = L, T A = 25 °C 1 3 µA V CC = +3.3 V, No load, D IN and R IN pins are OPEN, STBY = L 5 V CC = +5.0 V, No load, D IN and R IN pins are OPEN, STBY = L, T A = 25 °C 2 V CC = +5.0 V, No load, D IN and R IN pins are OPEN, STBY = L 10 High-Level Input Voltage V IH V CC = +3.0 to +5.5 V, STBY, V CHA pin Low-Level Input Voltage V IL V CC = +3.0 to +5.5 V, STBY, V CHA pin High-Level Input Current I IH V CC = +5.5 V, V I = +5.5 V, STBY, V CHA pin Low-Level Input Current I IL Input Capacitance C IN STBY — V CHA Time V CHA — STBY Time STBY — V CC Time V CC — STBY Time µA 5 µA µA 2.4 V 0.6 V 1 µA V CC = +5.5 V, V I = 0 V, STBY, V CHA pin –1 µA Driver input and receiver input V CC = +3.3 V, for GND, f = 1 MHz 10 pF Driver input and receiver input V CC = +5.0 V, for GND, f = 1 MHz 10 pF t SCH V CC = +3.0 to +5.5 V, STBY ↓ → V CHA, Note 8 1 µs t CHS V CC = +3.0 to +5.5 V, V CHA → STBY ↑, Note 8 1 µs t SC V CC = +3.0 to +5.5 V, STBY ↓ → 1 µs t CS V CC = +3.0 to +5.5 V, V CC → STBY ↑, 1 µs V CC , Note 8 Note 8 * The TYP. values are for reference at T A = 25 °C. Note 8. Measuring point 5V 3.3 V STBY 0.6 V 0.6 V 0.6 V 0.6 V 0V tSCH tCHS tSCH tCHS 3.3 V 2.4 V VCHA 2.4 V 0.6 V 0V tSC 0.6 V tCS tSC tCS 5V 4.5 V VCC 3.6 V 4.5 V 3.6 V 3.3 V 5 µ PD4721 ELECTRICAL SPECIFICATIONS (DRIVER) (Unless otherwise specified, T A = –40 to +85 °C, C 1 to C5 = 1 µF) 3 V mode (unless otherwise specified, V CHA = H, V CC = 3.0 to 3.6 V) Parameter Symbol Conditions MIN. MAX. Unit 0.8 V Low-Level Input Voltage V IL High-Level Input Voltage V IH Low-Level Input Current I IL V CC = +3.6 V, V I = 0 V –25 µA High-Level Input Current I IH V CC = +3.6 V, V I = 3.6 V 1.0 µA 2.0 V CC = +3.3 V, R L = ∞, TA = 25 °C Output Voltage V DO Output Short-Circuit Current Slew-Rate Note 9 I SC V CC = +3.3 V, R L = 3 kΩ, TA = T opt ±5.0 V CC = +3.0 V, R L = 3 kΩ, TA = +25 °C ±5.0 V ±9.5 V ±6.0 V V V CC = +3.3 V, for GND ±40 mA C L = 10 pF, R L = 3 to 7 kΩ 3.0 30 V/ µ s C L = 2 500 pF, RL = 3 to 7 kΩ 3.0 30 V/ µ s SR t PHL t PLH R L = 3 kΩ, C L = 2 500 pF Output Resistor RO V CC = V DD = V SS = 0 V V OUT = ±2 V Standby Output Transfer Time t DAZ R L = 3 kΩ, C L = 2 500 pF, Note 10 4 10 µs Standby Output Transfer Time t DZA R L = 3 kΩ, C L = 2 500 pF, Note 10 1 3 ms Power-On Output Transfer Time t PRA R L = 3 kΩ, C L = 2 500 pF, Note 11 1 3 ms Propagation Delay Time Note 9 * The TYP. values are for reference at T A = 25 °C. 6 TYP. µs 2.5 Ω 300 µ PD4721 5 V mode (Unless otherwise specified, V CHA = L, V CC = +5.0 V ± 10 %) Parameter Symbol Conditions MIN. TYP. MAX. Unit 0.8 V Low-Level Input Voltage V IL High-Level Input Voltage V IH Low-Level Input Current I IL V CC = +5.5 V, V I = 0 V –40 µA High-Level Input Current I IH V CC = +5.5 V, V I = 5.5 V 1.0 µA 2.0 V V CC = +5.0 V, R L = ∞, TA = 25 °C Output Voltage V DO Output Short-Circuit Current Slew-Rate Note 9 I SC ±9.7 V CC = +5.0 V, R L = 3 kΩ, TA = T opt ±6.0 V V CC = +4.5 V, R L = 3 kΩ, TA = T opt ±5.0 V V CC = +5.0 V, for GND SR V ±40 mA C L = 10 pF, R L = 3 to 7 kΩ 4.0 30 V/ µ s C L = 2 500 pF, RL = 3 to 7 kΩ 4.0 30 V/ µ s t PHL t PLH R L = 3 kΩ, C L = 2 500 pF Output Resistor RO V CC = V DD = V SS = 0 V V OUT = ±2 V Standby Output Transfer Time t DAZ R L = 3 kΩ, C L = 2 500 pF, Note 10 4 10 µs Standby Output Transfer Time t DZA R L = 3 kΩ, C L = 2 500 pF, Note 10 0.5 1 ms Power-On Output Transfer Time t PRA R L = 3 kΩ, C L = 2 500 pF, Note 12 0.5 1 ms Propagation Delay Time Note 9 µs 2 Ω 300 * The TYP. values are for reference at T A = 25 °C. Note 9. Measuring point VCC 2.0 V DIN 0.8 V 0V tPLH VDO+ DOUT tPHL +5 V +3 V –3 V +3 V –3 V –5 V VDO– SR+ SR– 7 µ PD4721 Note 10. Measuring point VCC 2.4 V STBY 0.6 V 0V tDAZ tDZA VDO+ +5 V DOUT High-impedance –5 V VDO– Driver outputs are indefinite during transition time (t DZA). Note 11. Measuring point 3.3 V 3.0 V VCC 0V tPRA VDO+ High-impedance DOUT +5 V –5 V VDO– Driver outputs are indefinite during transition time (t PRA). Note 12. Measuring point 5V 4.5 V VCC 0V tPRA VDO+ High-impedance DOUT +5 V –5 V VDO– Driver outputs are indefinite during transition time (t PRA). 8 +5 V –5 V µ PD4721 ELECTRICAL SPECIFICATIONS (RECEIVER) (Unless otherwise specified, VCC = 3.0 to 5.5 V, T A = –40 to +85 °C, C 1 to C 5 = 1 µ F) Parameter Symbol Conditions Low-Level Output Voltage V OL1 I OUT = 4 mA, STBY = H High-Level Output Voltage V OH1 I OUT = –4 mA, STBY = H Low-Level Output Voltage V OL2 I OUT = 4 mA, STBY = L High-Level Output Voltage V OH2 I OUT = –4 mA, STBY = L Propagation Delay Time (STBY = H) t PHL t PLH R IN → R OUT , C L = 150 pF V CC = +3.0 V, Note 13 Input Resistor RI Input Pin Open Voltage V IO Input Threshold (STBY = H) Standby Output Transfer Time Standby Output Transfer Time Power-On Reset Release Time MIN. TYP. MAX. Unit 0.4 V VCC – 0.4 V 0.5 VCC – 0.5 V µs 0.2 3 V 5.5 7 kΩ 0.5 V V IH V CC = +3.0 to +5.5 V 1.7 2.3 2.7 V V IL V CC = +3.0 to +5.5 V 0.7 1.1 1.7 V VH V CC = +3.0 to +5.5 V (Hysteresis width) 0.5 1.2 1.8 V t DAH 0.2 3 µs V CHA = H (3 V mode) Note 15 0.6 3 ms V CHA = L (5 V mode) Note 15 0.3 1 ms V CHA = H (3 V mode) Note 16 1 3 ms V CHA = L (5 V mode) Note 17 0.5 1 ms Note 15 t DHA t PRA * The TYP. values are for reference at T A = 25 °C. 9 µ PD4721 Note 13. Measuring point +3 V 2.7 V RIN 0.7 V 0V –3 V tPHL tPLH VOH ROUT 2.0 V 0.8 V VOL Note 14. Measuring point +3 V 2.7 V RIN 0.7 V 0V –3 V tPLH tPHL VOH ROUT 2.0 V 0.8 V VOL Note 15. Measuring point VCC STBY 2.4 V 0.6 V 0V tDHA tDAH VOH ROUT 2.0 V 0.8 V VOL Receiver outputs are indefinite during transition time (tDHA). 10 µ PD4721 Note 16. Measuring point 3.3 V 3.0 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (tPRA). Note 17. Measuring point 5V 4.5 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (tPRA). REFERENCE MATERIAL • IC PACKAGE MANUAL (C10943X) • NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212) 11 µ PD4721 RECOMMENDED SOLDERING CONDITIONS The following conditions (See table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SMT MANUAL” (C10535E). µ PD4721 GS-GJG Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None IR30-00-2 VPS Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None VP15-00-2 Wave soldering Solder Temperature: 260 °C or lower, Reflow time: Within 10 sec, Number of reflowprocess: 1, Exposure limit*: None WS60-00-1 Partial heating method Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method” 12 µ PD4721 PACKAGE DRAWINGS 20 PIN PLASTIC SHRINK SOP (300 mil) 20 11 3° +7° –3° detail of lead end 1 10 A H J E K F G I C D N B L M M P20GM-65-300B-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 7.00 MAX. 0.276 MAX. B 0.575 MAX. 0.023 MAX. C 0.65 (T.P.) 0.026 (T.P.) D 0.30 ± 0.10 0.012+0.004 –0.005 E 0.125 ± 0.075 0.005 ± 0.003 F 2.0 MAX. 0.079 MAX. G 1.7 0.067 H 8.1 ± 0.3 0.319 ± 0.012 I 6.1 ± 0.2 0.240 ± 0.008 J 1.0 ± 0.2 0.039 –0.008 K 0.15 +0.10 –0.05 0.006+0.004 –0.002 L 0.5 ± 0.2 0.020 –0.009 M 0.12 0.005 N 0.10 +0.009 +0.008 0.004 13 µ PD4721 [MEMO] 14 µ PD4721 [MEMO] 15 µ PD4721 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2