NEC UPD4721GS-GJG

DATA SHEET
MOS INTEGRATED CIRCUIT
µP D 4 7 2 1
RS-232 LINE DRIVER/RECEIVER AT 3.3 V/5 V
The µPD4721 is a high-breakdown voltage silicon gate CMOS line driver/receiver based on the EIA/TIA-232E standard. The internal DC/DC converter can switch between multiple voltages, realizing the allowing it to
operate with a single +3.3 V or +5 V power supply. It also provides standby function.
This IC incorporates 2 driver circuits and 2 receiver circuits. An RS-232 interface circuit can be easily
configured by connecting 5 capacitors externally.
FEATURES
• Conforms to EIA/TIA-232-E (former name, RS-232C) standards
• Selectable +3.3 V/+5 V single power supply (selected by VCHA pin)
• By setting the standby pin to a low level (standby mode), circuit current can be reduced. At such times,
the driver output is in a high-impedance state.
ORDERING INFORMATION
Part number
µPD4721GS-GJG
Document No. S12198EJ2V0DS00 (2nd edition)
(Previous No. IC-3279)
Date Published January 1997 N
Printed in Japan
Package
20-pin plastic SSOP (300 mil)
©
1993
µ PD4721
BLOCK DIAGRAM/PIN CONFIGURATION (Top View)
+10 V
C3
1
+
C4
2
+3.3 V
or
+5 V
C1
C4+ 20
VDD
+
C1+
GND 19
+
C2
+
3
VCC
C4– 18
4
C1–
VSS 17
5
C5+
6
C5–
–10 V
16 STBY
C5 +
15 VCHA
Note 4
300 Ω
DIN1
7
DIN2
8
13 DOUT2
ROUT1
9
12 RIN1
14 DOUT1
300 Ω
5.5 kΩ
ROUT2 10
11 RIN2
5.5 kΩ
Note 1. V DD and V SS are output pins stepped up internally. These pins should not be loaded directly.
2. Capacitors C 1 to C 5 with a breakdown voltage of 20 V or higher are recommended. And it is
recommended to insert the capacitor that is 0.1 µF to 1 µF between V CC and GND.
3. If V CHA is kept low level (in 5 V mode), capacitor C5 is not necessary.
4. The pull-up resistors at driver input are active resistors.
2
µ PD4721
Truth Table
Driver
STBY
D IN
DOUT
Remarks
L
×
Z
Standby mode (DC/DC converter is stopped)
H
L
H
Space level output
H
H
L
Mark level output
STBY
R IN
ROUT
L
×
H
Standby mode (DC/DC converter is stopped)
H
L
H
Mark level input
H
H
L
Space level input
Receiver
3 V ↔ 5 V switching
V CHA
Remarks
Note 5
Operating mode
L
5 V mode (double step-up)
H
3 V mode (3 times step-up)
H: high-level, L: low-level, Z: high-impedance, ×: H or L
Note 5. When switching VCHA, standby mode must be selected (STBY = L).
3
µ PD4721
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C)
Parameter
Symbol
Ratings
Unit
Supply Voltage (V CHA = L)
V CC
–0.5 to +7.0
V
Supply Voltage (V CHA = H)
V CC
–0.5 to +4.5
V
Driver Input Voltage
D IN
–0.5 to V CC +0.5
V
Receiver Input Voltage
R IN
–30.0 to +30.0
V
Control Input Voltage (STBY, V CHA)
V IN
–0.5 to V CC +0.5
V
–25.0 to +25.0
Note 6
Driver Output Voltage
D OUT
V
Receiver Output Voltage
R OUT
–0.5 to V CC +0.5
V
Input Current (D IN , STBY, V CHA)
I IN
±20.0
mA
Operating Ambient Temperature
TA
–40 to +85
°C
Storage Temperature
T stg
–55 to +150
°C
Total Power Dissipation
PT
0.5
W
Note 6. Pulse width = 1 ms, duty = 10 % MAX.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage (V CHA = L, 5 V mode)
V CC
4.5
5.0
5.5
V
Supply Voltage (V CHA = H, 3 V mode)
V CC
3.0
3.3
3.6
V
High-Level Input Voltage (D IN )
V IH
2.0
V CC
V
Low-Level Input Voltage (D IN)
V IL
0
0.8
V
High-Level Input Voltage (STBY, V CHA )
V IH
2.4
V CC
V
Low-Level Input Voltage (STBY, V CHA )
V IL
0
0.6
V
Receiver Input Voltage
R IN
–30
+30
V
Operating Ambient Temperature
TA
–40
+85
°C
Note 7
0.33
4.7
µF
Capacitance of External Capacitor
Note 7. In low temperature (below 0 ˚C), the capacitance of electrolytic capacitor becomes lower. Therefore,
set higher values when using in low temperature.
Concerning the wiring length between the capacitor and the IC, the shorter the better.
Capacitors with good frequency characteristics such as tantalum capacitors, laminated ceramic
capacitors, and aluminum electrolytic capacitors for switching power supply are recommended for the
external capacitors.
4
µ PD4721
ELECTRICAL SPECIFICATIONS (TOTAL)
(Unless otherwise specified, T A = –40 to +85 °C, C 1 to C5 = 1 µF)
Parameter
Symbol
Circuit Current
I CC1
Circuit Current
I CC2
Circuit Current at Standby
I CC3
Conditions
MIN.
TYP.
MAX.
Unit
V CC = +3.3 V, No load, R IN pin OPEN,
STBY = H
6.5
13
mA
V CC = +5.0 V, No load, R IN pin OPEN,
STBY = H
4.5
9
mA
V CC = +3.3 V, R L = 3 kΩ (DOUT ), D IN = GND,
R IN , R OUT pin OPEN, STBY = H
19
24
mA
V CC = +5.0 V,R L = 3 kΩ (DOUT ), D IN = GND,
R IN , R OUT pin OPEN, STBY = H
14
18
mA
V CC = +3.3 V, No load, D IN and R IN
pins are OPEN, STBY = L, T A = 25 °C
1
3
µA
V CC = +3.3 V, No load, D IN and R IN
pins are OPEN, STBY = L
5
V CC = +5.0 V, No load, D IN and R IN
pins are OPEN, STBY = L, T A = 25 °C
2
V CC = +5.0 V, No load, D IN and R IN
pins are OPEN, STBY = L
10
High-Level Input Voltage
V IH
V CC = +3.0 to +5.5 V, STBY, V CHA pin
Low-Level Input Voltage
V IL
V CC = +3.0 to +5.5 V, STBY, V CHA pin
High-Level Input Current
I IH
V CC = +5.5 V, V I = +5.5 V, STBY, V CHA pin
Low-Level Input Current
I IL
Input Capacitance
C IN
STBY — V CHA Time
V CHA — STBY Time
STBY — V CC Time
V CC — STBY Time
µA
5
µA
µA
2.4
V
0.6
V
1
µA
V CC = +5.5 V, V I = 0 V, STBY, V CHA pin
–1
µA
Driver input and receiver input
V CC = +3.3 V, for GND, f = 1 MHz
10
pF
Driver input and receiver input
V CC = +5.0 V, for GND, f = 1 MHz
10
pF
t SCH
V CC = +3.0 to +5.5 V, STBY ↓ → V CHA,
Note 8
1
µs
t CHS
V CC = +3.0 to +5.5 V, V CHA → STBY ↑,
Note 8
1
µs
t SC
V CC = +3.0 to +5.5 V, STBY ↓ →
1
µs
t CS
V CC = +3.0 to +5.5 V, V CC → STBY ↑,
1
µs
V CC , Note 8
Note 8
* The TYP. values are for reference at T A = 25 °C.
Note 8. Measuring point
5V
3.3 V
STBY
0.6 V
0.6 V
0.6 V
0.6 V
0V
tSCH
tCHS
tSCH
tCHS
3.3 V
2.4 V
VCHA
2.4 V
0.6 V
0V
tSC
0.6 V
tCS
tSC
tCS
5V
4.5 V
VCC
3.6 V
4.5 V
3.6 V
3.3 V
5
µ PD4721
ELECTRICAL SPECIFICATIONS (DRIVER)
(Unless otherwise specified, T A = –40 to +85 °C, C 1 to C5 = 1 µF)
3 V mode (unless otherwise specified, V CHA = H, V CC = 3.0 to 3.6 V)
Parameter
Symbol
Conditions
MIN.
MAX.
Unit
0.8
V
Low-Level Input Voltage
V IL
High-Level Input Voltage
V IH
Low-Level Input Current
I IL
V CC = +3.6 V, V I = 0 V
–25
µA
High-Level Input Current
I IH
V CC = +3.6 V, V I = 3.6 V
1.0
µA
2.0
V CC = +3.3 V, R L = ∞, TA = 25 °C
Output Voltage
V DO
Output Short-Circuit Current
Slew-Rate
Note 9
I SC
V CC = +3.3 V, R L = 3 kΩ, TA = T opt
±5.0
V CC = +3.0 V, R L = 3 kΩ, TA = +25 °C
±5.0
V
±9.5
V
±6.0
V
V
V CC = +3.3 V, for GND
±40
mA
C L = 10 pF, R L = 3 to 7 kΩ
3.0
30
V/ µ s
C L = 2 500 pF, RL = 3 to 7 kΩ
3.0
30
V/ µ s
SR
t PHL
t PLH
R L = 3 kΩ, C L = 2 500 pF
Output Resistor
RO
V CC = V DD = V SS = 0 V
V OUT = ±2 V
Standby Output Transfer Time
t DAZ
R L = 3 kΩ, C L = 2 500 pF, Note 10
4
10
µs
Standby Output Transfer Time
t DZA
R L = 3 kΩ, C L = 2 500 pF, Note 10
1
3
ms
Power-On Output Transfer Time
t PRA
R L = 3 kΩ, C L = 2 500 pF, Note 11
1
3
ms
Propagation Delay Time
Note 9
* The TYP. values are for reference at T A = 25 °C.
6
TYP.
µs
2.5
Ω
300
µ PD4721
5 V mode (Unless otherwise specified, V CHA = L, V CC = +5.0 V ± 10 %)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
0.8
V
Low-Level Input Voltage
V IL
High-Level Input Voltage
V IH
Low-Level Input Current
I IL
V CC = +5.5 V, V I = 0 V
–40
µA
High-Level Input Current
I IH
V CC = +5.5 V, V I = 5.5 V
1.0
µA
2.0
V
V CC = +5.0 V, R L = ∞, TA = 25 °C
Output Voltage
V DO
Output Short-Circuit Current
Slew-Rate
Note 9
I SC
±9.7
V CC = +5.0 V, R L = 3 kΩ, TA = T opt
±6.0
V
V CC = +4.5 V, R L = 3 kΩ, TA = T opt
±5.0
V
V CC = +5.0 V, for GND
SR
V
±40
mA
C L = 10 pF, R L = 3 to 7 kΩ
4.0
30
V/ µ s
C L = 2 500 pF, RL = 3 to 7 kΩ
4.0
30
V/ µ s
t PHL
t PLH
R L = 3 kΩ, C L = 2 500 pF
Output Resistor
RO
V CC = V DD = V SS = 0 V
V OUT = ±2 V
Standby Output Transfer Time
t DAZ
R L = 3 kΩ, C L = 2 500 pF, Note 10
4
10
µs
Standby Output Transfer Time
t DZA
R L = 3 kΩ, C L = 2 500 pF, Note 10
0.5
1
ms
Power-On Output Transfer Time
t PRA
R L = 3 kΩ, C L = 2 500 pF, Note 12
0.5
1
ms
Propagation Delay Time
Note 9
µs
2
Ω
300
* The TYP. values are for reference at T A = 25 °C.
Note 9. Measuring point
VCC
2.0 V
DIN
0.8 V
0V
tPLH
VDO+
DOUT
tPHL
+5 V
+3 V
–3 V
+3 V
–3 V
–5 V
VDO–
SR+
SR–
7
µ PD4721
Note 10. Measuring point
VCC
2.4 V
STBY
0.6 V
0V
tDAZ
tDZA
VDO+
+5 V
DOUT
High-impedance
–5 V
VDO–
Driver outputs are indefinite during transition time (t DZA).
Note 11. Measuring point
3.3 V
3.0 V
VCC
0V
tPRA
VDO+
High-impedance
DOUT
+5 V
–5 V
VDO–
Driver outputs are indefinite during transition time (t PRA).
Note 12. Measuring point
5V
4.5 V
VCC
0V
tPRA
VDO+
High-impedance
DOUT
+5 V
–5 V
VDO–
Driver outputs are indefinite during transition time (t PRA).
8
+5 V
–5 V
µ PD4721
ELECTRICAL SPECIFICATIONS (RECEIVER)
(Unless otherwise specified, VCC = 3.0 to 5.5 V, T A = –40 to +85 °C, C 1 to C 5 = 1 µ F)
Parameter
Symbol
Conditions
Low-Level Output Voltage
V OL1
I OUT = 4 mA, STBY = H
High-Level Output Voltage
V OH1
I OUT = –4 mA, STBY = H
Low-Level Output Voltage
V OL2
I OUT = 4 mA, STBY = L
High-Level Output Voltage
V OH2
I OUT = –4 mA, STBY = L
Propagation Delay Time
(STBY = H)
t PHL
t PLH
R IN → R OUT , C L = 150 pF
V CC = +3.0 V, Note 13
Input Resistor
RI
Input Pin Open Voltage
V IO
Input Threshold (STBY = H)
Standby Output Transfer Time
Standby Output Transfer Time
Power-On Reset Release Time
MIN.
TYP.
MAX.
Unit
0.4
V
VCC – 0.4
V
0.5
VCC – 0.5
V
µs
0.2
3
V
5.5
7
kΩ
0.5
V
V IH
V CC = +3.0 to +5.5 V
1.7
2.3
2.7
V
V IL
V CC = +3.0 to +5.5 V
0.7
1.1
1.7
V
VH
V CC = +3.0 to +5.5 V (Hysteresis width)
0.5
1.2
1.8
V
t DAH
0.2
3
µs
V CHA = H (3 V mode)
Note 15
0.6
3
ms
V CHA = L (5 V mode)
Note 15
0.3
1
ms
V CHA = H (3 V mode)
Note 16
1
3
ms
V CHA = L (5 V mode)
Note 17
0.5
1
ms
Note 15
t DHA
t PRA
* The TYP. values are for reference at T A = 25 °C.
9
µ PD4721
Note 13. Measuring point
+3 V
2.7 V
RIN
0.7 V
0V
–3 V
tPHL
tPLH
VOH
ROUT
2.0 V
0.8 V
VOL
Note 14. Measuring point
+3 V
2.7 V
RIN
0.7 V
0V
–3 V
tPLH
tPHL
VOH
ROUT
2.0 V
0.8 V
VOL
Note 15. Measuring point
VCC
STBY
2.4 V
0.6 V
0V
tDHA
tDAH
VOH
ROUT
2.0 V
0.8 V
VOL
Receiver outputs are indefinite during transition time (tDHA).
10
µ PD4721
Note 16. Measuring point
3.3 V
3.0 V
VCC
0V
tPRA
VOH
ROUT
0.8 V
VOL
Receiver outputs are indefinite during reset release time (tPRA).
Note 17. Measuring point
5V
4.5 V
VCC
0V
tPRA
VOH
ROUT
0.8 V
VOL
Receiver outputs are indefinite during reset release time (tPRA).
REFERENCE MATERIAL
• IC PACKAGE MANUAL (C10943X)
• NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212)
11
µ PD4721
RECOMMENDED SOLDERING CONDITIONS
The following conditions (See table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
under different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “SMT MANUAL” (C10535E).
µ PD4721 GS-GJG
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 230 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 2, Exposure limit*: None
IR30-00-2
VPS
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 2,
Exposure limit*: None
VP15-00-2
Wave soldering
Solder Temperature: 260 °C or lower,
Reflow time: Within 10 sec,
Number of reflowprocess: 1,
Exposure limit*: None
WS60-00-1
Partial heating method
Terminal temperature: 300 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
* Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”
12
µ PD4721
PACKAGE DRAWINGS
20 PIN PLASTIC SHRINK SOP (300 mil)
20
11
3° +7°
–3°
detail of lead end
1
10
A
H
J
E
K
F
G
I
C
D
N
B
L
M M
P20GM-65-300B-2
NOTE
Each lead centerline is located within 0.12
mm (0.005 inch) of its true position (T.P.) at
maximum material condition.
ITEM
MILLIMETERS
INCHES
A
7.00 MAX.
0.276 MAX.
B
0.575 MAX.
0.023 MAX.
C
0.65 (T.P.)
0.026 (T.P.)
D
0.30 ± 0.10
0.012+0.004
–0.005
E
0.125 ± 0.075
0.005 ± 0.003
F
2.0 MAX.
0.079 MAX.
G
1.7
0.067
H
8.1 ± 0.3
0.319 ± 0.012
I
6.1 ± 0.2
0.240 ± 0.008
J
1.0 ± 0.2
0.039 –0.008
K
0.15 +0.10
–0.05
0.006+0.004
–0.002
L
0.5 ± 0.2
0.020 –0.009
M
0.12
0.005
N
0.10
+0.009
+0.008
0.004
13
µ PD4721
[MEMO]
14
µ PD4721
[MEMO]
15
µ PD4721
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
2