Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array SEAF8 Series – Socket, Vertical Orientation SEAM8 Series – Terminal, Vertical Orientation Revision: D Date: September 10, 2015 Page 1 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec SEAM8/SEAF8 Series 0,80 mm SEARAY™ High Density, High Speed Open Pin Field Array connectors. All information contained in this specification is for a 10,00 mm mated height vertical configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?SEAM8 and ww.samtec.com?SEAF8. 3.0 TESTING 3.1 3.2 3.3 3.4 Current Rating: 0.9A (18 lines powered, 6x3 cluster) Voltage Rating: 220 VAC Operating Temperature Range: -55°C to +125°C Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 660 VAC Pass Insulation Resistance EIA-364-21 (5000 MΩ minimum) 15,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.5 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 100 cycles (w/Env. stress) Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: D Date: September 10, 2015 Page 2 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 3.6 Environmental: ITEM REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 660 VAC IR: >15,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 660 VAC IR: >15,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass Revision: D TEST CONDITION Date: September 10, 2015 Page 3 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 4.0 MATED SYSTEM 4.1 Stack Heights STACK HEIGHT SEAF8 LEAD STYLE -05.0 SEAM8 LEAD STYLE -S02.0 -S05.0 7.00mm [.276] 10.00mm [.394] 5.0 POLARIZING FEATURES Revision: D Date: September 10, 2015 Page 4 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair Stack Height Single-Ended Signaling Differential Pair Signaling 7 mm 12.00 GHz 14.00 GHz 7.0 PROCESSING RECOMMENDATIONS - For more information, please see our Processing Recommendations Document 7.1 Mating Alignment Requirements: 7.1.1 Revision: D Maximum guidance/capture in applications where at least one half of the interface is free to float. Date: September 10, 2015 Page 5 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 7.1.2 The parts can be rigidly misaligned by no more than .004" (0,10mm) in the X- and .004” (0,10mm) in the Y-direction to ensure a good mate. 7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only. 7.2.1 7.2.2 Revision: D Date: September 10, 2015 Page 6 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 7.3 Thermal Profile: The importance of properly profiling the fully populated printed circuit assembly cannot be overstated. The reflow process that forms the solder joint is sometimes overshadowed by other processes, but is critical to ensuring the solder charge reaches proper reflow conditions. Certain components can be sensitive to time and temperature, so both variables must be controlled and a thermal profile must be performed prior to processing or production. Thermocouples should be placed as close to the solder charge as possible (underneath the part) in the center and on the outside edge of the connector. Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. Revision: D Date: September 10, 2015 Page 7 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array 7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of 260°C. 7.5 Stencil Thickness: The stencil thickness is .005” (0,13 mm). 7.6 Placement: Machine placement and complete seating of the parts in the Z-axis is strongly recommended. 7.7 Reflow Environment: Samtec strongly recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 8 and 10 rows are released for nitrogen environment processing only. 8 and 10 rows are not recommended for air only processing. SEAX8 testing has consistently shown a dramatic increase in solder yields in a low level oxygen environment as opposed to an air environment. Many variables affect the level of residual oxygen required to optimize a given reflow process, but generally the levels should be less than 1000 ppm. 7.8 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Grid Array Rework Guidelines 7.8.1 Samtec recommends a minimum spacing of .125” (3,18mm) between adjacent connectors to allow adequate room for hot-air rework equipment. 7.9 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers two different types: 7.9.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options here: SO - Board Stacking Standoff 7.9.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested construction facilitates the mating and unmating process. This is especially helpful for multiple connector applications where the mating and unmating forces increase with the number of connectors used. See options here: JSO - Jack Screw Standoffs 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: D Date: September 10, 2015 Page 8 © 2013 Samtec, Inc. Product Specification Series: SEAM8 / SEAF8 0,80 mm (.0315”) SEARAY™ High Density, High Speed Open Pin Field Array USE OF PRODUCT SPECIFICATION SHEET This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED. Revision: D Date: September 10, 2015 Page 9 © 2013 Samtec, Inc.