Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array HDAF Series – Socket, Vertical Orientation HDAM Series – Terminal, Vertical Orientation Revision: C Date: May 12, 2015 Page 1 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec HDAF/HDAM Series 2,00 mm TM (.0787”) X 1,20 mm (.0472”) HD Mezz Rugged, High Density Open Pin Field Array connectors. All information contained in this specification is for a HDAF Series -08.0 lead style mated to a HDAM Series -12.0 lead style for a 20 mm (.787”) stack height, vertical configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?HDAF and www.samtec.com?HDAM. 3.0 TESTING 3.1 Current Rating: 1.8A (6 Pins Powered) 3.2 Voltage Rating: 230 VAC 3.3 Operating Temperature Range: -55°C to +125°C 3.4 Electrical: ITEM TEST CONDITION REQUIREMENT Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 690 VAC Insulation Resistance EIA-364-21 (1000 MΩ minimum) 5,000 MΩ Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage 3.5 Mechanical: ITEM TEST CONDITION REQUIREMENT STATUS Durability EIA-364-09C 100 cycles Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: C Date: May 12, 2015 Page 2 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 3.6 Environmental: ITEM REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 690 VAC IR: >15,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 690 VAC IR: >15,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 690 VAC IR: >15,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass Revision: C TEST CONDITION Date: May 12, 2015 Page 3 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 4.0 MATED SYSTEM 4.1 Mated Views Mated view information can be found at link below: http://cloud.samtec.com/Prints/HDAX%20Mated%20Document.pdf 5.0 POLARIZING FEATURES 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair Revision: C Stack Height Single-Ended Signaling Differential Pair Signaling 20 mm 9.5 GHz 9.0 GHz 25 mm 8.5 GHz 8.5 GHz 30 mm 10.0 GHz 7.5 GHz 35 mm 9.0 GHz 9.0 GHz Date: May 12, 2015 Page 4 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Alignment Requirements: Revision: C 7.1.1 Maximum guidance/capture in applications where at least one half of the interface is free to float. 7.1.2 The parts can be rigidly misaligned by no more than .005" (0,13 mm) in the X- and .001” (0,03 mm) in the Y-direction to ensure a good mate. Date: May 12, 2015 Page 5 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction. 7.2.1 7.2.2 Revision: C Date: May 12, 2015 Page 6 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020D which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. Revision: C Date: May 12, 2015 Page 7 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 7.4 Multiple Connector System: A customer may elect to place two systems on the same board. Multiple connectors must have the longitudinal (pin to pin) direction of the connectors parallel (FIG 1 and FIG 3) and not perpendicular (FIG 2). All the connectors on a board, in this application, must be the same gender, must come from a single supplier and process. Furthermore, they must come from either the same package or from successive packages with the same manufacturing date. 7.5 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum oven temperature of 260°C. 7.6 Stencil Thickness: The stencil thickness is .006” (0,15 mm). 7.7 Placement: Machine placement and complete seating of the parts in the Z-axis is strongly recommended. 7.8 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec’s wide variety of standoff options can be found here: SO - Board Stacking Standoff 7.9 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 7.10 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Reworking Grid Array Connectors 7.10.1 Samtec recommends a minimum spacing of .125” (3,18 mm) between adjacent connectors to allow adequate room for hot-air rework equipment 7.11 Solder Screen Printing Process: 7.11.1 Complete solder pad coverage is critical. Automated inspection of each print is recommended. If solder paste does not completely cover the solder pad, the assembly should be rejected, cleaned and re-printed. Revision: C Date: May 12, 2015 Page 8 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 7.11.2 Stencil cleaning may need to be monitored more frequently to ensure complete solder pad coverage is maintained. 7.11.3 Solder charge location relative to solder print. Notice good contact between solder charges and solder paste. 7.12 Handling: 7.12.1 These connectors are typically packaged in trays or tape-and-reel which protect the solder charges from damage. They should be handled like any other BGA or IC device. 7.12.2 Avoid resting the connector on the solder charge except during final placement onto the board. 7.12.3 When using tape-and-reel packaging, ensure the bottom of the pocket is protected as it travels through the feeder. 7.12.4 Avoid touching the solder charges. 7.12.5 When a partially used tray needs to be stored, use the flat cover from the original shipment or an empty tray to cover connectors. Band trays using flex wrap or rubber bands . 7.13 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers two different types: 7.13.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options here: SO - Board Stacking Standoff 7.13.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested construction facilitates the mating and unmating process. This is especially helpful for multiple connector applications where the mating and unmating forces increase with the number of connectors used. See options here: JSO - Jack Screw Standoffs Revision: C Date: May 12, 2015 Page 9 © Samtec, Inc. Product Specification Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array 7.14 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: C Date: May 12, 2015 Page 10 © Samtec, Inc.