STS2305A

STS2305A
Green
Product
S a mHop Microelectronics C orp.
Ver 1.1
P-Channel Enhancement Mode Field Effect Transistor
FEATURES
Super high dense cell design for low R DS(ON).
PRODUCT SUMMARY
V DSS
ID
R DS(ON) (m Ω) Max
Rugged and reliable.
70 @ VGS=-4.5V
-20V
Suface Mount Package.
-3.3A
100 @ VGS=-2.5V
D
S OT 23-3L
D
G
S
G
S
ABSOLUTE MAXIMUM RATINGS ( T C=25 °C unless otherwise noted )
Symbol
VDS
VGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
ID
Drain Current-Continuous
IDM
-Pulsed
TC=25°C
TC=70°C
a
b
a
PD
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
TC=25°C
TC=70°C
THERMAL CHARACTERISTICS
R JA
Thermal Resistance, Junction-to-Ambient
a
Details are subject to change without notice.
Limit
-20
±10
-3.3
Units
V
V
A
-2.6
A
-12.5
A
1.25
W
0.8
W
-55 to 150
°C
100
°C/W
Jun,02,2010
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STS2305A
Ver 1.1
ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body Leakage Current
IGSS
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
RDS(ON)
Drain-Source On-State Resistance
gFS
Forward Transconductance
Conditions
Min
VGS=0V , ID=-250uA
-20
Typ
Max
Units
-1
±100
uA
nA
-0.8
55
-1.5
70
V
m ohm
VGS=-2.5V , ID=-2.8A
80
100
m ohm
VDS=-5V , ID=-3.3A
11
S
VDS=-10V,VGS=0V
f=1.0MHz
380
196
175
pF
pF
pF
28
98
ns
ns
ns
ns
V
VDS=-16V , VGS=0V
VGS= ±10V , VDS=0V
VDS=VGS , ID=-250uA
VGS=-4.5V , ID=-3.3A
-0.5
c
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output
Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qgs
Qgd
Gate-Source Charge
Gate-Drain Charge
c
VDD=-10V
ID=-1A
VGS=-4.5V
RGEN= 6 ohm
VDS=-10V,ID=-3.3A,VGS=-4.5V
VDS=-10V,ID=-3.3A,
VGS=-4.5V
157
132
7
0.6
Diode Forward Voltage
b
VGS=0V,IS= -1A
nC
nC
3.5
DRAIN-SOURCE DIODE CHARACTERISTICS
Maximum Continuous Drain-Source Diode Forward Current
IS
VSD
nC
-0.8
-1
A
-1.2
V
Notes
_ 10sec.
a.Surface Mounted on FR4 Board,t <
_ 2%.
_ 300us, Duty Cycle <
b.Pulse Test:Pulse Width <
c.Guaranteed by design, not subject to production testing.
Jun,02,2010
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STS2305A
Ver 1.1
10
10
Tj=125 C
-I D, Drain Current(A)
-ID, Drain Current(A)
VGS=-4.5V
8
VGS=-3V
VGS=-2.5V
6
VGS=-2V
4
2
VGS=-1.5V
8
-55 C
4
2
0
0
0
2.0
1.5
1.0
0.5
2.5
0
3.0
-VDS, Drain-to-Source Voltage(V)
1.4
Vth, Normalized
Gate-Source Threshold Voltage
R DS(on), On-Resistance
Normalized
200
160
120
VG S =-2.5V
80
VG S =-4.5V
2
4
6
8
1.8
2.4
3.6
3.0
V G S =-2.5V
I D = -2.8A
1.3
1.2
1.1
V G S =-4.5V
I D =-3.3 A
1.0
0
10
0
25
50
75
100
125
150
T j ( °C )
-I D, Drain Current(A)
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
Figure 4. On-Resistance Variation with Drain
Current and Temperature
1.6
BVDSS, Normalized
Drain-Source Breakdown Voltage
RDS(on)(m Ω)
1.5
1
1.2
Figure 2. Transfer Characteristics
240
40
0.6
-VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
1
25 C
6
V DS =V G S
I D =-250uA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature( ° C )
1.15
I D =-250uA
1.10
1.05
1.00
0.95
0.90
0.85
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Breakdown Voltage Variation
with Temperature
Jun,02,2010
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STS2305A
Ver 1.1
20.0
180
-Is, Source-drain current(A)
I D =-3.3A
150
RDS(on)(m Ω)
120
125 C
90
60
75 C
25 C
30
0
0
0.5 1.0
2.0 2.5 3.0 3.5 4.0
1.5
10.0
5.0
25 C
125 C
75 C
1.0
4.5
0
1.2
1.6
2.0
Figure 8. Body Diode Forward Voltage
Variation with Source Current
Figure 7. On-Resistance vs.
Gate-Source Voltage
-VGS, Gate to Source Voltage(V)
600
500
C, Capacitance(pF)
0.8
-VSD, Body Diode Forward Voltage(V)
-VGS, Gate-to-Source Voltage(V)
Ciss
400
0.4
Coss
300
Crss
200
100
5
V DS = -10V
I D =-3.3A
4
3
2
1
0
0
0
4
2
6
8
10
12
0
2
4
8
6
10
12
Qg, Total Gate Charge(nC)
-V DS, Drain-to-Source Voltage(V)
Figure 10. Gate Charge
Figure 9. Capacitance
Tf
Tr
-ID, Drain Current(A)
Switching Time(ns)
TD(off )
100
60
TD(on)
10
VDS=-10V,ID=-1A
10
R
1
6 10
im
it
10
1m
10
10
DC
0.1
0.1
60 100
)L
1
VGS=-4.5V
1
D
ON
S(
10
0m
0u
s
s
ms
s
s
V G S =-4.5V
S ingle P ulse
T A =25 C
1
10
30 50
Rg, Gate Resistance(Ω)
-V DS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Jun,02,2010
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STS2305A
Ver 1.1
Normalized Transient
Thermal Resistance
10
1
0.5
0.2
0. 1
P DM
0.1
t1
t2
0.05
0.02
Single Pulse
0.01
0.01
0.0000 1
1.
2.
3.
4.
0.000 1
0.001
0.01
0. 1
1
R thJ A (t)=r (t) * R thJ A
R thJ A =S ee Datas heet
T J M-T A = P DM* R thJ A (t)
Duty C ycle, D=t1/t2
10
100
1000
Square Wave Pulse Duration(sec)
Figure 13. Normalized Thermal Transient Impedance Curve
Jun,02,2010
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STS2305A
Ver 1.1
PACKAGE OUTLINE DIMENSIONS
SOT23-3L
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
Dimensions In Millimeters
Min.
Max.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950 TYP.
1.800
2.000
0.550 REF.
0.300
0.500
0°
8°
Dimensions In Inches
Min.
Max.
0.035
0.045
0.000
0.004
0.035
0.041
0.012
0.020
0.003
0.006
0.110
0.118
0.047
0.055
0.089
0.100
0.037 TYP.
0.071
0.079
0.022 REF.
0.012
0.020
0°
8°
Jun,02,2010
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STS2305A
Ver 1.1
SOT23-3L Tape and Reel Data
SOT23-3L Carrier Tape
TR
FEED DIRECTION
UNIT:р
PACKAGE
SOT23-3L
A0
B0
K0
D0
D1
E
E1
E2
P0
P1
P2
T
1.75
²0.10
3.50
²0.05
4.00
²0.10
4.00
²0.10
2.00
²0.05
0.22
²0.04
1.22
²0.10
О1.00
+0.05
О1.50
+0.10
8.00
+0.30
-0.10
REEL SIZE
M
N
W
W1
H
K
S
G
R
V
О178
О178
²1
О60
²1
9.00
²0.5
12.00
²0.5
О13.5
!!²0.5
10.5
2.00
²0.5
О10.0
5.00
18.00
2.77
²0.10
3.15
²0.10
SOT23-3L Reel
UNIT:р
TAPE SIZE
8р
Jun,02,2010
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