STT100

STT100
Green
Product
S a mHop Microelectronics C orp.
Ver 3.0
N-Channel Enhancement Mode Field Effect Transistor
PRODUCT SUMMARY
V DSS
ID
R DS(ON) (m Ω) Max
FEATURES
Super high dense cell design for low R DS(ON).
Rugged and reliable.
819 @ VGS=10V
100V
Suface Mount Package.
1.2A
956 @ VGS=4.5V
ESD Protected.
D
G
G
S
STT SERIES
SO T - 223
S
ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted )
Symbol
VDS
VGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
ID
Drain Current-Continuous
IDM
EAS
-Pulsed
TA=25°C
Limit
100
±20
1.2
Units
V
V
A
TA=70°C
1.0
A
8
A
2.25
mJ
a
Single Pulse Avalanche Energy
PD
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
c
TA=25°C
TA=70°C
3
W
1.9
W
-55 to 150
°C
42
°C/W
THERMAL CHARACTERISTICS
R JA
Thermal Resistance, Junction-to-Ambient
Details are subject to change without notice.
Oct,18,2012
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STT100
Ver 3.0
ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
VGS=0V , ID=250uA
100
IDSS
Zero Gate Voltage Drain Current
VDS=80V , VGS=0V
IGSS
Gate-Body Leakage Current
VGS= ±20V , VDS=0V
ON CHARACTERISTICS
VGS(th)
Gate Threshold Voltage
VDS=VGS , ID=250uA
1
Typ
Max
Units
V
1
uA
±10
uA
2
3
V
655
819
m ohm
708
956
m ohm
RDS(ON)
Drain-Source On-State Resistance
VGS=10V , ID=0.6A
VGS=4.5V , ID=0.56A
gFS
Forward Transconductance
VDS=10V , ID=0.6A
1.9
S
VDS=25V,VGS=0V
f=1.0MHz
155
20
12
pF
pF
pF
17
13
ns
ns
185
ns
26
ns
b
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
b
VDD=50V
ID=0.6A
VGS=10V
RGEN= 6 ohm
VDS=50V,ID=0.6A,VGS=10V
3.2
nC
VDS=50V,ID=0.6A,VGS=4.5V
2
nC
0.7
nC
1
nC
VDS=50V,ID=0.6A,
VGS=10V
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
VGS=0V,IS=0.4A
VSD
Diode Forward Voltage
0.81
1.3
V
Notes
_ 2%.
_ 300us, Duty Cycle <
a.Pulse Test:Pulse Width <
b.Guaranteed by design, not subject to production testing.
c.Starting TJ=25°C,L=0.5mH,VDD = 50V.(See Figure13)
Oct,18,2012
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STT100
Ver 3.0
2.5
2.5
VGS = 4.5V
2.0
ID, Drain Current(A)
ID, Drain Current(A)
VGS = 10V
VGS = 4V
1.5
VGS = 3.5V
1.0
0.5
2.0
1.5
Tj=125 C
1.0
25 C
-55 C
0.5
VGS = 3V
0
0
2.0
1.0
0
3.0
0
1800
2.0
1500
1.8
1200
600
VGS = 10V
0
0.1
4.8
VGS=10V
ID=0.6A
1.6
1.4
VGS=4.5V
ID=0.56A
1.2
0.6
1.8
1.2
2.4
0.8
3.0
0
1.2
1.1
1.0
0.9
0.8
0.7
-25
0
25
50
100
125
150
Tj, Junction Temperature ( C)
BVDSS, Normalized
Drain-Source Breakdown Voltage
VDS = VGS
ID = 250uA
75
Figure 4. On-Resistance Variation with
Drain Current and Temperature
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
1.3
50
25
Tj( C)
ID, Drain Current (A)
Vth, Normalized
Gate-Source Threshold Voltage
4.0
1.0
300
0.6
-50
3.2
Figure 2. Transfer Characteristics
RDS(ON), On-Resistance
Normalized
R DS(on)(m Ω)
Figure 1. Output Characteristics
VGS = 4.5V
2.4
VGS, Gate-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
900
1.6
0.8
75 100 125 150
Tj, Junction Temperature ( C)
1.3
ID = 250uA
1.2
1.1
1.0
0.9
0.8
0.7
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature ( C)
Figure 6. Breakdown Voltage Variation
with Temperature
Figure 5. Gate Threshold Variation
with Temperature
Oct,18,2012
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STT100
Ver 3.0
1800
10.0
ID = 0.6A
Is, Source-drain current (A)
1500
RDS(on)(m Ω)
125 C
1200
75 C
900
25 C
600
300
0
125 C
75 C
25 C
1.0
4
2
0
8
6
10
0
0.4
0.8
1.2
1.6
2.0
V GS, Gate-Sorce Voltage(V)
VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs.
Gate-Source Voltage
Figure 8. Body Diode Forward Voltage
Variation with Source Current
10
175
VGS, Gate to Source Voltage (V)
200
C, Capacitance (pF)
5.0
Ciss
150
125
100
75
50
Coss
25
VDS = 50V
ID = 0.6A
8
6
4
2
Crss
0
0
0
5
10
20
15
25
30
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
VDS, Drain-to Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
3.2
500
10
TD(off )
ID, Drain Current (A)
Tf
TD(on)
Tr
10
V DS =50V,I D =0.6A
V GS =10V
1
1
10
RD
1
Rg, Gate Resistance(Ω)
(
Lim
it
10
10
10
1s
0m
1m
s
ms
s
s
0.1
VGS = 10V
Single Pulse
TA = 25 C
0.01
0.1
100
S
)
ON
DC
Switching Time(ns)
100
1
10
100
VDS, Drain-Source Voltage (V)
Figure 11. switching characteristics
Figure 12. Maximum Safe
Operating Area
Oct,18,2012
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STT100
Ver 3.0
V ( BR )D S S
tp
L
V DS
D .U .T
RG
+
-
IA S
VDD
20V
tp
0.0 1
IAS
Unclamped Inductive Test Circuit
Unclamped Inductive Waveforms
F igure 13a.
F igure 13b.
1
Normalized Transient
Thermal Resistance
0.5
0.2
0.1
0.1
0.05
P DM
0.02
0.01
0.01
t1
t2
Single Pulse
1. RthJA (t)=r (t) * R th JA
2. R thJA=See Datasheet
3. TJM-TA = PDM* R thJA (t)
4. Duty Cycle, D=t1/t2
0.001
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration(sec)
10
100
1000
Figure 14. Normalized Thermal Transient Impedance Curve
Oct,18,2012
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STT100
Ver 3.0
D
B
SOT-223
C
0.10 M C B
C
C
0.080
A
C1
(C)
E
b1
E1
0.10 M C B
b
SECTION B-B
DETAIL "A"
g
1
3
2
B
(C)
C1
B
e
b
0.10 M C B
C
e1
b3
b2
SECTION C-C
GAUGE PLANE
A2
SEATING PLANE
L
0.25
DETAIL "A"
A
C
A1
COMMON
SYMBOL
A
A1
A2
b
b1
b2
b3
g
c
c1
D
E
E1
e
e1
L
DIMENSIONS MILLIMETER
MIN.
MOM.
MAX.
1.80
0.02
0.10
1.60
1.50
1.70
0.84
0.76
0.66
0.60
0.71
0.79
3.10
2.90
3.00
3.05
2.95
2.84
0.06
0.35
0.23
0.30
0.23
0.28
0.33
6.50
6.70
6.30
6.70
7.30
7.00
3.50
3.30
3.70
2.30 BSC
4.60 BSC
0.81
10 °
0°
DIMENSIONS INCHE
MIN.
MOM.
0.0008
0.0591
0.0260
0.0236
0.1142
0.1118
0.0630
0.0300
0.0280
0.1181
0.1161
0.0090
0.0090
0.2480
0.2638
0.1300
0.0319
0°
0.1181
0.0110
0.2560
0.2760
0.1378
0.0906 BSC
0.1811 BSC
MAX.
0.0709
0.0039
0.0669
0.0330
0.0311
0.1220
0.1200
0.0020
0.1378
0.0130
0.2638
0.2874
0.1457
10 °
Oct,18,2012
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STT100
Ver 3.0
SOT-223 Tape and Reel Data
SOT-223 Carrier Tape
D1
P0
P2
P1
E1
E2
E
D0
T
K0
B0
A0
unit:р
PACKAGE
A0
B0
K0
7.42
²0.1
6.83
²0.1
1.88
²0.1
D0
1.50
+ 0.25
D1
1.60
+ 0.1
E
12.0
+ 0.3
- 0.1
E1
E2
P0
P1
P2
T
1.75
²0.1
5.50
²0.5
8.0
²0.1
4.00
²0.1
2.00
²0.05
0.292
²0.02
SOT-223 Reel
UNIT:р
REEL SIZE
ӿ330
² 0.5
M
N
ӿ97.0
² 1.0
W
2.2
W1
H
K
S
13.0
+ 1.5
ӿ13.0
+ 0.5
- 0.2
10.6
2.0
²0.5
G
R
V
Oct,18,2012
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