RSQ045N03 : Transistors

RSQ045N03
Nch 30V 4.5A Power MOSFET
Datasheet
lOutline
VDSS
30V
RDS(on) (Max.)
38mW
ID
4.5A
PD
1.25W
lFeatures
(6)
(5)
TSMT6
SOT-457T
(4)
(1)
(2)
(3)
lInner circuit
1) Low on - resistance.
(1)
(2)
(3)
(4)
(5)
(6)
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (TSMT6).
4) Pb-free lead plating ; RoHS compliant
Drain
Drain
Gate
Source
Drain
Drain
*1 ESD PROTECTION DIODE
*2 BODY DIODE
lPackaging specifications
Packaging
Taping
Reel size (mm)
lApplication
DC/DC converters
Type
180
Tape width (mm)
Basic ordering unit (pcs)
8
3,000
Taping code
TR
Marking
QL
lAbsolute maximum ratings(Ta = 25°C)
Parameter
Symbol
Value
Unit
Drain - Source voltage
VDSS
30
V
Continuous drain current
ID *1
4.5
A
ID,pulse *2
18
A
VGSS
20
V
PD *3
1.25
W
PD *4
0.6
W
Tj
150
°C
Tstg
-55 to +150
°C
Pulsed drain current
Gate - Source voltage
Power dissipation
Junction temperature
Range of storage temperature
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© 2012 ROHM Co., Ltd. All rights reserved.
1/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lThermal resistance
Parameter
Symbol
Thermal resistance, junction - ambient
Values
Unit
Min.
Typ.
Max.
RthJA *3
-
-
100
°C/W
RthJA *4
-
-
208
°C/W
lElectrical characteristics(Ta = 25°C) ,unless otherwise specified
Parameter
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
Symbol
V(BR)DSS
Conditions
VGS = 0V, ID = 1mA
ΔV(BR)DSS ID=1mA
ΔTj
referenced to 25°C
Values
Unit
Min.
Typ.
Max.
30
-
-
V
-
26
-
mV/°C
Zero gate voltage drain current
IDSS
VDS = 30V, VGS = 0V
-
-
1
mA
Gate - Source leakage current
IGSS
VGS = 20V, VDS = 0V
-
-
10
mA
Gate threshold voltage
VGS (th)
VDS = 10V, ID = 1mA
1.0
-
2.5
V
Gate threshold voltage
temperature coefficient
ΔV(GS)th
ΔTj
ID=1mA
referenced to 25°C
-
-2.8
-
mV/°C
VGS=10V, ID=4.5A
-
27
38
VGS=4.5V, ID=4.5A
-
36
51
VGS=4.0V, ID=4.5A
-
40
56
VGS=10V, ID=4.5A, Tj=125°C
-
50
70
f = 1MHz, open drain
-
6
-
W
3.5
7.0
-
S
Static drain - source
on - state resistance
Gate input resistannce
Transconductance
RDS(on)
RG
gfs *5
*5
VDS=10V, ID=4.5A
mW
*1 Limited only by maximum temperature allowed.
*2 Pw  10ms, Duty cycle  1%
*3 Mounted on a ceramic board (30×30×0.8mm)
*4 Mounted on a FR4 (15×20×0.8mm)
*5 Pulsed
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© 2012 ROHM Co., Ltd. All rights reserved.
2/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristics(Ta = 25°C)
Parameter
Symbol
Conditions
Values
Min.
Typ.
Max.
Input capacitance
Ciss
VGS = 0V
-
520
-
Output capacitance
Coss
VDS = 10V
-
150
-
Reverse transfer capacitance
Crss
f = 1MHz
-
95
-
VDD ⋍ 15V, VGS = 10V
-
12
-
tr *5
ID = 2.25A
-
19
-
td(off) *5
RL = 6.67W
-
41
-
RG = 10W
-
14
-
Turn - on delay time
Rise time
Turn - off delay time
td(on) *5
tf *5
Fall time
Unit
pF
ns
lGate Charge characteristics(Ta = 25°C)
Parameter
Total gate charge
Symbol
Qg *5
Gate - Source charge
Qgs *5
Gate - Drain charge
Qgd *5
Conditions
Values
Min.
Typ.
Max.
VDD ⋍ 15V, ID=4.5A
VGS = 5V
-
6.8
9.5
VDD ⋍ 15V, ID=4.5A
VGS = 10V
-
13
-
-
1.6
-
-
2.3
-
VDD ⋍ 15V, ID=4.5A
VGS = 5V
Unit
nC
lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)
Parameter
Inverse diode continuous,
forward current
Forward voltage
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Symbol
IS *1
VSD *5
Conditions
Values
Unit
Min.
Typ.
Max.
Ta = 25°C
-
-
1
A
VGS = 0V, Is = 1.0A
-
-
1.2
V
3/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristic curves
Fig.2 Maximum Safe Operating Area
Fig.1 Power Dissipation Derating Curve
100
Operation in this area is
limited by RDS(on) (VGS = 10V)
100
80
60
40
20
0
0
50
100
150
1
PW = 10ms
DC Operation
0.1
0.01
200
PW = 1ms
Ta=25ºC
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
0.1
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Ta=25ºC
Single Pulse
1
top D = 1
D = 0.5
D = 0.1
D = 0.05
D = 0.01
bottom Single
0.1
0.001
0.0001
Rth(ch-a)=100ºC/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
Mounted on ceramic board
(30mm × 30mm × 0.8mm)
0.01
100
1000
Ta=25ºC
Single Pulse
0.01
10
Fig.4 Single Pulse Maximum
Power dissipation
1
Peak Transient Power : P(W)
10
1
Drain - Source Voltage : VDS [V]
Junction Temperature : Tj [°C]
Normalized Transient Thermal Resistance : r(t)
PW = 100ms
10
Drain Current : ID [A]
Power Dissipation : PD/PD max. [%]
120
10
1
0.0001
100
Pulse Width : PW [s]
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100
0.01
1
100
Pulse Width : PW [s]
4/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristic curves
Fig.6 Typical Output Characteristics(II)
Fig.5 Typical Output Characteristics(I)
4
4
VGS= 10.0V
3.5
VGS= 4.0V
Ta=25ºC
Pulsed
3
Drain Current : ID [A]
Drain Current : ID [A]
3
VGS= 2.8V
2.5
VGS= 2.5V
2
1.5
1
0.5
0
0.0
0.2
0.4
0.6
0.8
Ta=25ºC
Pulsed
VGS= 2.8V
VGS= 2.5V
2.5
2
1.5
1
VGS= 2.0V
0.5
VGS= 2.0V
0
1.0
0
2
4
6
8
10
Drain - Source Voltage : VDS [V]
Drain - Source Voltage : VDS [V]
Fig.8 Typical Transfer Characteristics
Fig.7 Breakdown Voltage
vs. Junction Temperature
60
VGS = 0V
ID = 1mA
Pulsed
40
Drain Current : ID [A]
Drain - Source Breakdown Voltage : V(BR)DSS [V]
VGS= 4.0V
3.5
20
0
-50
0
50
100
150
Junction Temperature : Tj [°C]
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© 2012 ROHM Co., Ltd. All rights reserved.
Gate - Source Voltage : VGS [V]
5/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristic curves
Fig.9 Gate Threshold Voltage
vs. Junction Temperature
Fig.10 Transconductance vs. Drain Current
10
VDS= 10V
Pulsed
VDS = 10V
ID = 1mA
Pulsed
Transconductance : gfs [S]
Gate Threshold Voltage : VGS(th) [V]
3
2
1
0
-50
0
50
100
1
0.1
0.01
150
Junction Temperature : Tj [°C]
Ta= -25ºC
Ta=25ºC
Ta=75ºC
Ta=125ºC
0.1
1
10
Drain Current : ID [A]
Fig.11 Drain CurrentDerating Curve
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Drain Current Dissipation
: ID/ID max. (%)
1
0.8
0.6
0.4
0.2
0
-25
0
25
50
75
100
125
150
Static Drain - Source On-State Resistance
: RDS(on) [mW]
1.2
Gate - Source Voltage : VGS [V]
Junction Temperature : Tj [ºC]
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© 2012 ROHM Co., Ltd. All rights reserved.
6/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristic curves
Fig.13 Static Drain - Source On - State
Resistance vs. Drain Current(I)
Fig.14 Static Drain - Source On - State
Resistance vs. Junction Temperature
Static Drain - Source On-State Resistance
: RDS(on) [mW]
Static Drain - Source On-State Resistance
: RDS(on) [mW]
60
Drain Current : ID [A]
50
40
30
20
VGS = 10V
ID = 4.5A
Pulsed
10
0
-50 -25
0
25
50
75
100 125 150
Junction Temperature : Tj [ºC]
Fig.16 Static Drain-Source On-State
Resistance vs. Drain Current(III)
Static Drain - Source On-State Resistance
: RDS(on) [mW]
Static Drain - Source On-State Resistance
: RDS(on) [mW]
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Drain Current : ID [A]
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© 2012 ROHM Co., Ltd. All rights reserved.
Drain Current : ID [A]
7/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristic curves
Fig.18 Typical Capacitance
vs. Drain - Source Voltage
Capacitance : C [pF]
Static Drain - Source On-State Resistance
: RDS(on) [mW]
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current(IV)
Drain Current : ID [A]
Drain - Source Voltage : VDS [V]
Fig.20 Dynamic Input Characteristics
Switching Time : t [ns]
Gate - Source Voltage : VGS [V]
Fig.19 Switching Characteristics
Drain Current : ID [A]
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© 2012 ROHM Co., Ltd. All rights reserved.
Total Gate Charge : Qg [nC]
8/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lElectrical characteristic curves
Source Current : IS [A]
Fig.21 Source Current
vs. Source Drain Voltage
Source-Drain Voltage : VSD [V]
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© 2012 ROHM Co., Ltd. All rights reserved.
9/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lMeasurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
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© 2012 ROHM Co., Ltd. All rights reserved.
10/11
2012.10 - Rev.B
Data Sheet
RSQ045N03
lDimensions (Unit : mm)
D
A
e
TSMT6
c
L1
Lp
HE
E
Q
b
x
S A
A3
e1
l1
A1
y S
A
A2
e
S
b2
Pattern of terminal position areas
[Not a recommended pattern of soldering pads]
DIM
A
A1
A2
A3
b
c
D
E
e
HE
L1
Lp
Q
x
y
DIM
b2
e1
l1
MILIMETERS
MIN
MAX
1.00
0.00
0.10
0.75
0.95
0.25
0.35
0.50
0.10
0.26
2.80
3.00
1.50
1.80
0.95
2.60
3.00
0.30
0.60
0.40
0.70
0.05
0.25
0.20
0.10
INCHES
MIN
0.000
0.030
MAX
0.039
0.004
0.037
0.010
0.014
0.004
0.110
0.059
0.020
0.010
0.118
0.071
0.037
0.102
0.012
0.016
0.002
-
MILIMETERS
MIN
MAX
0.70
2.10
0.90
0.118
0.024
0.028
0.010
0.008
0.004
INCHES
MIN
-
MAX
0.028
0.083
-
0.035
Dimension in mm / inches
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© 2012 ROHM Co., Ltd. All rights reserved.
11/11
2012.10 - Rev.B
Notice
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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R1120A