THAN0084_Rev.3.00_E Application Note THAN0084_Rev.3.00_E THC63LVD1027 Application Note Mode setting, System Diagram and PCB Design Guide Date Revision Contents 2008/12/03 Rev.1.00_E New created 2010/03/03 Rev.1.10_E Caution for LVDS line connection is added 2010/03/11 Rev.1.20_E Some descriptions are altered. 2010/06/07 Rev.1.30_E Some descriptions are altered. 2011/09/13 Rev.1.40_E Some descriptions are altered. 2013/11/07 Rev.3.00_E Some descriptions are altered. Copyright©2013 THine Electronics, Inc. 1/12 THine Electronics, Inc. THAN0084_Rev.3.00_E Contents 1.Mode Setting ........................................................................................................ P.3 2.Signal Flow for Each Setting ............................................................................... P.3 3.Output Control / Fail Safe .................................................................................... P.4 4.Example of System Diagram................................................................................ P.5 5.Note ...................................................................................................................... P.9 6.PCB Design Guide Line ..................................................................................... P.11 Copyright©2013 THine Electronics, Inc. 2/12 THine Electronics, Inc. THAN0084_Rev.3.00_E 1. Mode Setting Input/Output MODE1 MODE0 (Input mode) (Output mode) H: Single H: Single L: Dual L: Dual CLK in L L Hi-z L L Hi-z H L CLK in L H -- H H RCLK2+/- Dual-In/Dual-Out (Fig.2-1, 3-1) Distribution (Fig.2-2, 3-2) Single-In/Dual-Out (Fig.2-3, 3-3) Dual-In/Single-Out (Fig.2-4, 3-4) Reserved 2. Signal Flow for Each Setting Dual-In / Dual-Out CLK Frequency f RA1+/RB1+/RC1+/RD1+/DATA Rate RE1+/f RCLK1+/- Distribution mode TA1+/CLK TB1+/Frequency TC1+/f TD1+/TE1+/DATA Rate TCLK1+/f CLK Frequency f RA2+/RB2+/RC2+/RD2+/DATA Rate RE2+/f RCLK2+/- TA2+/CLK TB2+/Frequency TC2+/f TD2+/TE2+/DATA Rate TCLK2+/f RA1+/RB1+/RC1+/RD1+/DATA Rate RE1+/RCLK1+/f TA1+/CLK TB1+/Frequency TC1+/f TD1+/TE1+/DATA Rate TCLK1+/f CLK Frequency f Hi-z Must be Hi-z Same Data RA2+/RB2+/RC2+/RD2+/RE2+/RCLK2+/- TA2+/CLK TB2+/Frequency TC2+/f TD2+/TE2+/DATA Rate TCLK2+/f =TCLK1+/- Fig2-2 Single-In / Dual-Out Dual-In / Single-Out CLK Frequency f RA1+/RB1+/RC1+/RD1+/DATA Rate RE1+/RCLK1+/f TA1+/CLK TB1+/Frequency TC1+/f/2 TD1+/TE1+/DATA Rate TCLK1+/f/2 RA2+/RB2+/RC2+/RD2+/RE2+/RCLK2+/- TA2+/CLK TB2+/Frequency TC2+/f/2 TD2+/TE2+/DATA Rate TCLK2+/f/2 Hi-z Must be Hi-z =TCLK1+/- Fig2-1 CLK Frequency f TA1+/CLK TB1+/Frequency TC1+/2f TD1+/TE1+/DATA Rate TCLK1+/2f CLK Frequency f TA2+/TB2+/TC2+/TD2+/TE2+/TCLK2+/- RA1+/RB1+/RC1+/RD1+/DATA Rate RE1+/f RCLK1+/- RA2+/RB2+/RC2+/RD2+/DATA Rate RE2+/f RCLK2+/- Fig2-3 Copyright©2013 THine Electronics, Inc. Hi-z Fig2-4 3/12 THine Electronics, Inc. THAN0084_Rev.3.00_E 3. Output Control / Fail Safe THC63LVD1027 has a function to control output depending on LVDS input condition. PD RCLK1+/- RCLK2+/- Output L * * All Hi-z H Hi-z * All Hi-z H CLK in CLK in Refer to p.3 Mode Setting # H CLK in Hi-z Refer to p.3 Mode Setting # * : Don’t care # : If a particular input data pair is Hi-z, the corresponding output data become L according to LVDS DC spec. For fail-safe purpose, all LVDS input pins are connected to VDD via resistance for detecting state of Hi-z. VDD LVDS input buffer Internal circuit of THC63LVD1027 Copyright©2013 THine Electronics, Inc. 4/12 THine Electronics, Inc. THAN0084_Rev.3.00_E 4. Example of System Diagram 4.1) Dual-In/Dual-Out (LVDS Input: 20~85MHz) THC63LVD1027 RA1- TA1- RA1+ TA1+ RB1- TB1- RB1+ TB1+ RC1- TC1- RC1+ TC1+ 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm RCLK1- TCLK1- RCLK1+ TCLK1+ 100ohm 100ohm RD1- TD1- RD1+ TD1+ TE1- RE1+ TE1+ RA2- TA2- RA2+ TA2+ RB2- TB2- RB2+ TB2+ 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm RC2- TC2- RC2+ TC2+ 100ohm 100ohm RCLK2- TCLK2- RCLK2+ TCLK2+ 100ohm 100ohm RD2- TD2- RD2+ TD2+ 100ohm 100ohm RE2- TE2- RE2+ TE2+ 100ohm 100ohm *1 *1 GND PCB(Transmitter) GND GND VDD VDD VDD JP RS GND PCB(Receiver) *3 0.1uF x4 VCC(3.3V) F.Bead ASIC/FPGA etc. LVDS Transmitter ASIC/FPGA etc. RE1- LVDS Receiver 100ohm 100ohm GND VDD *2 *2 220uF 10uF VDD CAP PD CAP MODE1 CAP 0.1uF 0.1uF 0.1uF MODE0 PCB(THC63LVD1027) *1 Connect each PCB GND with low impedance cable. *2 Select the suitable value for the system. *3 Place 4 de-coupling capacitors close to each VDD pin one by one. Copyright©2013 THine Electronics, Inc. 5/12 Fig3-1 THine Electronics, Inc. THAN0084_Rev.3.00_E 4.2) Distribution (LVDS Input: 20~85MHz) RA1- RA- TA1100ohm 100ohm RA1+ TA1+ RB1- TB1- RA+ RB100ohm 100ohm RB1+ TB1+ RB+ RC1- TC1- RC- RC1+ TC1+ 100ohm 100ohm RCLK1- RC+ TCLK1100ohm 100ohm RCLK1+ TCLK1+ THC63LVD104S THC63LVD1027 VCC(2.5V)*3 0.001uF 0.1uF VCC GND LVCC LGND PVCC F.Bead PGND DK R/F *4 RCLKRCLK+ CLKOUT /PDWN RD1- TD1- RD- TD1+ RE1- TE1- RE1+ TE1+ 100ohm 100ohm Hi-z Hi-z Hi-z RA2- RD+ RA6 - RA0 RB6 - RB0 RE- RC6 - RC0 RD6 - RD0 RE+ RE6 - RE0 RA- TA2100ohm RA2+ TA2+ RB2- TB2- RA+ RB100ohm TB2+ RB+ RC2- TC2- RC- RC2+ TC2+ RB2+ RCLK2- TCLK2- RCLK2+ TCLK2+ 100ohm RC+ THC63LVD104S LVDS Transmitter ASIC/FPGA etc. RD1+ Hi-z OE 100ohm 100ohm 7 7 7 7 7 VCC(2.5V)*3 0.001uF 0.1uF VCC GND LVCC LGND PVCC F.Bead PGND DK R/F *4 RCLK100ohm RCLK+ CLKOUT /PDWN Hi-z RD2RD2+ Hi-z RD- TD2- 100ohm TD2+ RE2- TE2- RE2+ TE2+ 100ohm *1 7 7 7 7 7 *1 GND GND GND PCB(Transmitter) GND PCB(Receiver) VDD VDD VDD JP *5 RS VCC(3.3V) F.Bead OE RD+ RA6 - RA0 RB6 - RB0 RE- RC6 - RC0 RD6 - RD0 RE+ RE6 - RE0 0.1uF x4 GND VDD *2 *2 220uF 10uF VDD CAP PD CAP MODE1 CAP 0.1uF 0.1uF 0.1uF MODE0 PCB(THC63LVD1027) *1 Connect each PCB GND with low impedance cable. *2 Select the suitable value for the system. *3 Supply voltage of THC63LVD104S is 2.5V(Typ). *4 Refer to datasheet. *5 Place 4 de-coupling capacitors close to each VDD pin one by one. Copyright©2013 THine Electronics, Inc. 6/12 Fig3-2 THine Electronics, Inc. THAN0084_Rev.3.00_E 4.3) Single-In/Dual-Out (LVDS Input: 40~135MHz) THC63LVD1027 RA1- TA1- RA1+ TA1+ RB1- TB1- RB1+ TB1+ RC1- TC1- RC1+ TC1+ 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm RCLK1- TCLK1- RCLK1+ TCLK1+ 100ohm 100ohm RD1- TD1- RD1+ TD1+ TE1- RE1+ TE1+ RA2- TA2- RA2+ TA2+ RB2- TB2- RB2+ TB2+ 100ohm 100ohm Hi-z Hi-z Hi-z Hi-z Hi-z Hi-z 100ohm 100ohm RC2- TC2- RC2+ TC2+ RCLK2- TCLK2- RCLK2+ TCLK2+ 100ohm 100ohm RD2- TD2- RD2+ TD2+ RE2- TE2- RE2+ TE2+ 100ohm 100ohm *1 *1 GND PCB(Transmitter) GND GND VDD VDD VDD JP RS GND PCB(Receiver) *3 0.1uF x4 VCC(3.3V) F.Bead ASIC/FPGA etc. LVDS Transmitter ASIC/FPGA etc. RE1- LVDS Receiver 100ohm 100ohm GND VDD *2 *2 220uF 10uF VDD CAP PD CAP MODE1 CAP 0.1uF 0.1uF 0.1uF MODE0 PCB(THC63LVD1027) *1 Connect each PCB GND with low impedance cable. *2 Select the suitable value for the system. *3 Place 4 de-coupling capacitors close to each VDD pin one by one. Copyright©2013 THine Electronics, Inc. 7/12 Fig3-3 THine Electronics, Inc. THAN0084_Rev.3.00_E 4.4) Dual-In/Single-Out (LVDS Input: 20~42.5MHz) THC63LVD1027 RA1- TA1- RA1+ TA1+ RB1- TB1- RB1+ TB1+ RC1- TC1- RC1+ TC1+ 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm RCLK1- TCLK1- RCLK1+ TCLK1+ 100ohm 100ohm RD1- TD1- RD1+ TD1+ TE1- RE1+ TE1+ RA2- TA2- RA2+ TA2+ RB2- TB2- RB2+ TB2+ 100ohm 100ohm Hi-z 100ohm Hi-z 100ohm RC2- TC2- RC2+ TC2+ Hi-z 100ohm RCLK2- TCLK2- RCLK2+ TCLK2+ Hi-z 100ohm RD2- TD2- RD2+ TD2+ Hi-z 100ohm RE2- TE2- RE2+ TE2+ Hi-z 100ohm *1 *1 GND PCB(Transmitter) GND GND VDD VDD VDD JP GND PCB(Receiver) *3 0.1uF x4 RS VCC(3.3V) F.Bead ASIC/FPGA etc. LVDS Transmitter ASIC/FPGA etc. RE1- LVDS Receiver 100ohm 100ohm GND VDD *2 *2 220uF 10uF VDD CAP PD CAP MODE1 CAP 0.1uF 0.1uF 0.1uF MODE0 PCB(THC63LVD1027) *1 Connect each PCB GND with low impedance cable. *2 Select the suitable value for the system. *3 Place 4 de-coupling capacitors close to each VDD pin one by one. Copyright©2013 THine Electronics, Inc. 8/12 Fig3-4 THine Electronics, Inc. THAN0084_Rev.3.00_E 5. Note 5.1)LVDS input pin connection When LVDS line is not drived from the previous device, the line is pulled up to 3.3V internally in THC63LVD1027. This can cause violation of absolute maximum ratings to the previous LVDS Tx device whose operating condition is lower voltage power supply than 3.3V. This phenomenon may happen at power on phase of the whole system including THC63LVD1027. One solution for this problem is PD=L control during no LVDS input period because pull-up resistors are cut off at power down state. If this situation is not avoidable and PD=L is hard to apply, there still is several remedy; therefore please contact to [email protected] (for FAE mailing list) LVDS Tx side PCB LVDS Rx side PCB VDD Low VDD THC63LVD1027 LVDS Tx or LVDS Tx integrated device LVDS input buffer Internal circuit of THC63LVD1027 5.2)Power On Sequence Don’t input RCLK#+/- before THC63LVD1027 is on in order to keep absolute maximum ratings. If it is not avoidable, please contact to [email protected] (for FAE mailing list) 5.3)Cable Connection and Disconnection Don’t connect and disconnect the LVDS cable, when the power is supplied to the system. 5.4)GND Connection Connect the each GND of the PCB which Transmitter, Receiver and THC63LVD1027 on it. It is better for EMI reduction to place GND cable as close to LVDS cable as possible. Copyright©2013 THine Electronics, Inc. 9/12 THine Electronics, Inc. THAN0084_Rev.3.00_E 5.5)Multi Drop Connection Multiple counterpart use such as following systems are not recommended. THC63LVD1027 TCLK1,2- LVDS Rx TCLK1,2+ LVDS Rx 5.6)Asynchronous use Asynchronous use such as following systems are not recommended. If it is not avoidable, please check if datasheet p.11 tCK12 spec can be kept or not and more further, please contact to [email protected] CLKOUT (for FAE mailing list) LVDS Tx RCLK1+/- LVDS Tx RCLK2+/- DATAOUT IC THC63LVD1027 CLKOUT DATAOUT Asynchronous use such as following systems are not recommended. If it is not avoidable, please contact to [email protected] (for FAE mailing list) CLKIN TCLK1+/- LVDS Rx DATAIN IC THC63LVD1027 TCLK2+/- Copyright©2013 THine Electronics, Inc. LVDS Rx DATAIN 10/12 THine Electronics, Inc. THAN0084_Rev.3.00_E 6. PCB Design Guide Line General Guideline • • • • • Use 4 layer PCB (minimum). Locate by-pass capacitors close to the device pins to a maximum extent. Make the loop minimum which is consist of Power line and Gnd line Use large Gnd plane Separate VDD power supply for each block via ferrite bead LVDS Traces • Interconnecting media between Transmitter and Receiver (i.e. PCB trace, connector, and cable) should be well balanced.(Keep all these differential impedance and the length of media as same as possible.). • • • • • Minimize the distance between traces of a pair (S1) to maximize common mode rejection. See following figure. Place adjacent LVDS trace pair at least twice (>2 x S1) as far away as possible. Avoid 90 degree bends and sharp angles. Minimize the number of VIA on LVDS traces. Match impedance of PCB trace, connector, media (cable) and termination to minimize reflections (emissions) for cabled applications (typically 100ohm differential mode characteristic impedance). • Place terminal resister close to the Receiver pins to a maximum extent. • To plase common mode choke coil is desired for EMI reduction. S1 > 2 x S1 GND +Signal Copyright©2013 THine Electronics, Inc. -Signal 11/12 +Signal -Signal THine Electronics, Inc. THAN0084_Rev.3.00_E Attentions and Requests 1. The product specifications described in this material are subject to change without prior notice. 2. The circuit diagrams described in this material are examples of the application which may not always apply to the customer's design. We are not responsible for possible errors and omissions in this material. Please note if errors or omissions should be found in this material, we may not be able to correct them immediately. 3. This material contains our copy right, know-how or other proprietary. Copying or disclosing to third parties the contents of this material without our prior permission is prohibited. 4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will be exempted from the responsibility unless it directly relates to the production process or functions of the product. 5. This product is presumed to be used for general electric equipment, not for the applications which require very high reliability (including medical equipment directly concerning people's life, aerospace equipment, or nuclear control equipment). Also, when using this product for the equipment concerned with the control and safety of the transportation means, the traffic signal equipment, or various Types of safety equipment, please do it after applying appropriate measures to the product. 6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently redundant or error preventive design applied to the use of the product so as not to have our product cause any social or public damage. 7. Please note that this product is not designed to be radiation-proof. 8. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under the Foreign Exchange and Foreign Trade Control Law. THine Electronics, Inc. E-mail:[email protected] Copyright©2013 THine Electronics, Inc. 12/12 THine Electronics, Inc.