PL610-6x Die

PL610-6x
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
FEATURES
DESCRIPTION
• Single IC to cover up to 60MHz output frequency.
• Direct oscillation operation
• Input Frequency: Fundamental crystal:
o 10MHz to 60MHz
• Output Frequency: LVCMOS
o 312.5kHz to 60MHz (2.5V & 3.3V)
o 312.5kHz to 40MHz (1.8V)
• Very low Jitter and Phase Noise
• High impedance standby function, <5uA
• Low current consumption
• Single 1.8V to 3.3V ± 10% power supply
• Operating temperature range from -40°C to 85°C
The PL610-6x is a family of high performance
general purpose to cover outputs from 156.25kHz up
to 60MHz. Designed to fit in a small 2.0x1.6mm, or
larger substrates, the PL610-6x offer the best phase
noise and jitter performance, smallest die size, and
lowest power consumption of any comparable IC.
With its Standby function the part draws <5uA.
BLOCK DIAGRAM
DIE SPECIFICATION
Chip size
0.65x 0.60mm
Chip thickness
130um, ± 15um
Pad size
90µ m
Chip base
GND level
Optional
(see ordering information)
Die back coating
600
Value
(650µ mx600µ m)
XT
650
Parameter
PAD ASSIGNMENT
1
VSS
2
Q
3
XTN
6
PL610-6x
5
INHN^
4
VDD
Note: ^ denotes internal pull up
PL610-6x FAMILY CONFIGURATIONS
Part Number
Operating Voltage
Input Frequency
PL610-61
Q=F XT
PL610-62
PL610-63
PL610-64
PL610-65
PL610-66
Output Frequency
1.8V to 3.3V, ± 10%
F XT = 10MHz to 60MHz
(3.3V & 2.5V)
F XT = 10MHz to 40MHz
(1.8V)
Q=F XT /2
Q=F XT /4
Q=F XT /8
Q=F XT /16
Q=F XT /32
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 www.phaselink.com 12/03/09 Page 1
PL610-6x
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
PAD DESCRIPTIONS
(Pad measurements are from die center)
Pad Center Spacing
X
Y
Pad
#
Pad
Name
1
XT
-177
231
Crystal input pad
2
VSS
-215
41
GND connection
3
Q
-215
-186
Clock output
4
VDD
215
-186
5
INHN
215
41
6
XTN
177
231
VDD connection
Output control input. When activated ( Logic “0” ) INHN will
Tristate (HiZ) the output and disable the oscillator. 10MΩ
internal pull up resistor.
Crystal output pad
Description
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETERS
SYMBOL
MIN.
MAX.
UNITS
V DD
-0.5
4.6
V
Input Voltage Range
VI
-0.5
V DD +0.5
V
Output Voltage Range
VO
-0.5
V DD +0.5
V
Storage Temperature
TS
-65
150
°C
-40
85
°C
Supply Voltage Range
Ambient Operating Temperature*
ESD Protection, Human Body Model
2
KV
Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the device and affect product
reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above the operational limits noted in this
specification is not implied. *Operating temperature is guaranteed by design. Parts are tested to commercial grade only.
CRYSTAL SPECIFICATIONS
PARAMETERS
Fundamental Crystal Resonator Frequency (2.5V & 3.3V)
Fundamental Crystal Resonator Frequency (1.8V)
Crystal Loading Rating
SYMBOL
MIN.
F XT
10
C L (xtal)
TYP.
60
40
MHz
pF
100
Operating Drive Level
Effective Series Resistance, Fundamental, (See MTC-4)
UNITS
12
Maximum Sustainable Drive Level
Crystal Shunt Capacitance
MAX.
µW
µW
25
C0
3
pF
ESR
50
Ω
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PL610-6x
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
AC SPECIFICATIONS
PARAMETERS
Crystal Input Frequency
(XT)
Output Frequency
CONDITIONS
Fundamental Crystal (2.5V & 3.3V)
Fundamental Crystal (1.8V)
3.3V & 2.5V operation
1.8V operation
MIN.
TYP.
MAX.
60
10
40
60
0.3125
40
UNITS
MHz
MHz
Settling Time
At power-up (VDD > 90%V DD )
2
ms
Standby Enable Time
INHN Function; Ta=25º C, 15pF Load. Add
one clock period for a useable output.
2
ms
V DD Sensitivity
Frequency vs. V DD, +/-10%
0.5
ppm
Output Rise/Fall Time
(See MTC-1)
3.3V, 15pF Load, 10/90%V DD
1.2
1.7
ns
Output Rise/Fall Time
(See MTC-1)
2.5V, 15pF Load, 10/90%V DD
1.7
2
ns
Output Rise/Fall Time
(See MTC-1)
1.8V, 15pF Load, 10/90%V DD
2.6
3
ns
Output Rise/Fall Time
(See MTC-1)
3.3V, 50pF Load, 10/90%V DD
3
4.5
ns
Output Rise/Fall Time
(See MTC-1)
2.5V, 50pF Load, 10/90%V DD
3.5
5
ns
Output Rise/Fall Time
(See MTC-1)
1.8V, 50pF Load, 10/90%V DD
5
8
ns
45
50
55
%
MIN.
TYP.
MAX.
UNITS
Duty Cycle* (See MTC-1)
-0.5
* For 1.8V operation, the 50% ±5% duty cycle is guaranteed for frequencies ≤40MHz.
DC SPECIFICATIONS
PARAMETERS
Supply Current, Dynamic
Standby Supply Current
SYMBOL
I DD
I DD_SB
CONDITIONS
@V DD =3.3V, 26MHz, No Load
1.2
@V DD =3.3V, 40MHz, No Load
1.65
@V DD =1.8V, 26MHz, No Load
0.58
@V DD =1.8V, 40MHz, No Load
0.9
INHN=”0”, 3.3V
Operating Voltage
V DD
Power Supply Ramp
t PU
Output Low Voltage
V OL
Time for V DD to reach 90% V DD .
Power ramp must be monotonic.
I OL = +4mA Standard Drive
Output High Voltage
V OH
I OH = -4mA Standard Drive
Output Current(See MCT-2)
I OHD
V OL = 0.4V, V OH = 2.4V
mA
5
uA
1.62
3.63
V
.001
100
ms
0.4
V
V DD – 0.4
V
16
mA
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PL610-6x
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
PHASE NOISE SPECIFICATIONS, 3.3V (See MCT-3)
PARAMETERS
FREQ.
@10Hz
@100Hz
@1kHz
@10kHz
@100kHz
@1M
Phase Noise
relative to carrier
(typical)
40.0MHz
-98
-126
-145
-151
-155
-156
26.0MHz
-100
-127
-145
-151
-155
-155
UNITS
dBc/Hz
MEASUREMENT TEST CIRCUITS (MTC)
MTC-1: Rise Time, Fall Time, Duty Cycle, VOL, VOH, Idd,
Power Down Current, Output Enable/Disable
A
0.1µF
0.1µF
VDD
VDD
XIN
XIN
FET
Probe
CLK
XOUT
OE^
GND
MTC-3: Jitter and Phase Noise
CLK
XOUT
OE^
GND
CL
MTC-2: Output Drive Current and Output Impedance
MTC-4: Negative Resistance
0.1µF
VDD
Network
Analyzer
VDD
XIN
CLK
XOUT
OE^
0.1µF
R
FET
Probe
XIN
0.1µF
CLK
XOUT
OE^ GND
GND
0.1µF
V
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 www.phaselink.com 12/03/09 Page 4
PL610-6x
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
WAVEFORM SWITCHING CHARACTERISTICS
Rise and Fall times:
90%VDD
10% VDD
tr
tf
Duty Cycle:
50% VDD
Duty Cycle = 100% ×
Tw
T
Tw
T
VOH, VOL:
VDD
VOH
VOL
GND
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 www.phaselink.com 12/03/09 Page 5
PL610-6x
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
ORDERING INFORMATION
For part ordering, please contact our Sales Department:
47745 Fremont Blvd., Fremont, CA 94538, USA
Tel: (510) 492-0990 Fax: (510) 492-0991
PART NUMBER
The order number for this device is a combination of the following:
Part number, Package type and Operating temperature range
PL610-6x
x xx
Part Number
PL610-61
PL610-62
PL610-63
PL610-64
PL610-65
PL610-66
(Q=FXT)
(Q=FXT/2)
(Q=FXT/4)
(Q=FXT/8)
(Q=FXT/16)
(Q=FXT/32)
Temperature Range
C=Commercial (0°C to 70°C)
Package Type
Die Thickness
D = Die
E = Die (with Non-Conductive Backcoating)
V = Wafer (with Non-Conductive Backcoating)
W = Wafer
5 = 5 mils
6 = 6 mils
8 = 8 mils
Part / Order Number
Package Option
Temperature
PL610-6xDxC
Die (Waffle Pack)
0°C to +70°C
PL610-6xEC
Die (Waffle Pack)
0°C to +70°C
PL610-6xVxC
Wafer
0°C to +70°C
PL610-6xWxC
Wafer
0°C to +70°C
PhaseLink Corporation, reserves the right to make changes in its produc ts or specifications, or both at any time without notice. The information
furnished by Phaselink is believed to be accurate and reliable. However, PhaseLink makes no guarantee or warranty concerning the accuracy of said
information and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon this product.
LIFE SUPPORT POLICY: PhaseLink’s products are not authorized for use as critical components in life support devices or systems without the
express written approval of the President of PhaseLink Corporation.
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